Product Specifications
Core Architecture
The XC6VSX315T-2FF1156C features Xilinx’s advanced 40nm CMOS technology, delivering superior performance with optimized power consumption. This FPGA incorporates 315,000 logic cells with high-speed DSP capabilities, making it suitable for complex digital processing tasks.
Key Technical Specifications
- Logic Cells: 315,000 system gates
- Package Type: FF1156 (1156-pin Fine-Pitch Ball Grid Array)
- Speed Grade: -2 (intermediate performance grade)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- I/O Pins: Up to 600 user I/O pins
- Memory: Integrated block RAM and distributed RAM
- DSP Slices: High-performance DSP48E1 slices for signal processing
- Clock Management: Advanced clock management tiles (CMTs)
- Power Supply: Multiple voltage domains (1.0V core, 2.5V/3.3V I/O)
Performance Features
The XC6VSX315T-2FF1156C delivers exceptional performance with its optimized architecture supporting high-speed serial connectivity, advanced memory interfaces, and parallel processing capabilities. The device supports multiple high-speed I/O standards including LVDS, SSTL, and HSTL.
Price
The XC6VSX315T-2FF1156C is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and performance specifications. Pricing varies based on:
- Quantity: Volume discounts available for large orders
- Distribution Channel: Authorized distributors vs. direct sales
- Market Conditions: Supply chain and demand fluctuations
- Package Options: Different package configurations may affect pricing
For current pricing information on the XC6VSX315T-2FF1156C, contact authorized Xilinx distributors or visit official pricing portals. Educational and research institutions may qualify for special academic pricing programs.
Documents & Media
Technical Documentation
- Datasheet: Comprehensive electrical and timing specifications
- User Guide: Detailed implementation and design guidelines
- Reference Manual: Complete architectural overview and programming guide
- Application Notes: Specific use case implementations and best practices
- Errata: Known issues and workarounds for the XC6VSX315T-2FF1156C
Design Resources
- Development Tools: Vivado Design Suite compatibility information
- IP Cores: Available intellectual property cores for rapid development
- Reference Designs: Proven design examples and templates
- Simulation Models: SPICE and behavioral models for system simulation
Multimedia Resources
- Product Videos: Technical overviews and application demonstrations
- Webinars: Training sessions and technical deep-dives
- White Papers: Technical analysis and comparative studies
Related Resources
Development Tools
The XC6VSX315T-2FF1156C is fully supported by Xilinx’s comprehensive development ecosystem:
- Vivado Design Suite: Complete design environment for FPGA development
- SDK: Software development kit for embedded processor integration
- ChipScope Pro: Real-time debugging and analysis tools
- System Generator: Model-based design tools for DSP applications
Evaluation Platforms
- Development Boards: Ready-to-use evaluation platforms featuring the XC6VSX315T-2FF1156C
- Reference Kits: Complete system solutions for rapid prototyping
- Demo Applications: Pre-built demonstrations showcasing device capabilities
Technical Support
- Community Forums: Peer-to-peer technical discussions and solutions
- Knowledge Base: Searchable database of technical articles and FAQs
- Technical Support: Direct access to Xilinx engineering expertise
- Training Resources: Comprehensive learning materials and certification programs
Compatible Products
- Memory Interfaces: DDR3, DDR2, and QDR memory controllers
- Communication Protocols: PCIe, Ethernet, and serial communication interfaces
- Power Management: Compatible power supply solutions and regulators
Environmental & Export Classifications
Environmental Compliance
The XC6VSX315T-2FF1156C meets stringent environmental standards and regulations:
- RoHS Compliance: Fully compliant with Restriction of Hazardous Substances directive
- REACH Regulation: Conforms to European chemical safety requirements
- Green Product: Environmentally conscious manufacturing processes
- Packaging: Recyclable and environmentally friendly packaging materials
Operating Conditions
- Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Humidity: Up to 85% relative humidity (non-condensing)
- Altitude: Operational up to 2000 meters above sea level
- Shock and Vibration: Meets JEDEC standards for mechanical reliability
Export Control Information
The XC6VSX315T-2FF1156C is subject to export control regulations:
- Export Classification: Consult current export control databases
- ECCN: Export Control Classification Number as per US regulations
- License Requirements: May require export licenses for certain destinations
- End-Use Restrictions: Subject to end-use and end-user restrictions
Quality Standards
- ISO Certification: Manufactured under ISO 9001 quality management systems
- Automotive Grade: Available in automotive-qualified versions for harsh environments
- Reliability Testing: Extensive qualification testing including temperature cycling and burn-in
- Traceability: Full manufacturing traceability for quality assurance
The XC6VSX315T-2FF1156C represents a pinnacle of FPGA technology, combining high performance, reliability, and comprehensive development support. Whether for prototyping new designs or deploying production systems, this FPGA provides the flexibility and performance needed for today’s most demanding applications.
