The XCKU3P-L1FFVA676I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing.
Product Specifications
The XCKU3P-L1FFVA676I features advanced 16nm FinFET+ technology, providing optimal power efficiency and performance. This FPGA incorporates 356,160 logic cells with 2,760 CLB slices, offering substantial computational resources for complex digital signal processing and parallel processing applications.
Key specifications of the XCKU3P-L1FFVA676I include 17.6 Mb of block RAM, 1,824 DSP slices for high-speed arithmetic operations, and support for up to 832 user I/O pins. The device operates across commercial and extended temperature ranges, with the L1 speed grade ensuring reliable performance in various environmental conditions.
The XCKU3P-L1FFVA676I utilizes the FFVA676 package, a 676-pin flip-chip fine-pitch BGA that provides excellent thermal performance and signal integrity. This packaging solution makes the XCKU3P-L1FFVA676I ideal for space-constrained applications requiring high pin density.
Price Information
Pricing for the XCKU3P-L1FFVA676I varies based on order quantity, distribution channel, and current market conditions. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume pricing discounts are typically available for quantities exceeding 100 units.
The XCKU3P-L1FFVA676I represents excellent value considering its advanced features, extensive I/O capabilities, and proven reliability in mission-critical applications.
Documents & Media
Comprehensive technical documentation supports the XCKU3P-L1FFVA676I implementation process. The official datasheet provides detailed electrical characteristics, timing specifications, and pin configuration information essential for board design and system integration.
Development resources include reference designs, application notes, and design methodologies specifically tailored for the XCKU3P-L1FFVA676I. The Vivado Design Suite provides complete design flow support, from RTL synthesis through implementation and programming.
Additional documentation covers power estimation guidelines, thermal management recommendations, and PCB design considerations for optimal XCKU3P-L1FFVA676I performance.
Related Resources
The XCKU3P-L1FFVA676I ecosystem includes comprehensive development tools and IP cores. Vivado HLx Design Suite offers high-level synthesis capabilities, enabling C/C++ to RTL conversion for accelerated development cycles.
IP portfolio compatibility ensures the XCKU3P-L1FFVA676I can leverage pre-verified cores for common functions including memory controllers, communication interfaces, and signal processing blocks. This extensive IP library reduces development time and accelerates time-to-market.
Evaluation boards and reference designs demonstrate XCKU3P-L1FFVA676I capabilities across various application domains, providing proven starting points for custom implementations.
Environmental & Export Classifications
The XCKU3P-L1FFVA676I complies with RoHS (Restriction of Hazardous Substances) directives, ensuring environmental responsibility in manufacturing and deployment. Lead-free packaging and halogen-free materials support green technology initiatives.
Export classification information for the XCKU3P-L1FFVA676I is available through official export control documentation. International customers should verify export license requirements and restrictions applicable to their specific applications and destinations.
Environmental operating specifications include commercial temperature range support, with extended temperature variants available for harsh environment applications. The XCKU3P-L1FFVA676I meets stringent reliability standards required for aerospace, automotive, and industrial applications.
Quality certifications and compliance standards ensure the XCKU3P-L1FFVA676I meets industry requirements for safety, reliability, and environmental impact across diverse deployment scenarios.
