“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC3S400A-5FTG256C: High-Performance Spartan-3A FPGA for Advanced Digital Design

Original price was: $20.00.Current price is: $19.00.

The XC3S400A-5FTG256C is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3A family, engineered to deliver exceptional performance for demanding digital applications. This versatile FPGA combines advanced processing capabilities with cost-effective design, making it an ideal choice for engineers and developers working on complex digital systems.

Product Specifications

The XC3S400A-5FTG256C features robust specifications that set it apart in the competitive FPGA market:

Core Architecture:

  • System gates: 400,000 gates providing extensive logic capacity
  • Logic cells: 8,064 configurable logic blocks for flexible design implementation
  • Distributed RAM: 112 Kbits for efficient data storage and processing
  • Block RAM: 360 Kbits organized in dual-port configuration

Memory and Processing:

  • 18 dedicated multiplier blocks for high-speed arithmetic operations
  • Maximum user I/O: 195 pins supporting various interface standards
  • Speed grade: -5 offering optimized performance-to-power ratio
  • Supply voltage: 1.2V core with 3.3V I/O compatibility

Package Details:

  • Package type: FTBGA (Fine-pitch Ball Grid Array)
  • Pin count: 256 pins in compact 17mm x 17mm form factor
  • Operating temperature range: 0ยฐC to +85ยฐC (commercial grade)
  • Advanced flip-chip packaging technology for enhanced thermal performance

Price

The XC3S400A-5FTG256C offers competitive pricing in the mid-range FPGA segment. Pricing varies based on quantity, with volume discounts available for large-scale production requirements. Contact authorized Xilinx distributors for current pricing and availability, as market conditions may affect final costs. Educational discounts and development kit bundles are often available for academic and research institutions.

Documents & Media

Technical Documentation:

  • Complete datasheet with electrical characteristics and timing specifications
  • Configuration user guide detailing programming procedures
  • Package and pinout diagrams for PCB layout design
  • Application notes covering common implementation scenarios

Development Resources:

  • Reference designs and example projects
  • Constraint files and UCF templates
  • Power estimation spreadsheets and thermal analysis tools
  • ISE Design Suite compatibility documentation

Video Content:

  • Product overview and feature highlights
  • Design flow tutorials and best practices
  • Troubleshooting guides and common pitfalls
  • Webinar recordings on advanced implementation techniques

Related Resources

Development Tools:

  • Xilinx ISE Design Suite supporting complete design flow from synthesis to bitstream generation
  • ChipScope Pro analyzer for real-time debugging and verification
  • PlanAhead design planning tool for floorplanning and constraint management
  • ModelSim simulation environment for comprehensive design verification

Evaluation Platforms:

  • Spartan-3A starter kits featuring the XC3S400A-5FTG256C
  • Development boards with peripheral interfaces and expansion connectors
  • Reference designs demonstrating key application areas
  • Third-party modules and IP cores compatible with Spartan-3A architecture

Support Community:

  • Xilinx forums and technical support channels
  • Application engineering assistance for complex design challenges
  • Training courses and certification programs
  • Partner ecosystem including design services and specialized tools

Environmental & Export Classifications

Environmental Compliance: The XC3S400A-5FTG256C meets stringent environmental standards including RoHS compliance, ensuring lead-free manufacturing processes. The device is manufactured using environmentally responsible methods and materials, supporting sustainable electronics design practices.

Export Classifications:

  • ECCN (Export Control Classification Number): 3A001.a.2
  • HTS (Harmonized Tariff Schedule): 8542.31.0001
  • Country of origin: Various (manufactured in Xilinx-qualified facilities)
  • Export licensing requirements may apply for certain destinations

Quality and Reliability:

  • Automotive-qualified versions available for harsh environment applications
  • Extended temperature range variants for industrial applications
  • Comprehensive quality assurance testing including burn-in and environmental stress screening
  • Long-term supply commitment ensuring availability for production lifecycles

The XC3S400A-5FTG256C represents an excellent balance of performance, features, and cost-effectiveness, making it suitable for applications ranging from industrial automation and telecommunications to consumer electronics and automotive systems. Its proven architecture and extensive support ecosystem ensure successful project implementation and long-term reliability.