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XC3S200A-FTG256AGQ: High-Performance Spartan-3A FPGA for Embedded Applications

Original price was: $20.00.Current price is: $19.00.

The XC3S200A-FTG256AGQ is a versatile field-programmable gate array (FPGA) from Xilinx’s Spartan-3A family, designed to deliver exceptional performance and flexibility for cost-sensitive applications. This automotive-grade device combines advanced programmable logic capabilities with robust reliability standards, making it an ideal choice for industrial, automotive, and consumer electronics applications.

Product Specifications

The XC3S200A-FTG256AGQ features a comprehensive set of specifications that make it suitable for demanding embedded applications:

Logic Resources:

  • 200,000 system gates equivalent
  • 4,320 logic cells with enhanced functionality
  • 216 configurable logic blocks (CLBs)
  • 432 slices for maximum design flexibility

Memory Architecture:

  • 12 dedicated block RAM modules
  • Total block RAM capacity of 216 Kbits
  • Distributed RAM capability using LUTs
  • Support for various memory configurations

I/O Capabilities:

  • 172 user I/O pins in FTG256 package
  • Multiple I/O standards support including LVTTL, LVCMOS, and differential signaling
  • Advanced I/O features with programmable drive strength
  • Hot-swappable I/O support for system reliability

Package Details:

  • FTG256 Fine-Pitch Ball Grid Array (FBGA) package
  • 256-pin configuration with 17mm x 17mm footprint
  • RoHS compliant lead-free package construction
  • Automotive-grade qualification (AGQ) for extended temperature operation

Pricing Information

The XC3S200A-FTG256AGQ pricing varies based on quantity, distribution channel, and market conditions. Contact authorized Xilinx distributors for current pricing and availability information. Volume discounts are typically available for production quantities, making this FPGA cost-effective for both prototyping and high-volume manufacturing applications.

Factors affecting XC3S200A-FTG256AGQ pricing include:

  • Order quantity and volume commitments
  • Lead times and inventory availability
  • Regional market variations
  • Support and development tool requirements

Documents & Media

Comprehensive documentation and support materials are available for the XC3S200A-FTG256AGQ:

Technical Documentation:

  • Complete datasheet with electrical specifications and timing parameters
  • Package and pinout documentation for FTG256 configuration
  • Application notes covering design best practices and implementation guidance
  • Reference designs and example projects for rapid development

Development Resources:

  • Xilinx ISE Design Suite compatibility for design entry and implementation
  • Timing analysis and simulation support tools
  • Programming and configuration utilities
  • Debug and verification resources

Design Files:

  • IBIS models for signal integrity analysis
  • Package footprint files for PCB layout
  • 3D mechanical models for thermal and mechanical analysis
  • Constraint files and templates for common applications

Related Resources

The XC3S200A-FTG256AGQ ecosystem includes various complementary products and resources:

Development Boards:

  • Spartan-3A evaluation boards featuring the XC3S200A device
  • Starter kits with comprehensive tutorials and example designs
  • Third-party development platforms and modules

Compatible Devices:

  • Other Spartan-3A family members for scalable design options
  • Configuration memory devices for system boot and reconfiguration
  • Power management solutions optimized for FPGA applications

Software Tools:

  • Xilinx ISE WebPACK free development environment
  • Third-party synthesis and simulation tools
  • IP core libraries and reference designs

Support Services:

  • Technical support and design consultation
  • Training programs and certification courses
  • Community forums and knowledge base access

Environmental & Export Classifications

The XC3S200A-FTG256AGQ meets stringent environmental and regulatory requirements:

Environmental Compliance:

  • RoHS compliant construction with lead-free materials
  • REACH regulation compliance for chemical safety
  • Conflict minerals reporting compliance
  • Environmental impact assessment available

Operating Conditions:

  • Automotive-grade temperature range: -40ยฐC to +125ยฐC junction temperature
  • Extended voltage tolerance for harsh environment operation
  • Enhanced reliability testing for automotive applications
  • Qualification standards meeting AEC-Q100 requirements

Export Classifications:

  • Export Control Classification Number (ECCN) designation
  • International traffic in arms regulations (ITAR) status
  • Regional export licensing requirements vary by destination
  • Consultation recommended for specific export applications

Quality Standards:

  • ISO/TS 16949 automotive quality management compliance
  • Statistical quality control and reliability testing
  • Failure analysis and quality reporting available
  • Long-term supply commitment for automotive applications

The XC3S200A-FTG256AGQ represents an excellent balance of performance, cost-effectiveness, and reliability for modern FPGA applications. Its automotive-grade qualification and comprehensive support ecosystem make it particularly well-suited for demanding applications requiring proven reliability and long-term availability.