High-Performance Field Programmable Gate Array with Premium Speed Grade
The XCKU5P-3SFVB784E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered to deliver exceptional price-performance-watt balance for demanding applications. Built on advanced 16nm FinFET technology, this premium speed grade (-3) device provides the highest performance in its class, making it ideal for high-speed processing, wireless communications, and data center applications.
1. Product Specifications
Core Architecture
- Family: Kintex UltraScale+
- Part Number: XCKU5P-3SFVB784E
- Speed Grade: -3 (highest performance grade)
- Process Technology: 16nm FinFET
- Temperature Grade: Extended (E) – Commercial temperature range
Logic Resources
- Logic Cells: 474,600 system logic cells
- CLB Flip-Flops: 949,200
- CLB LUTs: 216,960 configurable logic blocks
- Distributed RAM: 434 Kb
- Block RAM: 16.9 Mb UltraRAM + Block RAM
High-Speed Connectivity
- Package: SFVB784 (784-pin FC-BGA)
- User I/O Pins: 440 maximum user I/O
- GTY Transceivers: Up to 16 channels at 28.21 Gbps
- PCIe Support: Gen3 x16 and Gen4 capable
- Memory Interfaces: DDR4-2666 support
Power & Performance
- Core Voltage (VCCINT): 0.85V nominal
- Power Consumption: Up to 60% lower vs 7-series FPGAs
- Performance: 2x faster system-level performance per watt vs Kintex-7
DSP Capabilities
- DSP Slices: 1,968 DSP48E2 slices
- Peak DSP Performance: Optimized for signal processing applications
- UltraRAM: High-capacity on-chip memory blocks
2. Pricing Information
Pricing varies by quantity and distributor. Contact authorized distributors for current pricing:
- Mouser Electronics: Available with datasheet and technical support
- Newark/Farnell: Stock available, price on request
- Authorized Distributors: Multiple global suppliers maintain inventory
Lead Time: Currently 35+ weeks for factory orders due to high demand Packaging Options: Cut tape, full reel, and custom MouseReel packaging available
Note: Pricing subject to market conditions and availability. Non-cancellable, non-returnable (NCNR) product.
3. Documents & Media
Technical Documentation
- Primary Datasheet: Kintex UltraScale+ FPGAs Data Sheet (DS922)
- AC/DC Characteristics: Complete electrical specifications
- Package Pinout Files: TXT and CSV format package files
- User Guides: UltraScale Architecture user documentation
- Application Notes: Design guidelines and best practices
Design Resources
- Vivado Design Suite: Complete FPGA design software
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Sample applications and tutorials
- Package Files: Available through AMD support portal
Development Tools
- Vivado ML Edition: AI-enhanced design tools
- System Generator: High-level synthesis tools
- ChipScope Pro: Debug and verification tools
4. Related Resources
Evaluation Platforms
- KCU116 Evaluation Kit: Features XCKU5P-2FFVB676E for evaluation
- ALINX AXKU5/ACKU5: Third-party development boards
- Custom Development Boards: Various vendor solutions available
Companion Products
- Memory Solutions: Compatible DDR4 SODIMM modules
- Clock Sources: Si570 programmable oscillators
- Power Management: Multi-output power supply modules
- Thermal Solutions: Heat sinks and cooling systems
Software & IP
- 100G Ethernet IP: High-speed networking cores
- Video Processing IP: 4K/8K video acceleration
- Wireless IP: MIMO and baseband processing
- AI/ML Acceleration: Deep learning inference engines
Technical Support
- AMD Community Forums: Peer-to-peer technical discussions
- Application Engineers: Direct technical support
- Training Courses: FPGA design methodology training
- Webinars: Regular technical presentations
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Restriction of Hazardous Substances Directive
- REACH Compliant: Registration, Evaluation, Authorization of Chemicals
- Conflict Minerals: Compliant with conflict minerals regulations
- Lead-Free: RoHS-compliant lead-free package
Operating Conditions
- Temperature Range: 0ยฐC to +85ยฐC (Extended commercial)
- Humidity: Standard JEDEC specifications
- Altitude: Sea level to 2000m operational
- Shock & Vibration: MIL-STD-883 qualified
Export Classifications
- ECCN: 3A991.d (Export Administration Regulations)
- HTS Code: 8542390001 (Harmonized Tariff Schedule)
- TARIC: 8542399000 (EU customs classification)
- Country of Origin: Varies by assembly location
Quality & Reliability
- Quality Standards: ISO 9001:2015 certified manufacturing
- Reliability Testing: JEDEC JESD47 qualification
- Warranty: 12 months from date of purchase
- Traceability: Full supply chain traceability
Packaging & Handling
- ESD Sensitive: Class 1 electrostatic discharge sensitive
- MSL Rating: Moisture Sensitivity Level per JEDEC J-STD-020
- Storage: -55ยฐC to +150ยฐC storage temperature
- Anti-Static Packaging: Ships in conductive packaging
Applications: Ideal for 5G wireless infrastructure, 100G networking, video processing, machine learning acceleration, industrial automation, medical imaging, and high-performance computing applications requiring maximum FPGA performance.
For current pricing, availability, and technical support, contact authorized AMD Xilinx distributors or visit the official AMD website.
