The XCKU3P-2FFVA676E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications. This advanced programmable logic device combines high-speed processing capabilities with energy efficiency, making it ideal for telecommunications, aerospace, defense, and industrial automation systems.
Product Specifications
The XCKU3P-2FFVA676E features robust technical specifications that set it apart in the FPGA market:
Core Architecture:
- Logic Cells: 356,160 logic cells providing extensive programmable resources
- System Logic Cells: 216,960 configurable logic blocks
- Block RAM: 14.6 Mb total block memory for data storage and buffering
- UltraRAM: 23.6 Mb high-density memory blocks for large data sets
Processing Elements:
- DSP Slices: 1,368 DSP48E2 slices for high-performance signal processing
- Maximum Operating Frequency: Up to 891 MHz for demanding real-time applications
- Speed Grade: -2 performance grade ensuring reliable operation
Package Details:
- Package Type: FFVA676 – Fine-pitch Flip Chip Ball Grid Array
- Pin Count: 676 pins in compact form factor
- Operating Temperature: Extended commercial range
- Voltage Requirements: Multiple I/O standards supported
Connectivity Features:
- High-speed transceivers for multi-gigabit communication
- PCIe Gen3 support for system integration
- Multiple I/O banks with flexible voltage support
- Advanced clocking resources with low jitter PLLs
Price Information
The XCKU3P-2FFVA676E pricing varies based on quantity, distribution channel, and market conditions. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, making this FPGA cost-effective for both prototyping and mass production applications.
Factors affecting XCKU3P-2FFVA676E pricing include:
- Order quantity and lead times
- Geographic region and distributor margins
- Package options and testing requirements
- Market demand and supply chain conditions
Documents & Media
Essential documentation for the XCKU3P-2FFVA676E includes comprehensive technical resources to support design and implementation:
Technical Documentation:
- Complete datasheet with electrical characteristics and timing specifications
- Pin-out diagrams and package mechanical drawings
- Power consumption analysis and thermal management guidelines
- Migration guides from previous FPGA generations
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- IP core integration guidelines
- Constraint files and board design recommendations
Software Support:
- Latest Vivado tools compatibility matrix
- Programming and configuration guides
- Debug and verification methodologies
- Performance optimization techniques
Related Resources
The XCKU3P-2FFVA676E ecosystem includes extensive support resources and compatible products:
Development Platforms:
- Evaluation boards and development kits
- Reference designs for common applications
- Third-party compatible modules and carriers
- Training materials and tutorials
Compatible IP Cores:
- Communication protocol stacks
- Signal processing libraries
- Memory controllers and interfaces
- Video and image processing functions
Design Tools:
- Vivado Design Suite integration
- High-Level Synthesis (HLS) support
- System-level modeling tools
- Verification and validation frameworks
Environmental & Export Classifications
The XCKU3P-2FFVA676E meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant lead-free package construction
- Halogen-free materials for environmental sustainability
- REACH regulation compliance for European markets
- Conflict minerals reporting transparency
Export Control Information:
- ECCN classification for international shipping
- Country-specific import/export restrictions
- End-use and end-user considerations
- Documentation requirements for controlled technology
Quality Standards:
- ISO 9001 manufacturing quality systems
- Automotive grade options available (contact factory)
- Extended temperature range variants
- Long-term supply commitment programs
Reliability Testing:
- Comprehensive qualification testing programs
- JEDEC standard compliance verification
- Accelerated life testing results
- Field failure analysis support
The XCKU3P-2FFVA676E represents AMD Xilinx’s commitment to delivering high-performance, reliable FPGA solutions that meet the evolving needs of modern electronic systems. Its combination of processing power, flexibility, and comprehensive support makes it an excellent choice for next-generation applications requiring programmable logic capabilities.
