The XC7K410T-3FFG900I is a premium field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, engineered to deliver exceptional performance for demanding digital signal processing, communications, and embedded computing applications. This advanced FPGA combines high logic density with superior power efficiency, making it an ideal choice for next-generation electronic designs.
Product Specifications
The XC7K410T-3FFG900I features robust technical specifications that position it as a leading solution in the FPGA market:
Core Architecture:
- Logic Cells: 406,720 equivalent logic cells
- Configurable Logic Blocks (CLBs): 63,550 CLBs
- Look-Up Tables (LUTs): 254,200 6-input LUTs
- Flip-Flops: 508,400 flip-flops
- Block RAM: 28,620 Kb total block RAM
Memory and DSP Features:
- DSP Slices: 1,540 DSP48E1 slices for high-performance signal processing
- Memory Controllers: Integrated memory interface blocks supporting DDR3/DDR2
- Maximum Memory Bandwidth: Up to 1,866 Mb/s DDR3 support
Package and I/O:
- Package Type: FFG900 (Fine-Pitch Ball Grid Array)
- Total I/O Pins: 500 user I/O pins
- Speed Grade: -3 (highest performance grade)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Connectivity:
- High-speed serial transceivers: 32 GTX transceivers
- Maximum transceiver speed: 12.5 Gbps per channel
- PCI Express: PCIe Gen2 x8 endpoint and root port
Price Information
The XC7K410T-3FFG900I is positioned in the premium FPGA segment, reflecting its advanced capabilities and industrial-grade specifications. Pricing varies based on:
- Order quantity and volume discounts
- Distribution channel and regional availability
- Current market conditions and supply chain factors
- Additional services such as programming and testing
For current pricing and availability of the XC7K410T-3FFG900I, contact authorized Xilinx distributors or sales representatives. Educational and volume pricing options may be available for qualifying customers.
Documents & Media
Technical Documentation:
- Product Data Sheet: Comprehensive electrical and timing specifications
- User Guide: Detailed implementation guidelines and best practices
- Package and Pinout Information: Complete pin assignment and package drawings
- Migration Guide: Compatibility information for design transitions
Design Resources:
- Reference Designs: Pre-validated IP cores and application examples
- Development Board Schematics: Hardware design references
- Constraint Files: Timing and placement constraint templates
- Application Notes: Specific use case implementations
Software Support:
- Vivado Design Suite compatibility information
- IP Core documentation and licensing details
- Simulation models and testbenches
Related Resources
Development Tools:
- Xilinx Vivado Design Suite: Complete design environment for the XC7K410T-3FFG900I
- Kintex-7 Development Boards: Evaluation and prototyping platforms
- IP Core Libraries: Pre-verified intellectual property blocks
Compatible Products:
- Other Kintex-7 family devices for scalable design approaches
- Zynq-7000 SoCs for ARM processor integration
- Spartan-7 FPGAs for cost-optimized alternatives
Application Areas:
- Wireless Infrastructure: Base stations and radio frequency processing
- Wired Communications: High-speed networking and data center applications
- Industrial Automation: Motor control and machine vision systems
- Aerospace and Defense: Radar, sonar, and secure communication systems
Training and Support:
- Xilinx University Program resources
- Online training modules and certification programs
- Community forums and technical support channels
Environmental & Export Classifications
Environmental Compliance: The XC7K410T-3FFG900I meets stringent environmental standards:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH (Registration, Evaluation, Authorization of Chemicals) compliant
- Halogen-free package options available
- Conflict minerals reporting available
Export Control Information:
- Export Control Classification Number (ECCN): Classified under US Export Administration Regulations
- Country of Origin: Manufactured in facilities meeting international quality standards
- Import/Export Documentation: Available for customs and regulatory compliance
Quality and Reliability:
- Automotive-grade options available (AEC-Q100 qualified variants)
- Industrial temperature range: -40ยฐC to +100ยฐC junction temperature
- Extended lifecycle support for long-term projects
- Comprehensive quality assurance and testing procedures
Packaging and Handling:
- Moisture sensitivity level and storage requirements
- Electrostatic discharge (ESD) protection guidelines
- Recommended handling procedures for production environments
The XC7K410T-3FFG900I represents a sophisticated solution for engineers requiring high-performance FPGA capabilities with reliable operation in demanding environments. Its combination of advanced features, comprehensive documentation, and strong ecosystem support makes it an excellent choice for cutting-edge digital design projects.
