The XC3S700A-4FGG484CES is a powerful field-programmable gate array (FPGA) from Xilinx’s proven Spartan-3A family, designed to deliver exceptional performance and flexibility for a wide range of digital applications. This advanced FPGA solution combines high logic density with cost-effective implementation, making the XC3S700A-4FGG484CES an ideal choice for embedded systems, signal processing, and custom digital logic designs.
Product Specifications
Core Features of XC3S700A-4FGG484CES
Logic Resources:
- System Gates: 700,000
- Logic Cells: 13,248
- Configurable Logic Blocks (CLBs): 1,472
- Maximum Distributed RAM: 188 Kbits
- Block RAM: 360 Kbits (20 blocks of 18 Kbits each)
Memory Architecture: The XC3S700A-4FGG484CES features dual-port block RAM that can be configured as single or dual-port memory, FIFOs, or content-addressable memory (CAM). This flexible memory architecture enables efficient data storage and retrieval for complex applications.
I/O Capabilities:
- Maximum User I/O: 372 pins
- Package: 484-pin Fine-Pitch Ball Grid Array (FBGA)
- Differential I/O pairs support
- Multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL
Performance Specifications:
- Speed Grade: -4 (highest performance grade)
- Maximum frequency: Up to 320 MHz
- Low power consumption with advanced power management features
- Operating temperature range: Commercial (0ยฐC to +85ยฐC)
Digital Signal Processing: The XC3S700A-4FGG484CES includes dedicated 18×18 multipliers and advanced carry logic, making it well-suited for DSP applications, digital filtering, and mathematical computations.
Pricing Information
XC3S700A-4FGG484CES Pricing:
- Unit Price: Contact authorized distributors for current pricing
- Volume Pricing: Available for quantities of 100+ units
- Lead Time: Typically 8-12 weeks for standard orders
- Minimum Order Quantity: 1 piece
Note: Pricing for the XC3S700A-4FGG484CES may vary based on market conditions, order quantity, and distribution channel. Contact your local Xilinx representative or authorized distributor for the most current pricing and availability information.
Documents & Media
Technical Documentation for XC3S700A-4FGG484CES
Datasheets:
- XC3S700A-4FGG484CES Complete Data Sheet
- Spartan-3A FPGA Family Overview
- DC and AC Switching Characteristics
- Package and Pinout Information
User Guides:
- Spartan-3A FPGA User Guide
- Configuration User Guide
- SelectIO Resources User Guide
- Memory Resources User Guide
Application Notes:
- Power Management Techniques
- High-Speed Design Considerations
- PCB Layout Guidelines for BGA Packages
- Thermal Management Solutions
Design Tools:
- Xilinx ISE Design Suite compatibility
- Xilinx Vivado Design Suite support
- IP Core Generator access
- ChipScope Pro analyzer support
Related Resources
Development Tools and Support for XC3S700A-4FGG484CES
Development Boards:
- Spartan-3A Starter Kit
- Custom evaluation boards featuring XC3S700A-4FGG484CES
- Third-party development platforms
IP Cores and Reference Designs:
- MicroBlaze soft processor compatibility
- PicoBlaze microcontroller support
- Communication interfaces (UART, SPI, I2C)
- Memory controllers and interfaces
Software Tools:
- Xilinx Platform Studio (XPS)
- Software Development Kit (SDK)
- System Generator for DSP
- Embedded Development Kit (EDK)
Technical Support:
- Xilinx Answer Database
- Community forums and user groups
- Professional design services
- Training courses and webinars
Applications for XC3S700A-4FGG484CES
The versatile XC3S700A-4FGG484CES is suitable for various applications including:
- Industrial automation and control systems
- Medical device implementations
- Automotive electronics
- Communications infrastructure
- Test and measurement equipment
- Custom computing solutions
Environmental & Export Classifications
Environmental Compliance
RoHS Compliance: The XC3S700A-4FGG484CES meets RoHS (Restriction of Hazardous Substances) requirements, ensuring environmentally responsible manufacturing and disposal.
Operating Conditions:
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters
Package Environmental Data:
- Moisture Sensitivity Level (MSL): Level 3
- Peak Reflow Temperature: 260ยฐC
- ESD Protection: Human Body Model (HBM) Class 2
Export Control Information
ECCN Classification: The XC3S700A-4FGG484CES falls under Export Control Classification Number (ECCN) 3A001.a.7, subject to Export Administration Regulations (EAR).
Country of Origin: Manufactured in facilities compliant with international quality standards and export regulations.
Compliance Certifications:
- ISO 9001:2015 Quality Management
- ISO 14001:2015 Environmental Management
- IATF 16949:2016 Automotive Quality
Ready to implement the XC3S700A-4FGG484CES in your next project? Contact our technical sales team for detailed specifications, pricing, and design support. Our experts can help you maximize the potential of this powerful FPGA solution while ensuring optimal performance for your specific application requirements.
For the latest updates on XC3S700A-4FGG484CES availability, documentation, and technical support, visit the official Xilinx product page or consult with authorized distributors.
