The XC7K410T-L2FFG900E is a powerful Field Programmable Gate Array (FPGA) from Xilinx’s Kintex-7 family, designed to deliver exceptional performance for demanding applications. This advanced FPGA combines high logic density with superior power efficiency, making it ideal for telecommunications, industrial automation, and high-performance computing applications.
Product Specification
The XC7K410T-L2FFG900E features robust specifications that set it apart in the FPGA market:
Core Architecture:
- Logic Cells: 406,720 equivalent logic cells
- CLB Slices: 63,550 configurable logic blocks
- Block RAM: 28,620 Kb total block memory
- DSP Slices: 1,540 DSP48E1 slices for signal processing
Memory and I/O:
- Distributed RAM: 1,188 Kb
- I/O Pins: 500 user I/O pins
- Package: FFG900 (30mm x 30mm Fine-Pitch BGA)
- Speed Grade: -L2 (low power variant)
Performance Characteristics:
- Operating Voltage: 1.0V core, 1.8V/2.5V/3.3V I/O
- Temperature Range: -40ยฐC to +100ยฐC (commercial grade)
- Maximum System Clock: Up to 464 MHz
- Low-power architecture optimized for battery-powered applications
The XC7K410T-L2FFG900E incorporates advanced 28nm process technology, delivering superior performance per watt compared to previous generations.
Price
Pricing for the XC7K410T-L2FFG900E varies based on quantity, lead time, and supplier. Current market pricing typically ranges from $800 to $1,200 per unit for standard quantities. Volume pricing and long-term agreements can significantly reduce per-unit costs.
Pricing Factors:
- Order quantity (higher volumes receive better pricing)
- Lead time requirements
- Packaging options (tray vs. reel)
- Distribution channel selection
For the most current XC7K410T-L2FFG900E pricing and availability, contact authorized Xilinx distributors or semiconductor brokers. Educational and development discounts may be available for qualifying institutions and projects.
Documents & Media
Comprehensive documentation supports the XC7K410T-L2FFG900E implementation:
Technical Documentation:
- Kintex-7 FPGA Data Sheet (DS182)
- XC7K410T-L2FFG900E Product Brief
- Packaging and Pinout Specifications
- PCB Design Guidelines for FFG900 package
Design Resources:
- Vivado Design Suite compatibility information
- Power estimation spreadsheets
- Thermal analysis guidelines
- Signal integrity simulation models
Application Notes:
- High-speed design considerations
- Power management strategies
- Clock distribution best practices
- DDR3/4 memory interface implementation
Development Tools:
- Vivado Design Suite support
- SDK development environment compatibility
- IP core integration guides
- Debugging and verification resources
Access to these resources requires registration with Xilinx’s developer portal, providing engineers with comprehensive support for XC7K410T-L2FFG900E-based designs.
Related Resources
The XC7K410T-L2FFG900E ecosystem includes various complementary products and resources:
Development Boards:
- Kintex-7 FPGA KC705 Evaluation Kit
- Third-party development platforms
- Custom carrier board designs
Compatible IP Cores:
- Xilinx LogiCORE IP portfolio
- Memory controllers (DDR3/4, QDRII+)
- High-speed serial transceivers
- Digital signal processing blocks
Software Tools:
- Vivado Design Suite (synthesis and implementation)
- Vivado HLS (high-level synthesis)
- SDK (software development kit)
- ChipScope Pro analyzer
Training and Support:
- Xilinx University Program resources
- Online training modules
- Community forums and support
- Professional consulting services
Alternative Devices:
- XC7K325T-L2FFG900E (smaller logic capacity)
- XC7K480T-L2FFG900E (higher logic density)
- Ultrascale+ alternatives for next-generation designs
These resources enable comprehensive development support for XC7K410T-L2FFG900E-based projects.
Environmental & Export Classifications
The XC7K410T-L2FFG900E meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Halogen-free package options available
- Green package designation
Reliability Standards:
- AEC-Q100 automotive qualification (select grades)
- MIL-STD-883 military screening available
- JEDEC standard compliance
- Extended temperature range options
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.2
- Export license requirements vary by destination
- Dual-use technology restrictions apply
- Consult export control regulations before international shipping
Quality Certifications:
- ISO 9001:2015 manufacturing quality
- ISO 14001 environmental management
- IATF 16949 automotive quality (applicable variants)
Packaging and Handling:
- ESD-sensitive device (Class 1A)
- Moisture sensitivity level (MSL-3)
- Recommended storage conditions: <30ยฐC, <60% RH
- Anti-static packaging required
The XC7K410T-L2FFG900E’s comprehensive compliance portfolio ensures suitability for diverse global markets and applications, from commercial electronics to aerospace and defense systems.
The XC7K410T-L2FFG900E represents Xilinx’s commitment to delivering high-performance, power-efficient FPGA solutions. With its robust feature set, comprehensive documentation, and regulatory compliance, this device enables innovative designs across multiple industries and applications.
