Product Specifications
The XC6VSX475T-1FF1759I features impressive technical specifications that set it apart in the FPGA market:
Core Architecture:
- Logic Cells: 475,520 logic cells providing extensive programmable resources
- Configurable Logic Blocks (CLBs): 74,300 CLBs for flexible digital logic implementation
- Block RAM: 38,304 Kb of dual-port block RAM for high-speed data storage
- DSP48E1 Slices: 2,016 dedicated DSP slices for efficient signal processing
Memory and Storage:
- Distributed RAM: 1,187 Kb of distributed selectRAM+ memory
- Memory Controllers: Integrated memory interface blocks supporting DDR3/DDR2/DDR SDRAM
- Configuration Memory: External configuration via multiple interfaces
High-Speed Connectivity:
- GTX Transceivers: 36 GTX transceivers supporting data rates up to 6.6 Gbps
- I/O Banks: Multiple I/O banks with support for various voltage standards
- Maximum User I/O: 600 user I/O pins for extensive connectivity options
Package and Operating Conditions:
- Package Type: FF1759 (Fine-Pitch Ball Grid Array)
- Speed Grade: -1 (standard performance grade)
- Operating Temperature: Industrial temperature range (-40ยฐC to +100ยฐC)
- Supply Voltage: Multiple voltage domains (1.0V core, 1.8V/2.5V/3.3V I/O)
Price Information
The XC6VSX475T-1FF1759I pricing varies based on quantity, distributor, and current market conditions. As a high-end FPGA device, it typically falls within the premium pricing tier of Xilinx products. For accurate pricing information:
- Contact authorized Xilinx distributors for volume pricing
- Check major electronic component suppliers for current stock and pricing
- Consider lead times, as this device may require advance ordering
- Evaluate total cost of ownership including development tools and support
Price factors affecting the XC6VSX475T-1FF1759I include market demand, production volumes, and technology lifecycle stage. Given its advanced capabilities, this FPGA represents a significant investment justified by its performance benefits in critical applications.
Documents & Media
Comprehensive documentation is available for the XC6VSX475T-1FF1759I to support design and implementation:
Technical Documentation:
- Product Data Sheet: Complete electrical and timing specifications
- Package and Pinout Information: Detailed pin assignments and package drawings
- Power and Thermal Guidelines: Power consumption estimates and thermal management
- Migration Guide: Information for upgrading from previous FPGA generations
Design Resources:
- Reference Designs: Pre-validated designs for common applications
- Application Notes: Implementation guidance for specific use cases
- Timing Models: SPICE models and timing characteristics
- Constraint Files: UCF and XDC files for design implementation
Software and Tools:
- ISE Design Suite compatibility information
- Vivado Design Suite support (for newer tool versions)
- IP Core documentation for integrated functions
- Simulation models and testbench examples
Video and Training Materials:
- Webinar recordings on Virtex-6 design techniques
- Training courses for FPGA development
- Case studies demonstrating real-world implementations
- Community forums and support resources
Related Resources
The XC6VSX475T-1FF1759I ecosystem includes numerous complementary resources:
Development Boards:
- ML605 Evaluation Board: Full-featured development platform
- Custom carrier boards from third-party vendors
- Prototyping boards for specific application domains
- Debug and programming hardware options
IP Cores and Libraries:
- LogiCORE IP portfolio for common functions
- DSP libraries optimized for Virtex-6 architecture
- Communication protocol stacks (PCIe, Ethernet, etc.)
- Memory controller IP for various memory types
Design Services:
- Xilinx Alliance Partners for design consultation
- Training and certification programs
- Technical support and customer service
- Regional application engineering support
Competitive Analysis:
- Comparison with other Virtex-6 family members
- Alternative solutions for similar applications
- Migration paths to newer FPGA families
- Performance benchmarking data
Environmental & Export Classifications
The XC6VSX475T-1FF1759I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation compliance for European markets
- Conflict Minerals reporting in accordance with regulations
- ISO 14001 environmental management system certification
Quality Standards:
- Automotive qualification (AEC-Q100) for applicable grades
- Military temperature range options available
- Quality Management System ISO 9001 certification
- Statistical Quality Control (SQC) reporting available
Export Classifications:
- Export Control Classification Number (ECCN) designation
- International Traffic in Arms Regulations (ITAR) status
- Country-specific import/export restrictions
- End-use and end-user screening requirements
Packaging and Shipping:
- Moisture Sensitivity Level (MSL) classification
- Anti-static packaging requirements
- Temperature and humidity shipping constraints
- Traceability and lot control procedures
The XC6VSX475T-1FF1759I represents a pinnacle of FPGA technology, offering unmatched performance and flexibility for the most demanding applications. Its comprehensive feature set, robust documentation, and extensive ecosystem support make it an excellent choice for engineers developing next-generation electronic systems requiring high-performance programmable logic solutions.
