The XCKU5P-3FFVD900E is a cutting-edge field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in networking, aerospace, defense, and high-performance computing. This advanced FPGA combines high logic density with superior power efficiency, making it an ideal choice for next-generation system designs.
Product Specifications
Core Architecture
The XCKU5P-3FFVD900E features AMD Xilinx’s advanced UltraScale+ architecture built on 16nm FinFET+ technology. This FPGA delivers outstanding performance per watt while maintaining the flexibility that makes FPGAs essential for adaptive computing applications.
Key Technical Specifications
- Logic Cells: 356,160 system logic cells
- CLB Flip-Flops: 712,320
- CLB LUTs: 356,160
- Block RAM: 31.9 Mb total block RAM
- UltraRAM: 28.6 Mb integrated UltraRAM
- DSP Slices: 1,344 DSP48E2 slices
- Package: FFVD900 (23mm ร 23mm fine-pitch BGA)
- Speed Grade: -3 (highest performance grade)
- I/O Pins: 520 user I/O pins
- Transceivers: 16 GTY transceivers supporting up to 32.75 Gbps
- PCIe: PCIe Gen4 x8 capability
- Operating Temperature: Extended commercial (0ยฐC to 85ยฐC)
Advanced Features
The XCKU5P-3FFVD900E incorporates several advanced features including built-in security with AES and SHA authentication, integrated Arm processors for system-level integration, and advanced clocking resources with up to 24 MMCM/PLL blocks.
Price Information
Pricing for the XCKU5P-3FFVD900E varies based on quantity, distribution channel, and specific requirements. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities. Lead times may vary depending on market conditions and demand.
Documents & Media
Technical Documentation
- Product Brief: Comprehensive overview of XCKU5P-3FFVD900E capabilities and applications
- Datasheet: Detailed electrical characteristics, timing specifications, and package information
- User Guide: Complete implementation guide including design considerations and best practices
- Migration Guide: Instructions for upgrading from previous FPGA generations
- Packaging and Pinout: Detailed package drawings and pinout information
Development Resources
- Vivado Design Suite: Complete development environment optimized for the XCKU5P-3FFVD900E
- IP Catalog: Extensive library of verified IP cores compatible with this device
- Reference Designs: Ready-to-use designs demonstrating key capabilities
- Application Notes: Specific implementation guidance for common use cases
Related Resources
Development Boards
Several evaluation and development boards support the XCKU5P-3FFVD900E, enabling rapid prototyping and system validation. These boards typically include high-speed connectors, memory interfaces, and comprehensive I/O options.
Software Tools
The Vivado Design Suite provides complete design flow support for the XCKU5P-3FFVD900E, including synthesis, implementation, and debugging capabilities. Vitis unified software platform enables software-defined acceleration for this device.
Training and Support
AMD Xilinx offers comprehensive training programs, online resources, and technical support specifically for UltraScale+ devices including the XCKU5P-3FFVD900E. Community forums and knowledge base articles provide additional implementation guidance.
Compatible IP Cores
Extensive ecosystem of third-party IP cores optimized for the XCKU5P-3FFVD900E includes networking protocols, signal processing algorithms, and interface controllers.
Environmental & Export Classifications
Environmental Compliance
The XCKU5P-3FFVD900E meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device is designed for extended commercial temperature operation and includes comprehensive thermal management features.
Export Control Information
This product may be subject to export control regulations depending on the destination country and end-use application. Customers should verify export control requirements before ordering or shipping the XCKU5P-3FFVD900E.
Quality and Reliability
Manufacturing follows ISO 9001 quality standards with comprehensive testing and qualification procedures. The XCKU5P-3FFVD900E undergoes extensive reliability testing including temperature cycling, humidity testing, and accelerated aging to ensure consistent performance across operating conditions.
Packaging and Handling
The device ships in anti-static packaging with moisture sensitivity level (MSL) classification. Proper handling procedures should be followed during PCB assembly and system integration to maintain device reliability.
The XCKU5P-3FFVD900E represents the pinnacle of FPGA technology, combining high performance, power efficiency, and comprehensive feature integration in a compact package suitable for the most demanding applications.
