The XC6SLX75-L1FGG676C is a powerful field-programmable gate array (FPGA) from Xilinx’s proven Spartan-6 family, engineered to deliver exceptional performance for cost-sensitive applications. This FPGA combines advanced processing capabilities with energy-efficient design, making it an ideal choice for digital signal processing, embedded systems, and communication infrastructure projects.
Product Specifications
The XC6SLX75-L1FGG676C features robust technical specifications that enable versatile implementation across multiple application domains. This FPGA incorporates 74,752 logic cells with distributed RAM capability, providing substantial processing power for complex digital designs. The device includes 172 user I/O pins in a compact 676-ball fine-pitch ball grid array (FBGA) package, offering excellent connectivity options while maintaining a small form factor.
Key technical specifications include 4,824 slices with four 6-input look-up tables (LUTs) and eight flip-flops per slice, delivering flexible logic implementation. The XC6SLX75-L1FGG676C integrates 516 Kb of block RAM configured as dual-port memory blocks, supporting efficient data storage and buffering operations. Digital signal processing capabilities are enhanced through 132 DSP48A1 slices, enabling high-performance arithmetic operations essential for signal processing applications.
The device operates reliably across industrial temperature ranges from -40ยฐC to +100ยฐC, ensuring consistent performance in demanding environmental conditions. Power consumption is optimized through advanced low-power design techniques, making the XC6SLX75-L1FGG676C suitable for battery-powered and energy-conscious applications.
Price
Pricing for the XC6SLX75-L1FGG676C varies based on quantity, supplier, and market conditions. Typical unit pricing ranges from $45 to $85 for quantities of 100-999 pieces, with volume discounts available for larger orders. Engineering samples and small quantities may command premium pricing, while production volumes often qualify for negotiated pricing agreements.
Price factors include packaging options, speed grade specifications, and regional availability. The L1 speed grade designation indicates this device offers balanced performance and cost optimization compared to faster speed grades. Customers should consult authorized Xilinx distributors for current pricing, availability, and volume discount structures specific to their application requirements.
Documents & Media
Comprehensive technical documentation supports successful implementation of the XC6SLX75-L1FGG676C in your designs. The primary datasheet provides detailed electrical characteristics, timing specifications, and package information essential for system design and PCB layout planning. User guides offer step-by-step implementation guidance, covering everything from initial design entry through final bitstream generation.
Application notes demonstrate proven design techniques and best practices for maximizing performance while minimizing development time. These documents cover topics including clock domain crossing, memory interface design, and power optimization strategies specific to Spartan-6 FPGAs. Development board schematics and reference designs accelerate prototyping by providing tested hardware platforms and example implementations.
Software documentation includes detailed information about Xilinx ISE Design Suite compatibility, synthesis guidelines, and implementation flow optimization. Training materials and video tutorials provide additional support for engineers new to FPGA development or transitioning from other device families.
Related Resources
The XC6SLX75-L1FGG676C ecosystem includes extensive development tools and support resources to streamline your design process. Xilinx ISE Design Suite provides comprehensive design entry, synthesis, implementation, and debugging capabilities specifically optimized for Spartan-6 devices. The software includes integrated simulation tools, timing analysis, and power estimation features essential for successful FPGA implementation.
Development boards and evaluation kits offer hands-on experience with the XC6SLX75-L1FGG676C, featuring pre-built hardware platforms with common peripherals and interfaces. These boards include USB programming interfaces, memory modules, and expansion connectors that simplify prototyping and proof-of-concept development.
Intellectual property (IP) cores extend device functionality through pre-verified, optimized implementations of common functions including memory controllers, communication protocols, and digital signal processing algorithms. These IP cores reduce development time while ensuring reliable operation and optimal resource utilization within your XC6SLX75-L1FGG676C designs.
Third-party tools and services complement Xilinx development resources, including specialized synthesis tools, verification platforms, and design services from experienced FPGA consultants and system integrators.
Environmental & Export Classifications
The XC6SLX75-L1FGG676C meets stringent environmental and regulatory standards required for commercial and industrial applications. The device complies with RoHS (Restriction of Hazardous Substances) directives, ensuring lead-free manufacturing processes and environmentally responsible material selection throughout the supply chain.
Moisture sensitivity level (MSL) classification determines proper handling and storage requirements during manufacturing and assembly processes. The XC6SLX75-L1FGG676C typically carries MSL-3 classification, requiring controlled humidity conditions during storage and reflow soldering operations to prevent package damage.
Export control classifications determine international shipping and distribution requirements for the XC6SLX75-L1FGG676C. The device generally falls under standard commercial export categories, though specific end-use applications and destination countries may require additional export licensing. Customers should verify current export control status and requirements with qualified trade compliance professionals before international shipments.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade qualification for applications requiring enhanced reliability and traceability. The industrial temperature grade (-40ยฐC to +100ยฐC) supports deployment in harsh environmental conditions while maintaining specified performance parameters throughout the operational temperature range.
The XC6SLX75-L1FGG676C represents an excellent balance of performance, features, and cost-effectiveness for modern FPGA applications requiring substantial logic capacity and flexible I/O capabilities in a compact, energy-efficient package.
