1. Product Specifications
Core Architecture and Performance
- FPGA Family: Virtex-6 LXT (Low Power with Transceivers)
- Logic Cells: 128,000 cells maximum
- Technology Node: 40nm CMOS process technology
- Supply Voltage: 1V core voltage (0.95V ~ 1.05V operating range)
- Operating Temperature: 0ยฐC to 85ยฐC (TJ)
Logic Resources
- Configurable Logic Blocks (CLBs): 20,000 slices
- Distributed RAM: 1,740 Kb
- Total RAM Bits: 9,732,096 bits
- Number of LABs/CLBs: 10,000
I/O and Connectivity
- Package Type: 1156-Pin Flip Chip Ball Grid Array (FCBGA)
- Package Size: 35mm ร 35mm
- Maximum I/O Pins: 600
- GTX Transceivers: 8 high-speed serial transceivers
- Data Rate Support: Up to 6.5 Gb/s per channel
Advanced Features
- Clock Management: Mixed-Mode Clock Managers (MMCMs) with PLL-based architecture
- Configuration: SRAM-type internal latches
- Architecture: Third-generation ASMBLโข (Advanced Silicon Modular Block) column-based architecture
- Signal Processing: High-performance signal processing capabilities
- System Integration: Built-in system-level blocks for enhanced functionality
Speed Grade and Performance
- Speed Grade: -2 (commercial grade)
- Performance Class: High-performance logic fabric optimized for demanding applications
2. Price Information
The XC6VLX130T-2FF1156C is available through authorized distributors and electronic component suppliers. Pricing varies based on quantity, supplier, and market conditions. Current market intelligence indicates:
- Availability: Multiple suppliers report stock availability ranging from hundreds to thousands of units
- Lead Time: Typically available as new original stock
- Volume Discounts: Available for bulk orders
- Market Status: Active product with consistent supply chain support
For current pricing and availability, contact authorized Xilinx distributors or electronic component suppliers. Price quotes are typically provided based on specific quantity requirements and delivery terms.
3. Documents & Media
Technical Documentation
- Primary Datasheet: Comprehensive specifications and electrical characteristics
- User Guide: Virtex-6 FPGA User Guide with detailed implementation guidelines
- Configuration Guide: Programming and configuration instructions
- Package Information: Mechanical drawings and pinout details
- Application Notes: Design implementation best practices
Development Resources
- Software Tools: Xilinx Vivado Design Suite (recommended) or ISE Design Tools
- Reference Designs: Sample implementations and starter projects
- IP Cores: Compatible intellectual property blocks
- Evaluation Boards: Development platforms and starter kits available
Media and Support
- Product Briefs: Summary specifications and feature highlights
- Selection Guides: Family comparison and device selection criteria
- Technical Papers: Implementation strategies and performance optimization
- Video Resources: Design tutorials and training materials
4. Related Resources
Compatible Development Platforms
- Evaluation Boards: Virtex-6 FPGA evaluation kits
- Development Kits: ML605 and similar reference platforms
- Starter Kits: Entry-level development boards for prototyping
- Custom Boards: Third-party development platforms
Design Tools and Software
- Xilinx Vivado Design Suite: Modern design environment with advanced synthesis and implementation
- ISE Design Tools: Legacy but still supported development environment
- IP Catalog: Extensive library of pre-verified IP cores
- System Generator: MATLAB/Simulink integration tools
Technical Support
- Documentation Portal: Comprehensive technical documentation library
- Community Forums: Peer-to-peer technical discussions
- Application Engineering: Expert technical support services
- Training Programs: Design methodology and tool training
Ecosystem Partners
- Board Partners: Third-party development board manufacturers
- IP Partners: Specialized intellectual property providers
- Tool Partners: Complementary design and verification tools
- System Integrators: Professional design services
5. Environmental & Export Classifications
RoHS Compliance Status
- RoHS Compliance: EU RoHS Directive 2011/65/EU compliant with exemptions
- Lead-Free Status: Lead-free solder finish on external terminations
- Internal Lead Content: May contain lead in high-temperature die attach solder (RoHS exempt)
- Certification: Meets European Union restrictions on hazardous substances
Environmental Classifications
- Package Material: Environmentally conscious packaging materials
- Halogen Status: Standard product (not halogen-free unless specifically marked)
- Recycling: Compliant with WEEE (Waste Electrical and Electronic Equipment) directive
- Material Declaration: Material content information available upon request
Export Control Information
- ECCN Classification: 3A991.d (Export Control Classification Number)
- USHTS Code: 8542390001 (US Harmonized Tariff Schedule)
- TARIC Code: 8542399000 (European customs classification)
- Export Restrictions: Subject to applicable export control regulations
Regulatory Compliance
- REACH Compliance: Compliant with EU REACH regulation for chemical substances
- China RoHS: Meets Chinese restrictions on hazardous substances
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- Quality Standards: Manufactured to ISO 9001 quality management standards
Handling and Storage
- ESD Protection: Electrostatic discharge sensitive device
- Storage Requirements: Standard semiconductor storage conditions
- Moisture Sensitivity: Appropriate moisture sensitivity level classification
- Packaging: Anti-static packaging with proper identification labeling
Note: Specifications and availability are subject to change. For the most current information, consult the official Xilinx documentation and authorized distributors. The XC6VLX130T-2FF1156C represents a proven solution for high-performance FPGA applications requiring advanced logic capabilities and system integration features.
