The XC7K325T-L2FBG676I is a powerful mid-range Field Programmable Gate Array (FPGA) from AMD Xilinx’s acclaimed Kintex-7 family. This advanced FPGA delivers exceptional price-performance-per-watt optimization with cutting-edge 28nm technology, making it ideal for demanding applications in telecommunications, data centers, signal processing, and high-performance computing.
1. Product Specifications
Core Architecture
- FPGA Family: Kintex-7 Series
- Part Number: XC7K325T-L2FBG676I
- Logic Cells: 326,080 cells for complex digital designs
- Logic Blocks (CLBs): 50,950 configurable logic blocks
- Process Technology: 28nm HKMG (High-K Metal Gate)
- Speed Grade: -L2 (Low power, extended temperature)
- Operating Voltage: 0.95V core voltage
Memory and Storage
- Block RAM: 16,020 Kbit total
- Distributed RAM: Configurable from 6-input LUTs
- DSP Slices: High-performance DSP blocks for signal processing
- DSP Performance: 5.3 TMAC/s (Tera Multiply-Accumulate per second)
I/O and Connectivity
- User I/O: 400 total user I/O pins
- High-Performance I/O: 150 HP User I/O
- High-Range I/O: 250 HR User I/O
- GTX Transceivers: 16 high-speed transceivers
- Transceiver Speed: Up to 12.5 Gb/s per lane
- Total I/O Bandwidth: 2.9 Tb/s
- Package Type: 676-pin FCBGA (Flip Chip Ball Grid Array)
Performance Features
- Logic Density: Over 2 million logic cell capacity
- Real 6-input LUT technology for advanced logic implementation
- 36 Kb dual-port Block RAM with built-in FIFO logic
- Advanced clock management with MMCM and PLL
- 50% lower power consumption compared to previous generation
- 2X performance improvement over prior architectures
Interface Support
- PCIe Gen3 support for high-speed data transfer
- 10 Gigabit Ethernet compatibility
- DDR3/DDR4 memory interface support
- Standard communication protocols for versatile connectivity
Temperature and Environmental Specifications
- Operating Temperature Range: Extended temperature range for industrial applications
- Grade: Industrial (I) grade for harsh environments
- Power Efficiency: Optimized for low-power applications
- Reliability: Designed for long-life applications and harsh conditions
2. Price
The XC7K325T-L2FBG676I pricing varies based on quantity, supplier, and market conditions. For current pricing information:
- Small Quantities: Contact authorized distributors for quote
- Volume Pricing: Significant discounts available for bulk orders
- Lead Time: Varies by supplier and stock availability
- Price Monitoring: Real-time pricing available through electronic component distributors
Note: Prices fluctuate based on market demand, supply chain conditions, and order volume. Contact authorized AMD Xilinx distributors for current pricing and availability.
3. Documents & Media
Official Documentation
- Kintex-7 FPGAs Data Sheet (DS182) – Complete specifications and characteristics
- 7 Series FPGAs Overview (DS180) – Family-wide feature comparison
- Kintex-7 FPGAs Packaging and Pinout – Pin configuration and layout details
- DC and AC Switching Characteristics – Timing and electrical specifications
Development Resources
- Vivado Design Suite – Primary development environment
- Application Notes – Implementation guides and best practices
- Reference Designs – Pre-verified design examples
- IP Catalog – Ready-to-use intellectual property blocks
- User Guides – Step-by-step implementation instructions
Multimedia Resources
- Product Overview Videos – Feature demonstrations and capabilities
- Technical Webinars – Deep-dive training sessions
- Application Examples – Real-world implementation showcases
- White Papers – Technical analysis and performance studies
4. Related Resources
Development Platforms
- KC705 Evaluation Kit – Complete development platform for Kintex-7
- ZedBoard – Popular development board option
- Custom Development Boards – Third-party evaluation platforms
Software Tools
- Vivado Design Suite – Synthesis, implementation, and verification
- SDK (Software Development Kit) – Embedded software development
- IP Integrator – Graphical IP integration environment
- ChipScope Pro – Real-time debugging and analysis
Related FPGAs
- XC7K160T-L2FBG676I – Lower-density option in same package
- XC7K410T-L2FBG676I – Higher-density alternative
- XC7K355T Series – Mid-range alternatives with different features
Technical Support
- AMD Community Forums – Peer-to-peer technical discussions
- Application Engineering Support – Direct technical assistance
- Training Courses – Comprehensive FPGA design education
- Documentation Portal – Centralized resource access
Ecosystem Partners
- Authorized Distributors – Global supply chain partners
- Design Service Partners – Professional implementation services
- IP Vendors – Third-party intellectual property providers
- Board Manufacturers – Custom hardware solutions
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliance: Complies with EU chemical safety regulations
- Lead-Free Package: Environmentally friendly solder materials
- Halogen-Free: Reduced environmental impact materials
Operating Conditions
- Industrial Temperature Range: Extended operating temperature specifications
- Humidity Tolerance: Designed for varying environmental conditions
- Vibration Resistance: Suitable for harsh mechanical environments
- ESD Protection: Built-in electrostatic discharge protection
Export Classifications
- ECCN Classification: Subject to U.S. Export Administration Regulations
- Export License Requirements: May require licensing for certain destinations
- Country-Specific Restrictions: Compliance with international trade regulations
- End-Use Restrictions: Subject to dual-use technology controls
Quality Standards
- ISO 9001 Certified: Quality management system compliance
- Automotive Grade Options: AEC-Q100 qualified variants available
- Military/Aerospace: Extended screening options for critical applications
- Reliability Testing: Extensive qualification and stress testing
Packaging and Handling
- Moisture Sensitivity Level (MSL): Specified handling requirements
- Storage Conditions: Temperature and humidity specifications
- Anti-Static Requirements: ESD-safe handling procedures
- Tray Packaging: Standard delivery format for volume orders
The XC7K325T-L2FBG676I represents AMD Xilinx’s commitment to delivering high-performance, power-efficient FPGA solutions for next-generation applications. Contact authorized distributors for current availability, pricing, and technical support.
