The XCKU3P-3FFVB676E represents AMD Xilinx’s cutting-edge Kintex UltraScale+ FPGA technology, delivering exceptional performance and versatility for demanding applications. This advanced programmable logic device combines high-speed processing capabilities with energy efficiency, making it ideal for telecommunications, aerospace, defense, and high-performance computing applications.
Product Specifications
The XCKU3P-3FFVB676E features a robust architecture built on advanced 16nm FinFET+ technology. This Kintex UltraScale+ FPGA delivers superior performance with optimized power consumption, making it suitable for bandwidth-intensive applications.
Key Technical Specifications:
- Device Family: Kintex UltraScale+
- Package Type: FFVB676 (Flip Chip Fine Pitch BGA)
- Speed Grade: -3 (High Performance)
- Total I/O Pins: 676
- Operating Temperature: Extended commercial range
- Process Technology: 16nm FinFET+
- Logic Cells: High-density programmable logic blocks
- Memory Resources: Integrated block RAM and UltraRAM
- DSP Slices: High-performance digital signal processing blocks
- Transceivers: Integrated high-speed serial connectivity
The XCKU3P-3FFVB676E supports multiple voltage standards and offers extensive connectivity options for complex system integration requirements.
Pricing Information
Pricing for the XCKU3P-3FFVB676E varies based on quantity, packaging options, and distribution channels. Contact authorized distributors or AMD Xilinx directly for current pricing and availability. Volume discounts are typically available for production quantities.
For the most competitive XCKU3P-3FFVB676E pricing, consider:
- Authorized distributors for standard quantities
- Direct manufacturer pricing for high-volume orders
- Engineering samples for evaluation purposes
- Long-term supply agreements for production planning
Documents & Media
Comprehensive documentation supports the XCKU3P-3FFVB676E implementation and development process:
Technical Documentation:
- Product datasheet with complete electrical specifications
- Package and pinout information
- Thermal characteristics and power consumption data
- Application notes and design guidelines
- Migration guides from previous generations
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and example projects
- IP core libraries and interfaces
- Constraint files and PCB layout guidelines
- Signal integrity recommendations
Software Tools:
- Vivado Design Suite support
- SDK and embedded development tools
- Simulation models and verification IP
- Programming and configuration utilities
Related Resources
The XCKU3P-3FFVB676E ecosystem includes extensive development resources and complementary products:
Development Platforms:
- Evaluation boards and development kits
- Reference designs for common applications
- Third-party development tools and IP cores
- Training materials and online resources
Compatible Products:
- Other Kintex UltraScale+ family members
- Zynq UltraScale+ MPSoCs for ARM integration
- Memory interfaces and high-speed connectors
- Power management solutions
Support Resources:
- Technical support forums and communities
- Application engineering assistance
- Training courses and certification programs
- Design consulting services
Environmental & Export Classifications
The XCKU3P-3FFVB676E meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant for lead-free manufacturing
- REACH regulation compliance
- Conflict minerals reporting compliance
- Environmental management system certifications
Export Classifications:
- Export Control Classification Number (ECCN) designation
- Country-specific import/export requirements
- Trade compliance documentation
- Restricted party screening requirements
Quality Standards:
- ISO 9001 quality management certification
- Automotive qualification standards where applicable
- Reliability testing and qualification data
- Traceability and supply chain documentation
The XCKU3P-3FFVB676E represents a premium solution for applications requiring high-performance programmable logic with reliable operation across demanding environmental conditions. Its comprehensive ecosystem support and extensive documentation make it an excellent choice for both prototype development and production deployment.
