The XCKU5P-L2FFVD900E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing sectors.
Product Specifications
The XCKU5P-L2FFVD900E features advanced 16nm FinFET+ technology, providing superior power efficiency and performance optimization. This FPGA incorporates 356,160 logic cells with 2,760 DSP48E2 slices, enabling complex signal processing and computational tasks.
Key specifications of the XCKU5P-L2FFVD900E include:
- Logic Cells: 356,160 system logic cells
- Block RAM: 25.9 Mb total block RAM
- UltraRAM: 360 blocks providing 12.6 Mb
- DSP Slices: 2,760 DSP48E2 slices for high-performance arithmetic operations
- Package Type: FFVD900 (900-pin flip chip BGA)
- Speed Grade: -2L (low power variant)
- I/O Pins: Up to 520 user I/O pins
- PCIe: PCIe Gen3 x16 connectivity
- Memory Interfaces: DDR4-2400, DDR3, LPDDR4 support
The XCKU5P-L2FFVD900E operates across commercial temperature ranges and supports multiple voltage standards, making it versatile for various deployment environments.
Price
Pricing for the XCKU5P-L2FFVD900E varies based on quantity, lead time, and distribution channel. Contact authorized distributors or AMD Xilinx directly for current pricing information. Volume pricing and long-term agreements may offer significant cost advantages for production quantities.
Factors affecting XCKU5P-L2FFVD900E pricing include market demand, semiconductor supply chain conditions, and customer-specific requirements such as extended temperature ranges or specialized testing.
Documents & Media
Comprehensive technical documentation for the XCKU5P-L2FFVD900E includes:
Product Documentation:
- Complete datasheet with electrical characteristics and timing specifications
- Product Change Notifications (PCNs) and errata documents
- Package and pinout specifications for FFVD900 package
- Power consumption analysis and thermal management guidelines
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- IP core integration guides for the XCKU5P-L2FFVD900E
- Board design guidelines and layout recommendations
Software Tools:
- Vivado ML toolchain support documentation
- Timing closure methodologies specific to XCKU5P-L2FFVD900E
- Power estimation and optimization tools
Related Resources
The XCKU5P-L2FFVD900E ecosystem includes extensive development resources:
Development Platforms:
- KCU105 evaluation board (compatible architecture)
- Third-party development boards supporting XCKU5P-L2FFVD900E
- Custom carrier card solutions from ecosystem partners
IP Portfolio:
- High-speed connectivity IP (100G Ethernet, PCIe Gen3/4)
- Video and imaging processing IP cores
- Digital signal processing libraries optimized for XCKU5P-L2FFVD900E
- Memory controller IP for DDR4 and other standards
Technical Support:
- Community forums and knowledge base access
- Application engineering support for XCKU5P-L2FFVD900E implementations
- Training courses on UltraScale+ architecture optimization
- Design review services and consultation
Environmental & Export Classifications
The XCKU5P-L2FFVD900E meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant with lead-free package construction
- REACH regulation compliance for European markets
- Conflict minerals reporting and responsible sourcing
- Halogen-free package materials available
Quality Standards:
- Automotive-grade variants available (XCKU5P-L2FFVD900E-AES)
- Military temperature range options for defense applications
- ISO 9001 manufacturing quality certification
- Statistical quality control and reliability testing
Export Classifications:
- Export Control Classification Number (ECCN) designation
- ITAR compliance status for defense applications
- Country-specific import/export documentation requirements
- Trade compliance support for international shipments
Reliability Specifications:
- Mean Time To Failure (MTTF) calculations based on operating conditions
- Single Event Upset (SEU) mitigation features
- Built-in configuration memory scrubbing capabilities
- Extended operating temperature ranges up to 100ยฐC junction temperature
The XCKU5P-L2FFVD900E represents the pinnacle of FPGA technology, combining high performance, power efficiency, and comprehensive development support to accelerate time-to-market for next-generation electronic systems.
