1. Product Specifications
Core Features
- Part Number: XC6VLX130T-2FFG1156I
- Manufacturer: AMD Xilinx (formerly Xilinx Inc.)
- Product Family: Virtex-6 LXT FPGA
- Logic Elements: 128,000 cells
- Process Technology: 40nm CMOS technology
- Architecture: Third-generation ASMBL (Advanced Silicon Modular Block) column-based architecture
Technical Specifications
- Logic Cells: 128000 LE
- Block RAM: 9504 kbit embedded memory
- I/O Count: 600 I/O pins
- Package Type: 1156-Pin FCBGA (Flip Chip Ball Grid Array)
- Package Size: 35mm x 35mm
- Voltage Supply: 0.95 V ~ 1.05 V
- Operating Temperature: -40โ~ 100โ (TJ)
- Speed Grade: -2 (Commercial grade)
- Mounting Type: Surface Mount
Key Performance Features
- High-Speed Processing: Advanced programmable logic capabilities for complex digital designs
- Configurable I/O Interfaces: Support for multiple I/O standards and voltage levels
- Embedded Memory Blocks: Integrated Block RAM for efficient data storage and retrieval
- DSP Capabilities: Built-in digital signal processing blocks for real-time applications
- Low Power Consumption: Optimized 40nm process technology for power efficiency
2. Price
Current Market Pricing
The XC6VLX130T-2FFG1156I is available from authorized distributors and electronic component suppliers worldwide. Pricing varies based on quantity, supplier, and market conditions:
- Single Unit Price Range: $670.41/pcs to $800+ USD
- Bulk Pricing: Available upon request for quantities over 25 units
- Lead Time: Typically 3-7 business days for in-stock items
- Stock Availability: 46 pieces in stock at major distributors
Authorized Distributors
- Digi-Key Electronics
- Mouser Electronics
- Avnet
- Arrow Electronics
- Components-Store.com
- LCSC Electronics
Note: Prices are subject to change based on market conditions and availability. Contact authorized distributors for current pricing and volume discounts.
3. Documents & Media
Official Documentation
- Datasheet: Virtex-6 Family Overview (DS150) – Available from AMD Xilinx documentation portal
- User Guide: Virtex-6 FPGA Configuration User Guide
- Package Information: 1156-Ball Fine-Pitch Ball Grid Array Package specifications
- Pin-out Diagrams: Complete pin assignment and I/O bank information
Development Resources
- ISE Design Suite: Compatible with Xilinx ISE for design entry and implementation
- Vivado Design Suite: Support for newer design tools and workflows
- Reference Designs: Sample projects and application notes
- IP Core Library: Pre-verified intellectual property blocks
Technical Documentation Links
- Product Brief and Selection Guide
- Power and Thermal Design Guidelines
- PCB Design and Layout Guidelines
- Configuration and Programming documentation
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Comprehensive design environment for FPGA development
- Vivado Design Suite: Next-generation design tools with advanced features
- ChipScope Pro: Integrated logic analyzer for design debugging
- System Generator for DSP: MATLAB/Simulink-based DSP design tool
Evaluation Boards
- Virtex-6 FPGA ML605 Evaluation Kit
- Custom evaluation boards from third-party vendors
- Development platforms with XC6VLX130T-2FFG1156I
Programming Languages
- VHDL: Industry-standard hardware description language
- Verilog: Popular HDL for digital design
- SystemVerilog: Advanced verification and design language
- C/C++: High-level synthesis support
Application Areas
- Digital Signal Processing: Real-time signal processing and filtering applications
- Embedded Systems: Programmable logic for system-on-chip designs
- High-Performance Computing: Acceleration of compute-intensive algorithms
- Communications: Protocol processing and data packet handling
- Industrial Automation: Control systems and real-time processing
- Aerospace & Defense: Mission-critical applications requiring high reliability
Compatible Components
- XC6VLX240T-2FFG1156I (Higher logic density alternative)
- XC6VLX75T-2FFG784C (Lower pin count option)
- XC7A200T-2FFG1156C (Next-generation 7-series alternative)
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead free / RoHS Compliant
- REACH Compliant: Meets European chemical regulations
- Halogen-Free: Available in halogen-free package options
- Green Package: Environmentally friendly packaging materials
Operating Conditions
- Operating Temperature Range: -40โ to +100โ (Junction Temperature)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters above sea level
Export Control Classification
- ECCN (Export Control Classification Number): Consult with AMD Xilinx export compliance for current classification
- Country of Origin: Manufactured in various locations under AMD Xilinx quality standards
- Export Restrictions: Subject to U.S. export control regulations and country-specific restrictions
- Documentation Required: End-user certificates may be required for certain destinations
Quality Standards
- ISO 9001: Manufactured under ISO 9001 quality management system
- Automotive Grade: AEC-Q100 qualified versions available for automotive applications
- Military Grade: Extended temperature and reliability versions available
- Reliability Testing: Comprehensive reliability testing including HTOL, ELFR, and package stress tests
Packaging Information
- MSL Rating: Moisture Sensitivity Level 3
- Package Marking: Laser-etched part number and date code
- Tray Packaging: Anti-static trays for safe handling and storage
- Tape and Reel: Available for automated assembly processes
The XC6VLX130T-2FFG1156I represents a powerful solution for demanding FPGA applications, combining high performance, flexibility, and reliability in a proven architecture. For the latest technical specifications, pricing, and availability, consult with authorized AMD Xilinx distributors and the official product documentation.
