The XC3S700A-4FG400IC is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance and functionality for high-volume, cost-sensitive electronic applications. This advanced FPGA solution builds upon the proven success of earlier Spartan-3E and Spartan-3 FPGA families, incorporating enhanced features that improve system performance while reducing configuration costs.
1. Product Specifications
Core Architecture
- FPGA Family: Spartan-3A
- Logic Gates: 700,000 gates (700K)
- Logic Cells: 13,248 cells
- Configurable Logic Blocks (CLBs): 1,472 CLBs
- Maximum Frequency: 667MHz
- Process Technology: Advanced 90nm CMOS technology
- Operating Voltage: 1.2V core voltage
Package Details
- Package Type: FBGA-400 (Fine-Pitch Ball Grid Array)
- Pin Count: 400 pins
- I/O Pins: 311 user I/O pins
- Mounting Type: Surface Mount
- Package Size: Compact form factor for space-constrained designs
Performance Features
- High-speed operation up to 667MHz for demanding applications
- Low power consumption optimized for battery-powered devices
- Enhanced I/O capabilities with 311 available user I/O pins
- Dual-range VCCAUX supply simplifying 3.3V-only designs
- Advanced memory resources for complex data processing
Key Benefits
The XC3S700A-4FG400IC delivers more functionality and bandwidth per dollar than previous generations, setting new standards in the programmable logic industry. Its 90nm process technology ensures optimal power efficiency while maintaining high performance capabilities.
2. Price Information
Current Market Pricing
Based on current market data, the XC3S700A-4FG400IC pricing structure varies by quantity and supplier:
Typical Price Ranges (USD):
- 1+ units: $55.16 – $76.19
- 60+ units: $58.90 – $64.68
- 120+ units: $62.29 – $63.14
- 240+ units: $61.44 – $62.29
- 6000+ units: $58.90+
Volume Discounts Available: Significant cost savings for high-volume orders, making the XC3S700A-4FG400IC ideal for mass production applications.
Price Factors:
- Quantity ordered (volume discounts apply)
- Current market demand
- Distributor margins
- Geographic location
- Lead times and availability
Note: Prices are subject to market fluctuations and should be verified with authorized distributors for current quotes.
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive specifications and electrical characteristics
- Application Notes: Implementation guidelines and best practices
- Reference Designs: Sample designs for common applications
- Programming Guide: Detailed instructions for FPGA configuration
- Pin-out Diagrams: Complete I/O mapping and package information
Development Resources
- Design Software: Compatible with Xilinx Vivado Design Suite and ISE Design Tools
- IP Cores: Access to extensive library of pre-verified IP blocks
- Simulation Models: SPICE and behavioral models for system simulation
- Layout Guidelines: PCB design recommendations and constraints
- Thermal Management: Thermal characterization and cooling guidelines
Support Materials
- Quick Start Guides: Getting started documentation for new users
- FAQ Documents: Common questions and troubleshooting tips
- Video Tutorials: Step-by-step implementation guides
- Webinar Recordings: Technical presentations and design techniques
4. Related Resources
Development Tools
- Xilinx Vivado Design Suite: Industry-leading FPGA design environment
- ISE Design Tools: Legacy design suite for Spartan-3A development
- ChipScope Pro: Real-time debugging and verification tools
- EDK (Embedded Development Kit): Embedded processor development tools
Evaluation Platforms
- Spartan-3A Starter Kits: Complete development boards for prototyping
- Evaluation Boards: Professional-grade development platforms
- Reference Designs: Pre-built implementations for common applications
- Demo Applications: Working examples across various market segments
Companion Products
- Configuration Memory: Compatible PROM and Flash memory devices
- Power Management: Dedicated power supply solutions
- Clock Generation: High-precision oscillators and clock management
- Interface Components: Level shifters and I/O expansion devices
Application Areas
The XC3S700A-4FG400IC excels in numerous applications including:
- Broadband Access Equipment: High-speed data processing and routing
- Home Networking: Wireless routers and network infrastructure
- Display/Projection Systems: Video processing and image enhancement
- Digital Television Equipment: Signal processing and format conversion
- Industrial Control Systems: Real-time control and monitoring
- Automotive Electronics: Advanced driver assistance systems
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: Not RoHS Compliant (contains restricted substances)
- Lead-Free: No (contains lead in solder balls)
- Halogen-Free: Status varies by specific variant
- REACH Compliance: Compliant with REACH regulations
Operating Conditions
- Operating Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
- Storage Temperature: -55ยฐC to +150ยฐC
- Humidity: 85% relative humidity (non-condensing)
- Altitude: Up to 2000 meters above sea level
Export Classifications
- ECCN (Export Control Classification Number): 3A991.a.2
- HTS Code: 8542.31.0001
- Country of Origin: Manufactured in various approved facilities
- Export Restrictions: Subject to standard semiconductor export regulations
Quality Standards
- ISO Certification: Manufactured in ISO 9001:2015 certified facilities
- Automotive Grade: Standard commercial grade (industrial grade available)
- Military Standards: Commercial grade (military variants available separately)
- Reliability Testing: Extensive qualification testing per JEDEC standards
Package Handling
- ESD Sensitivity: Class 1 (>1000V HBM)
- Moisture Sensitivity: Level 3 (168 hours at 30ยฐC/60% RH)
- Storage Requirements: Dry pack recommended for long-term storage
- Handling Precautions: ESD protection required during handling and assembly
Manufacturer: Xilinx Inc. (now part of AMD)
Part Number: XC3S700A-4FG400IC
Product Category: Embedded – FPGAs (Field Programmable Gate Array)
Lifecycle Status: Active (End-of-Life announced – contact distributor for availability)
For the most current pricing, availability, and technical support, contact authorized Xilinx/AMD distributors or visit the official AMD documentation portal.
