The XC3S200A-4FTG256CES is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, engineered to deliver exceptional performance for a wide range of digital signal processing and embedded system applications. This versatile FPGA combines cost-effectiveness with robust functionality, making it an ideal choice for engineers developing complex digital circuits.
Product Specifications
The XC3S200A-4FTG256CES features a comprehensive set of specifications designed to meet demanding application requirements:
Core Architecture:
- Logic cells: 200,000 system gates
- Configurable Logic Blocks (CLBs): 1,728 slices
- Block RAM: 216 Kbits total capacity
- Distributed RAM: 54 Kbits
- Digital Clock Manager (DCM) blocks: 4 units
I/O and Package Details:
- Package type: Fine-pitch Ball Grid Array (FTBGA256)
- Total I/O pins: 195 user I/O
- Speed grade: -4 (commercial temperature range)
- Operating voltage: 1.2V core, 3.3V I/O
- Temperature range: 0ยฐC to +85ยฐC (commercial grade)
Performance Characteristics:
- Maximum frequency: Up to 200 MHz
- Low power consumption with advanced power management
- IEEE 1149.1 JTAG boundary scan support
- Multiple I/O standards compatibility including LVTTL, LVCMOS, and differential signaling
The XC3S200A-4FTG256CES incorporates dedicated multipliers and advanced routing architecture, ensuring optimal performance for DSP applications, communications systems, and industrial control solutions.
Price
Pricing for the XC3S200A-4FTG256CES varies based on quantity, supplier, and current market conditions. Typical price ranges include:
- Single unit pricing: $45-65 USD
- Volume pricing (100+ units): $35-50 USD
- Engineering sample availability upon request
For the most current XC3S200A-4FTG256CES pricing and availability, contact authorized Xilinx distributors or visit official electronics component marketplaces. Educational discounts may be available for academic institutions and research projects.
Documents & Media
Essential documentation and resources for the XC3S200A-4FTG256CES include:
Technical Documentation:
- Official datasheet with complete electrical specifications
- Spartan-3A FPGA User Guide with detailed architecture information
- Package and pinout diagrams for FTBGA256 configuration
- DC and switching characteristics specifications
- Configuration and programming guidelines
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- PCB layout guidelines and recommendations
- Thermal management specifications
- Signal integrity considerations for high-speed designs
Software Support:
- Vivado Design Suite support (check compatibility)
- IP core libraries and reference implementations
- Simulation models for popular EDA tools
All XC3S200A-4FTG256CES documentation is available through the official Xilinx website and authorized technical support channels.
Related Resources
Complementary products and resources that enhance XC3S200A-4FTG256CES implementation:
Development Platforms:
- Spartan-3A evaluation boards and starter kits
- Compatible development modules and breakout boards
- Programming cables and configuration devices
Software Tools:
- Xilinx ISE WebPACK (free version available)
- ChipScope Pro for embedded logic analysis
- Third-party synthesis and simulation tools
Technical Support:
- Xilinx community forums and knowledge base
- Application engineering support
- Training materials and webinar series
- Design review services for complex implementations
Ecosystem Components:
- Compatible memory interfaces (DDR, SRAM, Flash)
- Clock generation and distribution solutions
- Power supply design recommendations
- EMC/EMI compliance guidelines
The XC3S200A-4FTG256CES integrates seamlessly with standard development workflows and existing design methodologies.
Environmental & Export Classifications
The XC3S200A-4FTG256CES meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- WEEE directive compliance
- REACH regulation conformity
- Halogen-free package options available
Export Classifications:
- Export Control Classification Number (ECCN): Check current regulations
- Country of origin: Manufactured in approved facilities
- Trade compliance documentation available upon request
Quality Standards:
- ISO 9001 certified manufacturing processes
- Automotive qualification available (contact for AEC-Q100 versions)
- Industrial temperature grade options
- Extended reliability testing and qualification
Environmental Operating Conditions:
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters operational
- Vibration and shock resistance per industry standards
The XC3S200A-4FTG256CES demonstrates Xilinx’s commitment to environmental responsibility while maintaining the highest performance and reliability standards for mission-critical applications.
For detailed environmental specifications and the latest compliance information regarding the XC3S200A-4FTG256CES, consult official Xilinx documentation or contact authorized representatives.
