The XC3S400A-4FGG320C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-3A family, designed to deliver exceptional value for cost-sensitive applications. This versatile FPGA combines advanced features with competitive pricing, making it an ideal choice for digital signal processing, embedded processing, and general-purpose logic applications.
Product Specifications
The XC3S400A-4FGG320C offers robust performance characteristics that meet demanding application requirements:
Core Architecture:
- Logic Cells: 8,064 system gates
- CLB Array: 22 x 22 Configurable Logic Blocks
- Total CLBs: 896
- Slices: 3,584 (4 slices per CLB)
- Flip-Flops: 7,168
- 4-input LUTs: 7,168
Memory Resources:
- Block RAM: 360 Kbits total
- Block RAM Blocks: 20
- Distributed RAM: 112 Kbits
I/O and Connectivity:
- User I/O Pins: 221
- Differential I/O Pairs: 92
- Digital Clock Manager (DCM): 4 units
- Maximum User I/O Banks: 8
Performance Specifications:
- Speed Grade: -4 (standard performance)
- Operating Temperature: Commercial (0ยฐC to +85ยฐC)
- Package Type: FGG320 (320-pin Fine-Pitch Ball Grid Array)
- Package Dimensions: 17mm x 17mm
Power and Voltage:
- Core Voltage (VCCINT): 1.2V ยฑ5%
- I/O Voltage (VCCAUX): 2.5V ยฑ5%
- Configuration Voltage: 3.3V or 2.5V
- Low power consumption design
Pricing Information
The XC3S400A-4FGG320C offers competitive pricing for mid-range FPGA applications. Pricing varies based on quantity, distributor, and market conditions. For current pricing information:
- Contact authorized Xilinx distributors
- Request quotes for volume purchases
- Consider development kit bundles for evaluation
- Educational discounts may be available for academic institutions
Typical applications benefit from the optimal price-to-performance ratio that the XC3S400A-4FGG320C provides in the Spartan-3A family.
Documents & Media
Essential Documentation:
- Datasheet: Complete electrical and timing specifications for the XC3S400A-4FGG320C
- User Guide: Spartan-3A FPGA Family Complete Data Sheet
- Package Information: FGG320 package specifications and pinout diagrams
- Application Notes: Design guidelines and best practices
- Errata: Known issues and workarounds
Development Resources:
- ISE Design Suite: Compatible development environment
- Reference Designs: Example projects and IP cores
- Timing Models: For accurate timing analysis
- IBIS Models: For signal integrity simulation
Technical Support Materials:
- Migration Guides: Upgrading from previous FPGA families
- Power Estimation Tools: For thermal and power analysis
- Configuration Guides: Programming and configuration options
Related Resources
Development Tools:
- Xilinx ISE WebPACK (free development software)
- ChipScope Pro Analyzer for debugging
- System Generator for DSP applications
- Platform Studio for embedded processor systems
Evaluation Platforms:
- Spartan-3A Starter Kit featuring the XC3S400A-4FGG320C
- Custom development boards from third-party vendors
- Educational development platforms
IP Cores and Libraries:
- Xilinx LogiCORE IP for common functions
- Third-party IP solutions
- Open-source FPGA libraries
- DSP and communication IP blocks
Community Support:
- Xilinx Community Forums
- Design tutorials and examples
- University program resources
- Technical webinars and training materials
Environmental & Export Classifications
Environmental Compliance: The XC3S400A-4FGG320C meets stringent environmental standards:
- RoHS compliant (lead-free)
- REACH regulation compliant
- Halogen-free package options available
- Green package marking for environmental identification
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Industrial temperature variants available
- Humidity: 10% to 85% non-condensing
- Altitude: Up to 2000 meters
Export Control Classification:
- ECCN (Export Control Classification Number): Varies by destination
- Country-specific export restrictions may apply
- Consult current export control regulations
- Some applications may require export licenses
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive qualification available (selected grades)
- Military/aerospace screening options
- Long-term supply commitment
Package Materials:
- Lead-free solder ball attachment
- Moisture sensitivity level (MSL): Level 3
- ESD protection: HBM > 2000V, MM > 200V
- Latch-up immunity: > 100mA
The XC3S400A-4FGG320C represents an excellent balance of features, performance, and cost-effectiveness for FPGA-based designs. Its comprehensive feature set and extensive support ecosystem make it suitable for a wide range of applications, from educational projects to commercial products requiring reliable, field-programmable logic solutions.
