The XC3S50A-FTG256AGQ is a cutting-edge Field-Programmable Gate Array (FPGA) from Xilinx’s acclaimed Spartan-3A family, designed to deliver exceptional performance for cost-sensitive applications. This versatile FPGA combines advanced features with affordability, making the XC3S50A-FTG256AGQ an ideal choice for embedded systems, digital signal processing, and rapid prototyping projects.
Product Specifications
Core Architecture
- Device Family: Xilinx Spartan-3A FPGA
- Logic Cells: 50,000 system gates
- Package Type: FTBGA-256 (Fine-pitch Ball Grid Array)
- Operating Temperature: Automotive grade (-40ยฐC to +125ยฐC)
- Supply Voltage: 1.2V core, 3.3V I/O
Memory and I/O Features
- Block RAM: 216 Kb total block RAM
- Distributed RAM: 25 Kb
- User I/O Pins: 195 maximum
- Differential I/O Pairs: 72 pairs
- Clock Management: 4 Digital Clock Managers (DCMs)
Performance Characteristics
- Maximum Frequency: Up to 200 MHz
- Logic Elements: 1,584 slices (3,168 4-input LUTs)
- Multipliers: 4 dedicated 18×18 multipliers
- Power Consumption: Low-power design optimized for battery applications
The XC3S50A-FTG256AGQ features advanced I/O standards support including LVDS, SSTL, and HSTL, ensuring compatibility with modern high-speed interfaces and memory controllers.
Price Information
Competitive Pricing for XC3S50A-FTG256AGQ
The XC3S50A-FTG256AGQ offers exceptional value in the mid-range FPGA market segment. Pricing varies based on:
- Quantity Breaks: Volume discounts available for orders of 100+ units
- Lead Time: Standard vs. expedited delivery options
- Distribution Channel: Authorized distributors vs. direct from manufacturer
- Market Conditions: Current semiconductor supply chain status
For current XC3S50A-FTG256AGQ pricing and availability, contact authorized Xilinx distributors or request a quote through official channels. Educational and prototype quantities may qualify for special pricing programs.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and pin configuration for XC3S50A-FTG256AGQ
- User Guide: Spartan-3A FPGA family comprehensive design guide
- Package Information: FTBGA-256 mechanical drawings and assembly guidelines
- Errata: Known issues and workarounds for XC3S50A-FTG256AGQ
Development Resources
- Reference Designs: Sample VHDL/Verilog code for common applications
- Board Layout Guidelines: PCB design recommendations for XC3S50A-FTG256AGQ
- Thermal Management: Heat dissipation strategies and thermal modeling
- Power Analysis: Dynamic and static power consumption calculations
Software Tools
- Xilinx ISE Design Suite: Compatible development environment
- ChipScope Pro: Integrated logic analyzer for debugging
- FPGA Editor: Low-level design visualization and modification
Related Resources
Development Boards
- Spartan-3A Starter Kit: Entry-level development platform featuring XC3S50A-FTG256AGQ
- Custom Evaluation Boards: Third-party solutions for rapid prototyping
- Application-Specific Modules: Pre-built solutions for common use cases
Compatible Components
- Configuration Memory: Platform Flash and SPI Flash options
- Clock Sources: Crystal oscillators and clock generators
- Power Management: Voltage regulators and power sequencing ICs
- Interface Components: Level shifters and signal conditioning circuits
Design Services
- FPGA Design Consultation: Expert assistance for XC3S50A-FTG256AGQ implementation
- IP Core Licensing: Pre-verified intellectual property blocks
- Custom Board Design: Full-service PCB development including XC3S50A-FTG256AGQ integration
Training and Support
- Online Tutorials: Step-by-step guides for XC3S50A-FTG256AGQ development
- Webinar Series: Live training sessions covering advanced topics
- Community Forums: Peer-to-peer support and knowledge sharing
- Technical Support: Direct access to Xilinx application engineers
Environmental & Export Classifications
Environmental Compliance
The XC3S50A-FTG256AGQ meets stringent environmental standards:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: European chemical safety standards compliance
- Green Package: Halogen-free materials where applicable
- Automotive Grade: AEC-Q100 qualified for automotive applications
Export Control Information
- ECCN Classification: 3A001.a.2 (US Export Administration Regulations)
- HTS Code: Harmonized Tariff Schedule classification for customs
- Country of Origin: Manufacturing location for trade compliance
- Export Restrictions: Specific countries or end-use limitations
Quality and Reliability
- Operating Life: 20+ years under normal operating conditions
- Quality Standards: ISO 9001 certified manufacturing facilities
- Reliability Testing: Comprehensive qualification including temperature cycling, thermal shock, and accelerated aging
- Failure Rate: Industry-leading MTBF specifications
Packaging and Handling
- Moisture Sensitivity: MSL-3 classification requiring controlled storage
- Anti-Static Protection: ESD-sensitive device requiring proper handling procedures
- Storage Requirements: Temperature and humidity specifications for long-term storage
- Shipping Classifications: Proper packaging for international distribution
Why Choose XC3S50A-FTG256AGQ?
The XC3S50A-FTG256AGQ represents the perfect balance of performance, features, and cost-effectiveness in the FPGA market. Whether you’re developing industrial control systems, communications equipment, or consumer electronics, this versatile FPGA provides the flexibility and reliability your project demands.
Contact your local Xilinx distributor today to learn more about integrating the XC3S50A-FTG256AGQ into your next design project.
