“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC6SLX45T-3FGG484C – Spartan-6 LXT FPGA for High-Performance Applications

Original price was: $20.00.Current price is: $19.00.

The XC6SLX45T-3FGG484C is a powerful Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-6 LXT family. This advanced FPGA combines exceptional performance with cost-effectiveness, making it ideal for high-volume applications requiring serial connectivity and system integration capabilities.

Product Specifications

Core Architecture

  • FPGA Family: Spartan-6 LXT (high-speed serial connectivity optimized)
  • Logic Cells: 43,661 configurable logic cells
  • Configurable Logic Blocks (CLBs): 3,411 CLBs
  • Technology Node: 45nm low-power CMOS process
  • Operating Frequency: Up to 390MHz/667MHz/862MHz depending on configuration
  • Core Voltage: 1.2V (1.14V to 1.26V operating range)

Memory and DSP Resources

  • Block RAM: 2,088 Kbits total memory (18 Kb block RAMs)
  • DSP Slices: Second-generation DSP48A1 slices for high-performance signal processing
  • Memory Controllers: Integrated SDRAM memory controllers with 800Mb/s DDR3 support

I/O and Connectivity

  • User I/O Pins: 296 configurable I/O pins
  • Serial Transceivers: High-speed GTP transceivers (up to 3.2Gb/s)
  • PCI Express: Compatible endpoint blocks for PCIe connectivity
  • SelectIO Technology: Multi-voltage, multi-standard I/O banks supporting 3.3V to 1.2V standards

Package Details

  • Package Type: 484-pin Fine-pitch Ball Grid Array (FBGA)
  • Package Code: FGG484
  • Dimensions: 23mm x 23mm
  • Pitch: 1.0mm
  • Mounting: Surface Mount Technology (SMT)
  • Lead-Free: RoHS compliant, lead-free package

Advanced Features

  • Clock Management: Enhanced mixed-mode Clock Management Tiles (CMT)
  • Power Management: Hibernate power-down mode for zero power consumption
  • Security: AES encryption and Device DNA protection for IP security
  • Configuration: Auto-detect configuration options for simplified setup
  • Operating Temperature: 0ยฐC to 85ยฐC (commercial grade)

Price Information

The XC6SLX45T-3FGG484C offers competitive pricing for high-volume applications:

Current Market Pricing

  • Single Unit: $120 – $135 USD
  • Volume Pricing (60+ units): $98 – $108 USD
  • High Volume (1000+ units): $91 – $96 USD per unit

Pricing varies by distributor, order quantity, and current market conditions. Contact authorized distributors for current quotes and volume discounts.

Key Value Propositions

  • Cost-Effective: 50% lower power consumption compared to previous Spartan families
  • High Integration: Reduces overall BOM costs through integrated peripherals
  • Scalable: Part of 13-member Spartan-6 family for design scalability

Documents & Media

Technical Documentation

  • Official Datasheet: Spartan-6 Family Overview (DS160)
  • User Guide: Spartan-6 FPGA Configurable Logic Block User Guide
  • Reference Manual: Spartan-6 FPGA SelectIO Resources User Guide
  • Application Notes: Power consumption optimization and PCB design guidelines

Development Resources

  • Software Tools: Xilinx ISE Design Suite, Vivado Design Suite (migration path)
  • IP Cores: Comprehensive library of verified IP cores
  • Reference Designs: Automotive infotainment, industrial automation examples
  • Evaluation Boards: Compatible with multiple Xilinx development platforms

Pin Configuration

  • Pinout Diagrams: Complete ball-out diagrams and pin assignments
  • PCB Footprints: Eagle, Altium, and KiCad footprint libraries
  • Layout Guidelines: High-speed design considerations and routing recommendations

Related Resources

Compatible Development Boards

  • Digilent Basys 3: Educational FPGA development board
  • Nexys4 DDR: Advanced prototyping platform with DDR3 memory
  • Custom Carrier Boards: Various third-party solutions available

Software Ecosystem

  • Xilinx Vivado: Next-generation design suite for advanced development
  • ISE Design Suite: Legacy support for existing Spartan-6 designs
  • Platform Studio: Embedded system development environment
  • ChipScope Pro: Real-time verification and debugging tools

Application Areas

  • Automotive Infotainment: Advanced bridging and connectivity solutions
  • Industrial Automation: High-speed control and monitoring systems
  • Consumer Electronics: Cost-sensitive applications requiring FPGA flexibility
  • Communications: Protocol processing and data path acceleration
  • Medical Equipment: Real-time signal processing applications

Training and Support

  • Online Courses: Xilinx University Program training modules
  • Design Methodologies: Best practices for Spartan-6 implementation
  • Community Forums: Active developer community and technical support
  • FAE Support: Local field application engineer assistance

Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliance: Fully compliant with RoHS directive 2011/65/EU
  • REACH Regulation: Compliant with EU REACH regulation
  • Lead-Free: 100% lead-free construction and assembly
  • Halogen-Free: Meets industry halogen-free requirements
  • MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30ยฐC/60% RH)

Export Control Classifications

  • ECCN Code: 3A991.d (Export Control Classification Number)
  • HTS Code: 8542390001 (US Harmonized Tariff Schedule)
  • TARIC Code: 8542399000 (EU customs classification)
  • Country of Origin: Varies by manufacturing location (typically Malaysia/China)

Regulatory Certifications

  • FCC Compliance: Suitable for FCC Part 15 applications
  • CE Marking: Compliant with European EMC and safety directives
  • UL Recognition: Component recognition for safety-critical applications
  • ISO Standards: Manufactured in ISO 9001:2015 certified facilities

Packaging and Shipping

  • ESD Protection: Antistatic packaging for component protection
  • Tray Packaging: Standard 60-piece trays for automated assembly
  • Tape and Reel: Available for high-volume SMT placement
  • Storage Requirements: Store in controlled environment (โ‰ค30ยฐC, โ‰ค60% RH)

Bottom Line: The XC6SLX45T-3FGG484C delivers exceptional price-performance for applications requiring high-speed connectivity, making it the optimal choice for cost-sensitive designs that cannot compromise on functionality or reliability.