Product Specification
The XC6VSX315T-2FF1156I offers impressive specifications that make it ideal for complex digital signal processing applications:
Core Architecture:
- Logic Cells: 315,000 system gates
- Configurable Logic Blocks (CLBs): 49,200 slices
- Block RAM: 11,664 Kb total memory
- DSP48E1 Slices: 1,344 dedicated multiply-accumulate blocks
- Package Type: FF1156 (35mm x 35mm Fine-Pitch BGA)
- Speed Grade: -2 (high performance)
- Temperature Range: Industrial (-40ยฐC to +100ยฐC)
I/O Capabilities:
- User I/O: 600 pins maximum
- High-speed serial transceivers optimized for 11.18 Gbps
- Multiple I/O standards support including LVDS, SSTL, and HSTL
- Integrated memory controllers for DDR3/DDR2 interfaces
Power and Performance:
- Core voltage: 1.0V
- Advanced power management with multiple power domains
- Dynamic power optimization features
- High-speed clock management units (CMTs)
Price
The XC6VSX315T-2FF1156I pricing varies based on quantity and supplier relationships. Contact authorized Xilinx distributors for current pricing information, as costs fluctuate based on market conditions and order volumes. Educational and volume discounts may be available for qualifying customers.
For the most competitive pricing on the XC6VSX315T-2FF1156I, consider:
- Authorized Xilinx distributors
- Electronic component brokers
- Direct manufacturer channels for high-volume orders
Documents & Media
Essential documentation for the XC6VSX315T-2FF1156I includes:
Technical Documentation:
- Virtex-6 Family Data Sheet (DS150)
- XC6VSX315T-2FF1156I Product Brief
- Virtex-6 FPGA Packaging and Pinout Specifications
- DC and Switching Characteristics documentation
- Configuration User Guide
Design Resources:
- Vivado Design Suite compatibility guides
- ISE Design Suite project templates
- Reference designs and application notes
- PCB design guidelines and footprint libraries
- Thermal management guidelines
Software Tools:
- Xilinx Vivado Design Suite support
- ChipScope Pro analyzer compatibility
- ModelSim simulation models
- Timing analysis reports and constraints files
Related Resources
The XC6VSX315T-2FF1156I ecosystem includes comprehensive development resources:
Development Boards:
- Virtex-6 SXT FPGA Development Kit
- Custom evaluation platforms from third-party vendors
- Prototyping boards with XC6VSX315T-2FF1156I socket support
Companion ICs:
- Compatible voltage regulators and power management ICs
- Clock generation and distribution devices
- High-speed ADCs and DACs for signal processing applications
- Memory interfaces (DDR3, QDR II+, RLDRAM II)
Software Ecosystem:
- Xilinx System Generator for DSP
- Embedded Development Kit (EDK)
- Platform Studio integrated development environment
- Third-party IP cores and reference designs
Technical Support:
- Xilinx Answer Database for XC6VSX315T-2FF1156I
- Community forums and user groups
- Application engineering support
- Training courses and webinars
Environmental & Export Classifications
The XC6VSX315T-2FF1156I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Industrial temperature range qualification (-40ยฐC to +100ยฐC)
- Moisture sensitivity level (MSL) rating: Level 3
- Halogen-free package options available
Export Classifications:
- Export Control Classification Number (ECCN) varies by configuration
- Subject to U.S. Export Administration Regulations (EAR)
- International Traffic in Arms Regulations (ITAR) considerations for certain applications
- Country-specific import/export restrictions may apply
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive-grade quality processes where applicable
- Extended temperature screening and burn-in testing
- Comprehensive electrical and functional testing
Reliability Specifications:
- MTBF (Mean Time Between Failures) data available
- Accelerated life testing results
- Electrostatic discharge (ESD) protection ratings
- Latch-up immunity specifications
The XC6VSX315T-2FF1156I delivers the performance, reliability, and flexibility required for next-generation electronic systems. Its combination of high logic density, advanced DSP capabilities, and robust industrial-grade specifications makes it an excellent choice for demanding applications requiring proven FPGA technology.
