The XC3S700A-5FGG400I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3 family, designed to deliver exceptional performance for complex digital signal processing and embedded system applications. This versatile programmable logic device combines high gate density with cost-effective pricing, making it an ideal choice for engineers developing sophisticated electronic systems.
Product Specifications
The XC3S700A-5FGG400I offers robust technical capabilities that set it apart in the FPGA market:
Core Architecture:
- Logic Cells: 13,824 equivalent logic cells
- System Gates: 700,000 system gates
- CLB Array: 46 x 34 Configurable Logic Blocks
- Total CLBs: 1,472 CLBs with 5,888 4-input LUTs and 5,888 flip-flops
Memory Resources:
- Block RAM: 360 Kbits total block RAM
- RAM Blocks: 20 dedicated 18-Kbit block RAMs
- Distributed RAM: 92 Kbits using LUTs as distributed RAM
I/O and Connectivity:
- Package: 400-pin Fine-Pitch Ball Grid Array (FBGA)
- User I/O Pins: 264 user I/O pins
- Differential I/O Pairs: 104 differential pairs
- Speed Grade: -5 (high performance)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Advanced Features:
- Digital Clock Manager (DCM): 4 DCMs for clock management
- Multipliers: 20 dedicated 18×18 multiplier blocks
- Maximum Frequency: Up to 326 MHz system performance
- Power Supply: 1.2V core, 2.5V/3.3V I/O compatible
Price Information
The XC3S700A-5FGG400I pricing varies based on quantity and supplier. For current pricing and availability of the XC3S700A-5FGG400I, contact authorized Xilinx distributors or electronic component suppliers. Volume pricing discounts are typically available for production quantities.
Documents & Media
Essential documentation for the XC3S700A-5FGG400I includes:
Technical Documentation:
- XC3S700A-5FGG400I datasheet with complete electrical specifications
- Spartan-3 FPGA Family User Guide
- Configuration and programming guidelines
- Package drawings and pinout diagrams
- DC and switching characteristics documentation
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- PCB layout guidelines for the 400-pin FBGA package
- Thermal management recommendations
Related Resources
Development Tools:
- Xilinx ISE WebPACK (free) or ISE Foundation software
- ChipScope Pro for embedded logic analysis
- EDK (Embedded Development Kit) support
- Third-party synthesis tools compatibility
Evaluation Boards:
- Spartan-3 Starter Kit boards featuring similar devices
- Custom evaluation platforms from Xilinx partners
- University program development boards
Technical Support:
- Xilinx technical support portal and knowledge base
- Community forums and design examples
- Training materials and webinars
Environmental & Export Classifications
The XC3S700A-5FGG400I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free)
- REACH regulation compliant
- Industrial temperature range: -40ยฐC to +100ยฐC junction temperature
- Moisture sensitivity level: MSL-3
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Varies by manufacturing location
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive qualified versions available (contact factory)
- Military temperature and screening options available
The XC3S700A-5FGG400I represents an excellent balance of performance, features, and cost-effectiveness for demanding FPGA applications. Its combination of high logic density, abundant I/O resources, and proven Spartan-3 architecture makes it suitable for applications ranging from digital signal processing to embedded control systems. Whether you’re developing telecommunications equipment, industrial automation systems, or advanced research platforms, the XC3S700A-5FGG400I provides the programmable logic resources needed for successful project implementation.
