The XCKU9P-3FFVE900E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing.
Product Specifications
The XCKU9P-3FFVE900E features advanced 16nm FinFET+ technology, providing superior power efficiency and performance optimization. This FPGA incorporates 912,000 system logic cells with 5,520 DSP slices, enabling complex signal processing and mathematical computations. The device includes 38.4 Mb of block RAM and 1,728 user I/O pins in the FFVE900 package.
Key specifications include a -3 speed grade for high-performance applications, operating temperature range from 0ยฐC to 85ยฐC, and support for multiple voltage standards. The XCKU9P-3FFVE900E supports PCIe Gen3 x16 connectivity and features integrated 100G Ethernet MAC for high-speed networking applications.
The device offers 48 GTH transceivers capable of operating up to 16.3 Gbps, making it ideal for high-bandwidth data transmission requirements. Power consumption is optimized through advanced power management features, ensuring efficient operation across various deployment scenarios.
Price Information
Pricing for the XCKU9P-3FFVE900E varies based on quantity, distribution channel, and current market conditions. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for large-scale deployments and OEM applications.
The XCKU9P-3FFVE900E represents excellent value for applications requiring high logic density, advanced DSP capabilities, and robust connectivity options. Consider total cost of ownership including development tools, support, and long-term availability when evaluating pricing.
Documents & Media
Comprehensive documentation supports the XCKU9P-3FFVE900E implementation and development process. The official datasheet provides detailed electrical specifications, timing parameters, and package information. User guides cover device configuration, power estimation, and thermal management considerations.
Development resources include reference designs, application notes, and white papers demonstrating best practices for XCKU9P-3FFVE900E implementation. Vivado Design Suite provides complete development environment support with device-specific optimization tools and IP libraries.
Technical documentation covers PCB design guidelines, signal integrity considerations, and thermal management recommendations specific to the FFVE900 package. Video tutorials and webinars provide additional learning resources for developers working with the XCKU9P-3FFVE900E.
Related Resources
The XCKU9P-3FFVE900E ecosystem includes development boards, evaluation kits, and third-party IP cores optimized for Kintex UltraScale+ devices. Popular development platforms provide rapid prototyping capabilities and reference implementations for common applications.
Software tools include Vivado HLS for high-level synthesis, SDK for embedded processor development, and various simulation and verification tools. IP catalog offers pre-verified cores for common functions including DSP, networking, and interface protocols.
Community resources include forums, design contests, and university programs supporting XCKU9P-3FFVE900E development. Training courses and certification programs help engineers maximize device capabilities and reduce development time.
Environmental & Export Classifications
The XCKU9P-3FFVE900E meets RoHS compliance requirements and follows industry-standard environmental regulations. The device is manufactured using environmentally responsible processes and materials, supporting green technology initiatives.
Export classification follows applicable international trade regulations including EAR (Export Administration Regulations) and ITAR considerations. Customers should verify current export control status and obtain necessary licenses for international shipments or technology transfers.
Environmental operating specifications include commercial temperature range operation with optional industrial and extended temperature variants available. The XCKU9P-3FFVE900E supports lead-free packaging options and follows conflict minerals reporting requirements.
Quality certifications include ISO standards compliance and automotive-grade options for safety-critical applications. The device undergoes comprehensive testing and qualification processes ensuring reliable operation across specified environmental conditions.
The XCKU9P-3FFVE900E delivers exceptional performance, comprehensive development support, and regulatory compliance for next-generation FPGA applications requiring advanced processing capabilities and high-speed connectivity.
