The XCKU5P-1SFVB784I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance, power efficiency, and integration capabilities for demanding applications. Built on advanced 16nm FinFET+ process technology, this FPGA offers the optimal balance of high performance and cost-effectiveness for next-generation designs.
1. Product Specifications
Core Features
- Part Number: XCKU5P-1SFVB784I
- Manufacturer: AMD Xilinx (formerly Xilinx)
- Series: Kintexยฎ UltraScale+โข
- Process Technology: 16nm FinFET+
- Package: 784-pin FCBGA (Flip-Chip Ball Grid Array)
- Speed Grade: -1
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC TJ)
Logic Resources
- Logic Elements/Cells: 474,600 LE
- Adaptive Logic Modules (ALMs): 27,120 ALM
- System Logic Cells: 247,200
- CLB Flip-Flops: 949,200
- LUT Elements: 474,600
Memory Specifications
- Block RAM: 36.8 Mb
- UltraRAM: 3,600 Kb
- Embedded Memory: 16.9 Mbit total
- Memory Blocks: 41,984,000
Signal Processing
- DSP Slices: 7,320
- 18×25 Multipliers: 14,640
- Advanced DSP: Optimized for high-performance computation
I/O Capabilities
- User I/Os: 304
- High-Speed Transceivers: 32 channels
- Transceiver Speed: Up to 16.3 Gbps
- PCIe Support: PCIe Gen3 compatible
- Memory Interfaces: DDR4 support
Power Management
- Core Voltage (VCCINT): 0.825V – 0.876V (0.85V nominal)
- Advanced Power Management: Optimized energy efficiency
- Low Power Operation: Enhanced thermal performance
- Power Options: Multiple power modes for optimal performance/power balance
Physical Characteristics
- Package Type: 784-FCBGA
- Mounting Type: Surface Mount
- Package Dimensions: High-density ball grid array
- Pin Count: 784 pins
2. Price Information
Current Market Pricing (2025):
- Reference price from authorized distributors varies based on quantity and availability
- Extended temperature variant (XCKU5P-1SFVB784E): Approximately $1,740.45 USD (single unit)
- Industrial temperature grade pricing available upon request
- Volume discounts available for quantity orders
- Lead time: Typically 25 weeks from manufacturer
Pricing Notes:
- Prices fluctuate based on market conditions and availability
- Contact authorized distributors for current quotations
- Multiple payment options available (Wire Transfer, PayPal, Credit Card)
- Tray packaging standard
3. Documents & Media
Technical Documentation
- Official Datasheet: XCKU5P-1SFVB784I.pdf (Available from AMD Xilinx)
- UltraScale Architecture User Guide: Comprehensive implementation guide
- Package Pinout Files: Available in TXT and CSV formats
- Design Constraint Files: XDC files for timing constraints
Development Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Application-specific example designs
- User Guides: UG575 package information guide
CAD Models
- ECAD Models: Free CAD models available for download
- Library Loader: Tool for ECAD file conversion
- 3D Models: Package mechanical drawings
- Symbol Libraries: Schematic symbol libraries
Application Notes
- High-Speed Design Guidelines: Signal integrity recommendations
- Power Management: Optimal power supply design
- Thermal Management: Heat dissipation strategies
- PCB Layout: Best practices for board design
4. Related Resources
Development Tools
- Programming Interfaces: JTAG-SMT2-NC, JTAG-SMT3-NC programmers
- Debug Tools: Integrated Logic Analyzer (ILA)
- Simulation: Vivado Simulator and third-party tools
- Hardware Debug: ChipScope Pro equivalent functionality
Compatible Products
- XCKU3P-1SFVB784E: Lower-cost alternative with 355,950 cells
- XCKU5P-1SFVB784E: Extended temperature variant
- XCKU5P-2SFVB784I: Higher speed grade option
- XCKU15P Series: Higher capacity devices in same family
Evaluation Platforms
- Kintex UltraScale+ Development Boards: Various form factors available
- Third-Party Boards: ZedBoard, Nexys series compatibility
- Custom Carrier Boards: Design services available
- Prototyping Solutions: Rapid development platforms
Support Ecosystem
- Technical Forums: Active community support
- Training Resources: Online courses and workshops
- Design Services: Professional implementation support
- Partner Network: Certified design partners worldwide
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant
- REACH Compliance: Fully compliant with EU regulations
- Conflict Minerals: Compliant with conflict minerals regulations
- WEEE Directive: Compliant with waste electrical equipment directive
Quality Standards
- ISO Certification: Manufactured under ISO 9001 quality system
- Reliability: Military-grade reliability standards
- ESD Protection: Electrostatic discharge protection implemented
- MSL Rating: Moisture Sensitivity Level classification applied
Export Classifications
- ECCN: Export Control Classification Number available
- Country of Origin: Manufactured in advanced semiconductor facilities
- Export Restrictions: Subject to export administration regulations
- Dual-Use: May require export license for certain destinations
Packaging & Handling
- Anti-Static Packaging: ESD-safe packaging materials
- Moisture Protection: Sealed packaging with desiccant
- Traceability: Full lot traceability maintained
- Quality Assurance: 100% electrical testing performed
Temperature Ratings
- Operating Range: -40ยฐC to +100ยฐC (Junction Temperature)
- Storage Range: -65ยฐC to +150ยฐC
- Thermal Resistance: Optimized for various cooling solutions
- Junction Temperature: Maximum 100ยฐC for reliable operation
Keywords: XCKU5P-1SFVB784I, Kintex UltraScale+, FPGA, Xilinx, AMD, 16nm FinFET, high-performance computing, signal processing, 784-FCBGA, programmable logic, industrial automation, aerospace applications, data center acceleration
Applications: High-performance computing, aerospace and defense systems, radar signal processing, image and video processing, data center acceleration, industrial automation, automotive electronics, wireless communication, networking equipment, machine learning acceleration
