The XC6SLX25T-3FG484I is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-6 family. This versatile FPGA delivers exceptional performance and flexibility for a wide range of applications, from consumer electronics to industrial automation systems.
Product Specifications
Core Features of XC6SLX25T-3FG484I
The XC6SLX25T-3FG484I features 24,051 logic cells and 52 user I/O pins, making it ideal for medium-complexity digital designs. Built on advanced 45nm technology, this FPGA offers superior power efficiency while maintaining high performance standards.
Key Technical Specifications:
- Logic Cells: 24,051
- Block RAM: 2,088 Kbits
- DSP48A1 Slices: 38
- User I/O: 52
- Package Type: FBGA-484 (Fine Pitch Ball Grid Array)
- Speed Grade: -3 (High Performance)
- Operating Temperature: Industrial (-40ยฐC to +100ยฐC)
- Supply Voltage: 1.2V core, 3.3V I/O
Memory and Processing Capabilities
The XC6SLX25T-3FG484I incorporates distributed RAM and block RAM resources totaling over 2MB of memory. The integrated DSP48A1 slices provide dedicated multiply-accumulate functionality, essential for signal processing applications.
Package and Pin Configuration
Housed in a compact 23x23mm FBGA-484 package, the XC6SLX25T-3FG484I maximizes pin density while maintaining excellent thermal characteristics. The fine-pitch ball grid array ensures reliable connections in high-density PCB designs.
Price Information
XC6SLX25T-3FG484I Pricing:
- Single Unit Price: Contact for current pricing
- Volume Pricing: Available for quantities of 100+ units
- Educational Discount: Special pricing available for academic institutions
- Lead Time: Typically 2-4 weeks for standard quantities
Pricing for the XC6SLX25T-3FG484I varies based on market conditions and order volume. Contact authorized distributors for the most current pricing information.
Documents & Media
Technical Documentation for XC6SLX25T-3FG484I
Essential Documents:
- Datasheet: Complete electrical and timing specifications
- User Guide: Comprehensive design and implementation guidelines
- Package Information: Detailed pinout and mechanical drawings
- Power Estimation Tools: Xilinx Power Estimator (XPE) spreadsheets
- Design Constraints: UCF (User Constraints File) templates
Development Resources
Software and Tools:
- Xilinx ISE Design Suite: Complete development environment
- ChipScope Pro: Advanced debugging and analysis tools
- MicroBlaze Soft Processor: Embedded processing capabilities
- Reference Designs: Proven starting points for common applications
Application Notes and Tutorials
Access comprehensive application notes covering DDR memory interfacing, high-speed serial communication, and power optimization techniques specifically for the XC6SLX25T-3FG484I.
Related Resources
Compatible Development Boards
Recommended Evaluation Platforms:
- Spartan-6 FPGA SP605 Evaluation Kit
- Nexys 3 Board (Academic Applications)
- Custom carrier boards for the XC6SLX25T-3FG484I
Complementary Products
Essential Components for XC6SLX25T-3FG484I Designs:
- Configuration memory devices (SPI Flash, PROM)
- Power management ICs optimized for Spartan-6 FPGAs
- Clock generation and distribution circuits
- High-speed connectors and cables
Design Services and Support
Professional design services are available for customers implementing the XC6SLX25T-3FG484I in complex applications. Xilinx Alliance Program partners provide specialized expertise in FPGA design, verification, and manufacturing support.
Environmental & Export Classifications
Environmental Compliance
The XC6SLX25T-3FG484I meets stringent environmental standards:
RoHS Compliance: Fully compliant with RoHS 2011/65/EU directive REACH Regulation: Compliant with EU REACH requirements Conflict Minerals: Certified conflict-free minerals sourcing Green Packaging: Recyclable packaging materials used throughout
Operating Conditions
Environmental Specifications:
- Storage Temperature: -65ยฐC to +150ยฐC
- Operating Humidity: 5% to 85% relative humidity (non-condensing)
- Altitude: Up to 3,000 meters above sea level
- Vibration Resistance: Meets JEDEC standards for transportation and operation
Export Control Classifications
Trade Compliance Information:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (final assembly location specified on product marking)
Important Notice: The XC6SLX25T-3FG484I may be subject to export licensing requirements depending on the destination country and end-use application. Consult with trade compliance specialists before international shipments.
Quality and Reliability Standards
The XC6SLX25T-3FG484I undergoes comprehensive testing to ensure reliability in demanding applications:
- JEDEC Standards: Full compliance with semiconductor reliability standards
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Temperature: Extended temperature range operation certified
For the most current information about the XC6SLX25T-3FG484I, including availability, pricing, and technical specifications, contact your local Xilinx representative or authorized distributor.
