The XCKU3P-3FFVA676E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and industrial markets.
Product Specifications
The XCKU3P-3FFVA676E features advanced 16nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates 356,160 logic cells with 1,824 DSP slices for intensive digital signal processing applications. The device includes 19.1 Mb of block RAM and 64 Mb of UltraRAM, ensuring ample memory resources for complex designs.
Key specifications of the XCKU3P-3FFVA676E include a 676-pin FFVA package with industrial temperature range support from -40ยฐC to +100ยฐC. The device operates with multiple I/O standards and features high-speed transceivers capable of supporting data rates up to 32.75 Gbps. Power consumption is optimized through advanced power management features, making the XCKU3P-3FFVA676E suitable for power-sensitive applications.
The XCKU3P-3FFVA676E supports PCIe Gen4, 100G Ethernet, and other high-speed protocols, enabling seamless integration into modern system architectures. Its programmable nature allows for customization and adaptation to specific application requirements while maintaining high performance standards.
Price
Pricing for the XCKU3P-3FFVA676E varies based on order quantity, delivery requirements, and current market conditions. Contact authorized distributors or AMD Xilinx directly for current pricing information and volume discounts. The XCKU3P-3FFVA676E represents excellent value for applications requiring high-performance programmable logic with advanced features.
Educational institutions and qualified research organizations may be eligible for special pricing programs. Long-term supply agreements are available for production applications using the XCKU3P-3FFVA676E.
Documents & Media
Comprehensive documentation is available for the XCKU3P-3FFVA676E, including detailed datasheets, user guides, and application notes. The product datasheet provides complete electrical specifications, timing parameters, and package information for the XCKU3P-3FFVA676E.
Design tools and IP cores are available through AMD Xilinx Vivado Design Suite, providing complete development environment support for XCKU3P-3FFVA676E projects. Reference designs and example projects demonstrate best practices for implementing common functions using the XCKU3P-3FFVA676E.
Technical documentation includes power estimation guides, thermal management recommendations, and PCB design guidelines specific to the XCKU3P-3FFVA676E. Video tutorials and webinars provide additional learning resources for engineers working with this device.
Related Resources
The XCKU3P-3FFVA676E is supported by a comprehensive ecosystem of development tools, IP cores, and third-party solutions. AMD Xilinx provides extensive libraries of verified IP cores optimized for the XCKU3P-3FFVA676E architecture.
Development boards and evaluation kits featuring the XCKU3P-3FFVA676E are available from AMD Xilinx and third-party vendors, enabling rapid prototyping and proof-of-concept development. These platforms include essential peripherals and interfaces commonly used with the XCKU3P-3FFVA676E.
Professional services and training programs are available to help engineers maximize the potential of the XCKU3P-3FFVA676E in their applications. Community forums and technical support resources provide ongoing assistance for XCKU3P-3FFVA676E users.
Environmental & Export Classifications
The XCKU3P-3FFVA676E complies with RoHS (Restriction of Hazardous Substances) regulations and other international environmental standards. The device is manufactured using environmentally responsible processes and materials, supporting sustainable design practices.
Export classification information for the XCKU3P-3FFVA676E is available through AMD Xilinx export control documentation. Users must comply with applicable export regulations when incorporating the XCKU3P-3FFVA676E into their products or systems.
The XCKU3P-3FFVA676E meets automotive qualification standards where applicable and supports applications requiring extended temperature ranges and enhanced reliability. Quality and reliability data demonstrate the robust performance characteristics of the XCKU3P-3FFVA676E across various operating conditions.
Environmental testing results for the XCKU3P-3FFVA676E include vibration, shock, and thermal cycling performance data, ensuring reliable operation in demanding environments. The device packaging materials are selected for compatibility with standard PCB assembly processes and long-term reliability.
