The XC6SLX25-3FTG256C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-6 family, designed to deliver exceptional performance for cost-sensitive applications. This versatile FPGA combines advanced processing capabilities with energy efficiency, making it an ideal choice for developers working on digital signal processing, embedded systems, and communication infrastructure projects.
Product Specifications
The XC6SLX25-3FTG256C features robust specifications that make it suitable for demanding applications:
Core Architecture:
- Logic Cells: 24,051 logic cells providing ample resources for complex designs
- Look-Up Tables (LUTs): 15,822 6-input LUTs for flexible logic implementation
- Flip-Flops: 19,161 flip-flops for reliable data storage and timing control
- Block RAM: 52 blocks of 18Kb each, totaling 936Kb of embedded memory
Memory and DSP Features:
- Distributed RAM: 259Kb for distributed memory applications
- DSP48A1 Slices: 38 dedicated DSP slices for high-performance arithmetic operations
- Maximum user I/O pins: 186 pins for extensive connectivity options
Package and Speed Grade:
- Package Type: FTG256 (Fine-Pitch Ball Grid Array with 256 pins)
- Speed Grade: -3 (high-performance speed grade for demanding timing requirements)
- Operating Temperature: Commercial grade (0°C to +85°C)
Power and Performance:
- Supply Voltage: 1.2V core, 3.3V/2.5V/1.8V I/O support
- Low power consumption with advanced power management features
- High-speed performance up to 375 MHz internal clock frequency
Price Information
The XC6SLX25-3FTG256C is competitively priced within the mid-range FPGA market segment. Pricing varies based on quantity, distribution channel, and current market conditions. For the most current pricing information and volume discounts, please contact authorized Xilinx distributors or visit the official Xilinx website. Educational institutions and volume purchasers may be eligible for special pricing programs.
Documents & Media
Technical Documentation:
- XC6SLX25-3FTG256C Datasheet: Complete electrical specifications and AC/DC characteristics
- Spartan-6 Family Overview: Comprehensive family documentation and feature comparison
- Configuration User Guide: Detailed configuration and programming instructions
- PCB Design Guidelines: Layout recommendations and signal integrity considerations
Design Resources:
- Reference Designs: Pre-built design examples and application notes
- IP Core Documentation: Compatible IP cores and integration guidelines
- Pin-out Documentation: Detailed pin assignments and package information
- Timing Reports: Speed file information and timing constraint examples
Software Support:
- ISE Design Suite compatibility documentation
- Vivado Design Suite migration guides (where applicable)
- Constraint file templates and examples
Related Resources
Development Tools:
- Xilinx ISE Design Suite: Primary development environment for the XC6SLX25-3FTG256C
- ChipScope Pro: Integrated logic analyzer for debugging and verification
- EDK (Embedded Development Kit): For embedded processor development
Evaluation Platforms:
- Spartan-6 FPGA SP605 Evaluation Kit: Compatible development board
- Third-party development boards supporting the FTG256 package
- Custom evaluation board design files and references
IP Cores and Libraries:
- LogiCORE IP portfolio compatibility
- DSP and communication IP cores optimized for Spartan-6
- Interface IP cores for common protocols (PCIe, Ethernet, USB)
Application Areas:
- Digital Signal Processing applications
- Communications and networking equipment
- Industrial automation and control systems
- Automotive electronics and infotainment
- Medical device development
- Aerospace and defense applications
Environmental & Export Classifications
Environmental Compliance: The XC6SLX25-3FTG256C meets stringent international environmental standards:
- RoHS Compliant (Restriction of Hazardous Substances)
- REACH Regulation compliance
- Lead-free package construction with Pb-free finish
- Halogen-free package materials available
- WEEE Directive compliance for electronic waste management
Operating Conditions:
- Commercial Temperature Range: 0°C to +85°C ambient
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters above sea level
- Vibration and shock resistance per industry standards
Export Classification:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Varies by manufacturing location
- Export licensing requirements may apply for certain destinations
Quality and Reliability:
- Automotive qualification available (AEC-Q100 Grade 2)
- Industrial temperature range options (-40°C to +100°C)
- Extended lifecycle support for long-term projects
- Comprehensive quality assurance and testing procedures
Package Information:
- MSL (Moisture Sensitivity Level): Level 3
- Storage temperature: -65°C to +150°C
- Lead-free reflow soldering compatible
- Package marking includes date code and traceability information
The XC6SLX25-3FTG256C represents an excellent balance of performance, features, and cost-effectiveness, making it a preferred choice for engineers developing next-generation digital systems. Its comprehensive feature set, combined with robust environmental compliance and extensive development ecosystem support, ensures successful project implementation across diverse application domains.
