The XC6SLX9-L1FT256I is a versatile Field-Programmable Gate Array (FPGA) from Xilinx’s proven Spartan-6 family, engineered to deliver exceptional performance while maintaining ultra-low power consumption. This compact yet powerful FPGA solution is ideal for cost-sensitive applications requiring reliable programmable logic capabilities.
Product Specifications
The XC6SLX9-L1FT256I features a robust architecture designed for demanding embedded applications:
Core Logic Resources:
- 9,152 logic cells providing flexible digital signal processing capabilities
- 576 CLB slices for efficient logic implementation
- 32 dedicated DSP48A1 slices for high-speed mathematical operations
- 32 block RAM modules (576 Kb total) for on-chip memory storage
I/O and Connectivity:
- 186 user I/O pins in FTBGA256 package format
- Multiple I/O standards support including LVDS, LVCMOS, and SSTL
- High-speed serial connectivity options
- Integrated memory controller support
Performance Characteristics:
- Industrial temperature range (-40ยฐC to +100ยฐC)
- Low-power L1 speed grade optimized for energy efficiency
- Advanced 45nm manufacturing process technology
- Supply voltage flexibility from 1.2V core to 3.3V I/O
Package Details:
- FTBGA256 (17mm x 17mm) fine-pitch ball grid array
- Lead-free RoHS compliant construction
- Compact footprint ideal for space-constrained designs
Pricing Information
The XC6SLX9-L1FT256I offers competitive pricing for volume applications. Contact authorized Xilinx distributors for current pricing tiers based on quantity requirements. Educational and prototype quantities may qualify for special pricing programs. Volume discounts are available for production orders exceeding 1,000 units annually.
Documents & Media
Technical Documentation:
- XC6SLX9-L1FT256I product datasheet with complete electrical specifications
- Spartan-6 FPGA User Guide covering architecture and design guidelines
- Package and pinout documentation for FTBGA256 format
- Power consumption analysis and thermal management guidelines
Design Resources:
- Reference designs and application notes
- Constraint files and footprint libraries
- Signal integrity analysis reports
- Layout guidelines for optimal PCB design
Software Tools:
- Xilinx ISE Design Suite compatibility information
- Configuration and programming specifications
- Simulation models and timing analysis data
Related Resources
Development Platforms:
- Spartan-6 evaluation boards featuring the XC6SLX9-L1FT256I
- Compatible development kits and reference designs
- Third-party carrier boards and modules
Design Support:
- Xilinx technical support resources and community forums
- Application-specific reference implementations
- IP core libraries optimized for Spartan-6 architecture
- Training materials and design methodology guides
Compatible Products:
- Other Spartan-6 family devices for design scalability
- Configuration memory solutions (SPI Flash, PROM)
- Power management ICs optimized for FPGA applications
- High-speed connectors and interface components
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for European markets
- Conflict minerals reporting available upon request
- ISO 14001 certified manufacturing processes
Export Control Information:
- ECCN (Export Control Classification Number): 3A001.a.7
- Licensed for export to most international destinations
- Specific country restrictions may apply – consult current export regulations
- Technical data subject to US Export Administration Regulations (EAR)
Quality and Reliability:
- Automotive grade AEC-Q100 qualified versions available
- Extended industrial temperature range operation
- MTBF (Mean Time Between Failures) data available in reliability reports
- Comprehensive quality assurance testing including burn-in procedures
The XC6SLX9-L1FT256I represents an optimal balance of performance, power efficiency, and cost-effectiveness for modern FPGA applications. Its proven Spartan-6 architecture, combined with comprehensive development tool support, makes it an excellent choice for engineers developing next-generation embedded systems, industrial automation, communications infrastructure, and consumer electronics products.
