The XC3S200AN-5FT256C is a versatile and cost-effective Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for a wide range of embedded system applications. This advanced FPGA combines programmable logic, integrated memory, and flexible I/O capabilities in a compact 256-ball Fine-Pitch Ball Grid Array (FTBGA) package.
Product Specifications
The XC3S200AN-5FT256C offers robust technical specifications that make it ideal for demanding applications:
Logic Resources:
- 200,000 system gates capacity
- 4,320 logic cells with 4-input lookup tables (LUTs)
- 8,640 equivalent logic gates
- Distributed RAM: 60 Kb
- Block RAM: 216 Kb (12 blocks of 18 Kb each)
Memory and Storage:
- Integrated non-volatile configuration memory
- In-System Programming (ISP) capability
- Multi-boot configuration support
- Enhanced security features with bitstream encryption
I/O and Connectivity:
- 173 user I/O pins
- Multiple I/O standards support including LVTTL, LVCMOS, SSTL, and HSTL
- High-speed differential signaling capabilities
- Flexible pin assignment and routing
Performance Characteristics:
- Speed grade: -5 (high performance)
- Operating frequency up to 326 MHz
- Low power consumption with multiple power management modes
- Operating temperature range: 0ยฐC to +85ยฐC (commercial grade)
Package Details:
- FT256 Fine-Pitch Ball Grid Array package
- 256-ball configuration with 1.0mm ball pitch
- Compact 17mm ร 17mm footprint
- RoHS compliant lead-free package
Price Information
The XC3S200AN-5FT256C is competitively priced for volume applications, with pricing varying based on order quantity and market conditions. For current pricing and availability:
- Contact authorized Xilinx distributors for volume pricing
- Educational discounts available for qualifying institutions
- Development kit bundles offered at reduced rates
- Consult with regional sales representatives for custom pricing options
Typical lead times range from 12-16 weeks for standard orders, with expedited options available for urgent requirements.
Documents & Media
Comprehensive technical documentation and support materials are available for the XC3S200AN-5FT256C:
Technical Documentation:
- Complete datasheet with electrical specifications and timing parameters
- Reference manual detailing architecture and programming guidelines
- Application notes covering design best practices and implementation examples
- Errata documents highlighting known issues and workarounds
Design Tools and Software:
- ISE Design Suite compatibility for development and synthesis
- ChipScope Pro for real-time debugging and analysis
- IP core libraries and reference designs
- Simulation models for popular EDA tools
Development Resources:
- Evaluation boards and starter kits
- Hardware debugging tools and adapters
- Video tutorials and webinar recordings
- Community forums and technical support channels
Related Resources
The XC3S200AN-5FT256C integrates seamlessly with Xilinx’s broader ecosystem of development tools and complementary products:
Compatible Development Platforms:
- Spartan-3AN Starter Kit for rapid prototyping
- Platform Flash configuration devices
- JTAG programming cables and adapters
- Third-party evaluation and development boards
Software and IP Solutions:
- MicroBlaze soft processor core for embedded processing
- DSP and communication IP cores
- Interface controllers for popular protocols
- Reference designs for common applications
Technical Support:
- Xilinx Answer Database with searchable solutions
- Application engineering support services
- Training courses and certification programs
- Partner ecosystem for specialized design services
Environmental & Export Classifications
The XC3S200AN-5FT256C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant with lead-free manufacturing
- REACH regulation compliance for European markets
- Conflict minerals reporting and supply chain transparency
- ISO 14001 certified manufacturing processes
Quality and Reliability:
- Automotive-grade versions available (XA series)
- Extended temperature range options for industrial applications
- Radiation-tolerant variants for aerospace applications
- Comprehensive quality assurance and testing procedures
Export Classifications:
- Export Control Classification Number (ECCN) designation
- International Traffic in Arms Regulations (ITAR) compliance where applicable
- Country-specific import/export documentation requirements
- Authorized distributor network for controlled regions
Packaging and Shipping:
- Anti-static packaging for component protection
- Moisture sensitivity level classification
- Traceability documentation and certificates of compliance
- Global logistics support with regional distribution centers
The XC3S200AN-5FT256C represents an excellent balance of performance, cost-effectiveness, and design flexibility, making it an ideal choice for engineers developing next-generation embedded systems across automotive, industrial, communications, and consumer electronics markets.
