The XC3S50AN-5TQ144C is a versatile field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance and flexibility for cost-sensitive embedded applications. This advanced FPGA combines programmable logic with integrated flash memory, making it an ideal solution for developers seeking reliable, low-power digital design implementations.
Product Specifications
The XC3S50AN-5TQ144C features a robust architecture with 50,000 system gates and 1,584 logic cells, providing ample resources for complex digital designs. This FPGA operates at a -5 speed grade, ensuring fast signal processing and reduced propagation delays for time-critical applications.
Key technical specifications of the XC3S50AN-5TQ144C include dual-port RAM blocks totaling 54 Kbits, supporting efficient data storage and retrieval operations. The device incorporates 108 I/O pins in a compact 144-pin TQFP (Thin Quad Flat Package) form factor, maximizing connectivity options while maintaining a small footprint suitable for space-constrained designs.
The integrated flash memory eliminates the need for external configuration devices, simplifying board design and reducing overall system cost. The XC3S50AN-5TQ144C supports multiple I/O standards including LVTTL, LVCMOS, and differential signaling, ensuring compatibility with various interface requirements.
Power consumption characteristics make the XC3S50AN-5TQ144C particularly attractive for battery-powered applications, with multiple power management modes available to optimize energy efficiency based on operational requirements.
Price Information
Pricing for the XC3S50AN-5TQ144C varies based on order quantity, distribution channel, and current market conditions. Volume pricing typically offers significant cost advantages for production quantities. For current pricing information and availability, contact authorized Xilinx distributors or visit official semiconductor supplier websites. Educational discounts may be available for academic institutions and qualifying research projects.
Documents & Media
Comprehensive technical documentation supports the XC3S50AN-5TQ144C implementation process. The official datasheet provides detailed electrical characteristics, timing specifications, and package information essential for design planning. Application notes offer practical guidance for common implementation scenarios and design optimization techniques.
Design tools include Xilinx ISE Design Suite compatibility, enabling seamless development workflow from initial concept through final implementation. Reference designs and example projects accelerate development timelines by providing proven starting points for typical applications.
Programming guides detail configuration procedures and debugging methodologies, while thermal analysis documents assist with thermal management planning for demanding operational environments.
Related Resources
The Spartan-3AN family offers several related devices that may suit different application requirements. Higher-density options like the XC3S200AN and XC3S400AN provide expanded logic resources for more complex designs, while maintaining architectural compatibility with the XC3S50AN-5TQ144C.
Development boards and evaluation kits enable rapid prototyping and proof-of-concept validation before committing to custom hardware designs. These platforms typically include essential peripherals, programming interfaces, and example designs to streamline the evaluation process.
Third-party IP cores extend functionality with pre-verified designs for common functions like communication protocols, signal processing algorithms, and interface controllers. Partner ecosystem resources include design services, training programs, and technical support options to accelerate project completion.
Environmental & Export Classifications
The XC3S50AN-5TQ144C meets stringent environmental standards for industrial applications. Operating temperature range spans from -40ยฐC to +85ยฐC, ensuring reliable operation across diverse environmental conditions. The device complies with RoHS (Restriction of Hazardous Substances) directives, supporting environmentally responsible manufacturing practices.
Qualification standards include automotive-grade testing where applicable, with extended temperature ranges and enhanced reliability screening for mission-critical applications. Package materials meet industry standards for moisture sensitivity and thermal cycling performance.
Export classification information is available through official trade compliance documentation, ensuring proper handling for international shipments and regulatory compliance. Standard commercial export classifications typically apply, though specific applications may require additional verification.
Quality certifications include ISO standards compliance and comprehensive reliability testing programs that validate long-term operational stability under specified conditions.
