The XC3S1400A-5FG484C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, engineered to deliver exceptional performance for demanding digital applications. This versatile FPGA combines high logic density with cost-effective implementation, making it an ideal choice for engineers developing complex digital systems.
Product Specifications
The XC3S1400A-5FG484C features robust specifications that meet the requirements of sophisticated digital designs:
Core Architecture:
- Logic cells: 1,400,000 system gates
- Configurable Logic Blocks (CLBs): 8,064 logic cells
- Distributed RAM: 124 Kbits
- Block RAM: 576 Kbits (32 blocks of 18 Kbits each)
- Digital Clock Manager (DCM) blocks: 8 units
I/O and Package Details:
- Package type: FG484 (Fine-pitch Ball Grid Array)
- Total I/O pins: 333 user I/Os
- Speed grade: -5 (high performance)
- Operating voltage: 1.2V core, 2.5V/3.3V I/O
- Package dimensions: 23mm ร 23mm
Performance Characteristics:
- Maximum operating frequency: Up to 200+ MHz
- Low power consumption with advanced power management
- Industrial temperature range: -40ยฐC to +100ยฐC
- Commercial grade available: 0ยฐC to +85ยฐC
The XC3S1400A-5FG484C incorporates Xilinx’s 90nm process technology, ensuring optimal power efficiency while maintaining high-speed operation across various operating conditions.
Price Information
Pricing for the XC3S1400A-5FG484C varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, making this FPGA cost-effective for both prototype development and mass production applications.
Documents & Media
Technical Documentation:
- XC3S1400A-5FG484C datasheet with complete electrical specifications
- Spartan-3A FPGA User Guide covering architecture and design guidelines
- Package and pinout documentation for FG484 BGA package
- Power consumption and thermal management guides
- Design constraint files and timing specifications
Development Resources:
- Reference designs and application notes
- Getting started tutorials for Spartan-3A development
- PCB layout guidelines and design recommendations
- Signal integrity considerations for high-speed designs
Software Tools:
- Compatible with Xilinx ISE Design Suite
- Supported by Vivado Design Suite (legacy support)
- IP core libraries and design examples
- Simulation models and timing libraries
Related Resources
Development Boards:
- Spartan-3A evaluation boards featuring the XC3S1400A-5FG484C
- Starter kits with comprehensive peripherals and interfaces
- Custom development platforms from third-party vendors
Companion Devices:
- Configuration memory options (SPI Flash, Platform Flash)
- Power management ICs optimized for Spartan-3A FPGAs
- Clock generation and distribution components
- Interface transceivers and level translators
Design Services:
- Xilinx Alliance Program partners offering design services
- Training courses and certification programs
- Technical support and design consultation
- Community forums and knowledge base resources
Application Areas: The XC3S1400A-5FG484C excels in communications infrastructure, industrial automation, automotive electronics, medical devices, and aerospace applications where reliable, high-performance programmable logic is essential.
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free package available)
- REACH regulation compliance
- Conflict minerals reporting available
- ISO 14001 environmental management certification
Export Control Information:
- Export Control Classification Number (ECCN): 3A991.a.2
- Country of origin: Various (check specific part marking)
- HTS (Harmonized Tariff Schedule) classification available
- No export license required for most destinations (verify current regulations)
Quality and Reliability:
- Automotive qualification available (XQR versions)
- Military and aerospace grades offered
- Extended temperature range options
- Comprehensive quality assurance and testing procedures
Package and Handling:
- Moisture sensitivity level (MSL): Level 3
- Electrostatic discharge (ESD) sensitive device
- Proper handling and storage procedures required
- Tape and reel packaging available for automated assembly
The XC3S1400A-5FG484C represents a proven solution for designers requiring high-performance FPGA capabilities with reliable supply chain support. Its combination of logic density, I/O flexibility, and robust design features makes it suitable for a wide range of applications from prototyping through volume production.
For the most current technical specifications, pricing, and availability information for the XC3S1400A-5FG484C, consult with authorized Xilinx distributors or visit the official Xilinx product documentation portal.
