The XC7K325T-3FFG900I is a powerful Kintex-7 FPGA from Xilinx (now AMD) that delivers exceptional performance for demanding applications requiring high-speed processing and advanced connectivity. This industrial-grade programmable logic device combines optimal power efficiency with robust functionality, making it ideal for telecommunications, aerospace, defense, and high-performance computing applications.
Product Specifications
The XC7K325T-3FFG900I features impressive technical specifications that set it apart in the FPGA market:
Logic Resources:
- 326,080 logic cells providing extensive programmable capacity
- 407 user I/O pins for comprehensive connectivity options
- 840 DSP48E1 slices for high-performance digital signal processing
- 16,020 Kb total block RAM for efficient data storage
Package Details: The XC7K325T-3FFG900I utilizes a 900-pin Fine-Pitch Ball Grid Array (FFG900) package, offering excellent thermal performance and signal integrity. The industrial temperature grade (-40ยฐC to +100ยฐC) ensures reliable operation in harsh environments.
Performance Characteristics:
- Speed grade -3 delivers maximum performance for time-critical applications
- Advanced 28nm CMOS technology provides optimal power consumption
- Supports multiple I/O standards including LVDS, DDR3, and PCIe
- Integrated memory controllers and high-speed transceivers
Price Information
XC7K325T-3FFG900I pricing varies based on quantity, supplier, and market conditions. Contact authorized distributors for current pricing and availability. Volume discounts are typically available for production quantities, making this FPGA cost-effective for both prototyping and manufacturing applications.
Documents & Media
Comprehensive documentation supports XC7K325T-3FFG900I implementation:
Technical Documentation:
- Complete datasheet with electrical specifications and timing parameters
- Reference manual detailing architecture and programming guidelines
- Application notes covering design best practices and optimization techniques
- Package and pinout diagrams for PCB layout planning
Design Resources:
- Vivado Design Suite compatibility for streamlined development
- IP core libraries and reference designs
- Power estimation tools and thermal analysis guides
- Configuration and programming documentation
Related Resources
The XC7K325T-3FFG900I integrates seamlessly with Xilinx’s broader ecosystem:
Development Tools:
- Vivado Design Suite for synthesis, implementation, and debugging
- SDK for embedded software development
- ChipScope Pro for real-time signal analysis
- Power optimization and analysis utilities
Compatible Products:
- Other Kintex-7 family members for scalable solutions
- Complementary Zynq-7000 SoCs for ARM-based applications
- Supporting development boards and evaluation kits
- Third-party IP cores and reference designs
Environmental & Export Classifications
The XC7K325T-3FFG900I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for chemical safety
- Industrial temperature range operation (-40ยฐC to +100ยฐC)
- Moisture sensitivity level and storage requirements specified
Export Classifications:
- Export control classification numbers (ECCN) for international shipping
- Country-specific import/export documentation requirements
- Compliance with relevant trade regulations and restrictions
- End-use application guidelines and restrictions
The XC7K325T-3FFG900I represents a premium choice for applications demanding high performance, reliability, and extensive I/O capabilities. Its robust feature set, comprehensive tool support, and industrial-grade specifications make it an excellent solution for next-generation FPGA-based designs across multiple industries.
