The XC3S700A-6FG484C is a versatile field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for cost-sensitive applications. This advanced programmable logic device combines robust functionality with energy efficiency, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
The XC3S700A-6FG484C features impressive technical capabilities that set it apart in the FPGA market. This device incorporates 700,000 system gates with 13,824 logic cells, providing substantial processing power for demanding applications. The FPGA includes 360 Kbits of distributed RAM and 360 Kbits of block RAM, ensuring efficient data storage and retrieval operations.
Key specifications of the XC3S700A-6FG484C include a maximum operating frequency that supports high-speed digital signal processing applications. The device operates with a core voltage of 1.2V and I/O voltage ranging from 1.2V to 3.3V, offering flexibility in system integration. The -6 speed grade designation indicates optimized performance characteristics for applications requiring faster timing closure.
The FG484 package provides 484 pins in a fine-pitch ball grid array (FBGA) format, measuring 23mm x 23mm. This compact footprint maximizes I/O density while maintaining excellent thermal characteristics. The XC3S700A-6FG484C supports 372 user I/O pins, enabling extensive connectivity options for complex system designs.
Price Information
Pricing for the XC3S700A-6FG484C varies based on order quantity, distribution channel, and market conditions. The device is positioned as a cost-effective solution within the Spartan-3A family, offering excellent price-to-performance ratio for volume applications. Engineers should contact authorized Xilinx distributors for current pricing information, volume discounts, and availability schedules.
The XC3S700A-6FG484C represents significant value in applications requiring moderate logic density with high I/O count. Cost optimization opportunities exist through design efficiency improvements and proper utilization of the device’s integrated features, including built-in clock management and memory resources.
Documents & Media
Comprehensive documentation supports successful implementation of the XC3S700A-6FG484C in various applications. The official Xilinx datasheet provides detailed electrical specifications, timing parameters, and package information essential for design planning. Application notes offer practical guidance for common implementation scenarios and design optimization techniques.
The Spartan-3A family user guide contains extensive information about device architecture, configuration options, and design methodologies. PCB layout guidelines ensure proper signal integrity and thermal management in high-density designs. Reference designs and evaluation boards accelerate development timelines by providing proven implementation examples.
Software support includes compatibility with Xilinx ISE Design Suite and Vivado Design Suite, offering comprehensive tools for synthesis, implementation, and debugging. IP core libraries extend functionality with pre-verified components for common interfaces and processing functions.
Related Resources
The XC3S700A-6FG484C integrates seamlessly with Xilinx’s broader ecosystem of development tools and support resources. Evaluation platforms provide hands-on experience with device capabilities before committing to full system development. Training materials and online courses help engineers maximize their design efficiency and implement best practices.
Community forums and technical support channels offer assistance throughout the development process. Application-specific reference designs demonstrate optimal implementation approaches for telecommunications, industrial control, and consumer electronics applications. Third-party IP providers extend available functionality through specialized cores and interfaces.
Design services and consulting support are available for complex projects requiring specialized expertise. Partner programs connect engineers with qualified design houses and system integrators experienced in Spartan-3A implementations.
Environmental & Export Classifications
The XC3S700A-6FG484C meets stringent environmental and regulatory requirements for global deployment. The device complies with RoHS directives, ensuring lead-free manufacturing processes that support environmental sustainability initiatives. Temperature grades accommodate operation in industrial environments with extended temperature ranges.
Export classification follows standard semiconductor regulations, with appropriate ECCN (Export Control Classification Number) designations for international shipping compliance. The device meets automotive qualification standards where applicable, supporting deployment in safety-critical applications.
Quality certifications include ISO standards compliance throughout the manufacturing process. Reliability testing encompasses temperature cycling, thermal shock, and accelerated aging protocols that verify long-term operational stability. The XC3S700A-6FG484C demonstrates excellent performance characteristics across specified operating conditions.
Environmental testing validates operation under various stress conditions including humidity, vibration, and electromagnetic interference scenarios. These comprehensive qualifications ensure reliable performance in demanding deployment environments while maintaining compliance with international standards and regulations.
The XC3S700A-6FG484C represents an excellent choice for engineers seeking proven FPGA technology with comprehensive support resources and global availability. Its combination of performance, flexibility, and cost-effectiveness makes it suitable for a wide range of applications requiring programmable logic solutions.
