The XCKU3P-L1SFVB784I is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding computing applications. This advanced FPGA combines high logic density with energy efficiency, making it an ideal choice for telecommunications, aerospace, defense, and high-performance computing applications.
Product Specifications
The XCKU3P-L1SFVB784I features robust specifications that set it apart in the FPGA market. This device incorporates 356,160 logic cells and 1,824 DSP slices, providing substantial computational power for complex signal processing tasks. The FPGA includes 17.6 Mb of block RAM and 512 UltraRAM blocks, offering flexible memory configurations for various application requirements.
Built on advanced 16nm FinFET+ process technology, the XCKU3P-L1SFVB784I delivers superior performance per watt compared to previous generations. The device operates across commercial temperature ranges and supports multiple I/O standards, ensuring compatibility with diverse system architectures. The SFVB784 package provides 784 pins in a flip-chip ball grid array configuration, optimizing signal integrity and thermal management.
Key specifications include support for DDR4-2400 memory interfaces, PCIe Gen3 x8 connectivity, and 100G Ethernet capabilities. The integrated ARM-based processing system enhances system-level integration while reducing overall component count and board complexity.
Pricing Information
Pricing for the XCKU3P-L1SFVB784I varies based on quantity, delivery requirements, and distributor partnerships. Volume pricing typically offers significant cost advantages for production applications. Contact authorized distributors or AMD Xilinx directly for current pricing, lead times, and availability information.
Educational institutions and research organizations may qualify for special academic pricing programs. Development kit pricing and evaluation board options are also available to support design evaluation and prototyping phases.
Documents & Media
Comprehensive technical documentation supports successful implementation of the XCKU3P-L1SFVB784I in your designs. Essential resources include the complete datasheet detailing electrical characteristics, timing specifications, and package information. The user guide provides detailed architectural descriptions and design guidelines.
Application notes cover specific implementation topics such as power management, thermal considerations, and high-speed design techniques. Reference designs demonstrate best practices for common applications including digital signal processing, communications protocols, and embedded processing systems.
Software support includes the latest Vivado Design Suite tools, featuring synthesis, implementation, and debugging capabilities optimized for Kintex UltraScale+ devices. IP core libraries provide pre-verified functionality blocks to accelerate development cycles.
Related Resources
The XCKU3P-L1SFVB784I integrates seamlessly with AMD Xilinx’s comprehensive ecosystem of development tools, IP cores, and support resources. The Vivado Design Suite provides a complete design environment from RTL to bitstream generation, while the Vitis unified software platform enables software-defined hardware development approaches.
Evaluation boards and development kits accelerate prototyping and proof-of-concept development. These platforms include essential interfaces, power supplies, and debugging capabilities needed for rapid design iteration. Community forums and technical support resources provide additional assistance throughout the development process.
Third-party IP vendors offer specialized cores optimized for Kintex UltraScale+ architecture, expanding available functionality for specific applications. Training courses and certification programs help development teams maximize their productivity with the XCKU3P-L1SFVB784I platform.
Environmental & Export Classifications
The XCKU3P-L1SFVB784I meets stringent environmental standards and regulatory requirements for commercial and industrial applications. The device complies with RoHS directives and REACH regulations, ensuring environmental responsibility throughout the product lifecycle.
Export classification information is available through official AMD Xilinx channels, as regulations may vary by destination country and application. The device typically falls under standard commercial export categories, though specific applications may require additional compliance verification.
Packaging materials are designed for recyclability and minimal environmental impact. The device supports various thermal management strategies to optimize system-level energy efficiency and reduce operational environmental footprint.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade quality processes where applicable. Reliability data and qualification reports are available to support mission-critical applications requiring extended operational lifetimes.
The XCKU3P-L1SFVB784I represents cutting-edge FPGA technology, combining high performance, energy efficiency, and comprehensive development support to enable innovative solutions across diverse application domains.
