The XC7K70T-3FBG676E is a powerful field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, engineered to deliver exceptional performance for demanding digital signal processing, communication, and embedded system applications. This versatile programmable logic device combines high-speed processing capabilities with energy efficiency, making it an ideal choice for engineers developing next-generation electronic systems.
Product Specifications
The XC7K70T-3FBG676E features robust technical specifications that position it as a premium solution for complex digital designs:
Core Architecture:
- Logic Cells: 65,600 system logic cells
- CLB Slices: 8,200 configurable logic block slices
- Block RAM: 4,860 Kb total block RAM
- DSP Slices: 240 DSP48E1 slices for high-performance signal processing
Memory and Processing:
- Distributed RAM: 201 Kb
- Maximum Memory Interfaces: Multiple high-speed memory controller support
- Processing Speed: Up to 464 MHz maximum frequency
- I/O Banks: 6 I/O banks with 300 user I/O pins
Package Details:
- Package Type: FBGA (Fine Ball Grid Array)
- Pin Count: 676 pins
- Package Size: 27mm ร 27mm
- Speed Grade: -3 (highest performance grade)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
Connectivity Features:
- PCIe: Integrated PCIe Gen2 x4 endpoint
- Gigabit Transceivers: 8 integrated 6.25 Gbps transceivers
- Clock Management: 4 mixed-mode clock manager (MMCM) tiles
- XADC: 12-bit analog-to-digital converter with dual 1 MSPS
Price Information
The XC7K70T-3FBG676E is positioned as a premium FPGA solution, with pricing typically reflecting its advanced capabilities and high-performance specifications. Pricing varies based on quantity, distribution channel, and market conditions. For current pricing information and volume discounts, contact authorized Xilinx distributors or visit official semiconductor suppliers. Educational and development discounts may be available for qualifying institutions and projects.
Documents & Media
Technical Documentation:
- XC7K70T-3FBG676E Datasheet: Complete electrical and mechanical specifications
- Kintex-7 Family User Guide: Comprehensive implementation guidelines
- Pin Assignment Guide: Detailed pin mapping and I/O standards
- Thermal Design Guidelines: Heat dissipation and cooling recommendations
Development Resources:
- Vivado Design Suite compatibility documentation
- Reference designs and application notes
- PCB layout guidelines and footprint files
- Signal integrity design considerations
Software Support:
- ISE Design Suite compatibility (legacy support)
- Vivado Design Suite full support
- SDK and embedded development tools
- IP core libraries and reference implementations
Related Resources
Development Boards:
- Kintex-7 evaluation boards featuring the XC7K70T-3FBG676E
- Third-party development platforms and carrier boards
- Educational development kits for learning and prototyping
Complementary Products:
- Other Kintex-7 family FPGAs (XC7K160T, XC7K325T, XC7K410T)
- Zynq-7000 SoC alternatives for ARM processor integration
- Configuration memory devices and programming solutions
Design Tools:
- Vivado High-Level Synthesis (HLS) for C/C++ design entry
- ChipScope Pro analyzer for debugging and verification
- Power estimation and analysis tools
- Timing analysis and constraint development utilities
Application Areas:
- Wireless infrastructure and base station processing
- Medical imaging and diagnostic equipment
- Industrial automation and control systems
- Aerospace and defense signal processing applications
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting compliance
- ISO 14001 environmental management certification
Export Control Information:
- Export Control Classification Number (ECCN): 3A001.a.7
- Country of Origin: Varies by manufacturing location
- Export licensing requirements may apply for certain destinations
- Dual-use technology classification under EAR regulations
Quality Standards:
- Automotive qualified versions available (XQR7K70T)
- Industrial temperature range options
- Extended lifecycle support commitment
- Quality management system ISO 9001 certified manufacturing
Packaging and Handling:
- Moisture sensitivity level (MSL): Level 3
- Anti-static handling procedures required
- Tray packaging standard, tape and reel available
- Storage temperature range: -65ยฐC to +150ยฐC
The XC7K70T-3FBG676E represents a compelling choice for engineers requiring high-performance programmable logic solutions. Its combination of processing power, flexibility, and comprehensive development ecosystem makes it suitable for a wide range of applications from prototyping through production deployment. Whether developing advanced communication systems, implementing complex digital signal processing algorithms, or creating innovative embedded solutions, the XC7K70T-3FBG676E provides the performance and features necessary for successful project completion.
