The XC3S400AN-4FGG400I is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance and flexibility for embedded system applications. This automotive-grade FPGA combines advanced processing capabilities with robust reliability, making it an ideal choice for demanding industrial and automotive environments.
Product Specifications
The XC3S400AN-4FGG400I features comprehensive specifications that set it apart in the FPGA market:
Core Architecture:
- Logic Cells: 8,064 cells providing extensive programmable logic capacity
- System Gates: 400,000 gates for complex digital design implementation
- Block RAM: 360 Kbits of dedicated memory for data storage and buffering
- Distributed RAM: 56 Kbits for flexible memory applications
I/O and Connectivity:
- User I/O: 264 pins for extensive external interface capabilities
- Package Type: FBGA (Fine-pitch Ball Grid Array) with 400 pins
- Speed Grade: -4 offering optimized performance timing
- Operating Voltage: 1.2V core with 3.3V I/O compatibility
Processing Features:
- 18 dedicated multipliers for efficient DSP operations
- 4 Digital Clock Managers (DCMs) for flexible clock management
- Multiple clock domains support for complex timing requirements
- Advanced routing architecture for optimal signal integrity
Temperature and Reliability:
- Industrial temperature range: -40ยฐC to +100ยฐC
- Automotive-grade qualification (AN designation)
- Enhanced reliability for mission-critical applications
Pricing Information
The XC3S400AN-4FGG400I pricing varies based on quantity and supplier. Typical pricing ranges from $45-85 per unit for standard quantities, with volume discounts available for orders exceeding 1,000 pieces. Contact authorized Xilinx distributors for current pricing and availability, as semiconductor market conditions may affect pricing structures.
Documents & Media
Essential documentation for the XC3S400AN-4FGG400I includes:
Technical Documentation:
- Spartan-3AN FPGA Family Data Sheet containing detailed electrical specifications
- User Guide with comprehensive design implementation guidelines
- Package and Pinout specifications for PCB design requirements
- Application Notes covering best practices and design examples
Design Resources:
- Reference designs and example projects
- Timing and power consumption analysis reports
- PCB layout guidelines and recommendations
- Simulation models and behavioral descriptions
Software Support:
- Xilinx ISE Design Suite compatibility information
- Programming and configuration guides
- Debugging and verification methodologies
Related Resources
The XC3S400AN-4FGG400I ecosystem includes numerous supporting components and tools:
Development Tools:
- Xilinx ISE WebPACK (free version) for basic development
- ChipScope Pro for advanced debugging capabilities
- ModelSim simulation environment integration
Compatible Products:
- Spartan-3AN family variants for scalable solutions
- Configuration memory devices (SPI Flash, PROM)
- Power management ICs optimized for FPGA applications
- Clock generation and distribution components
Evaluation Platforms:
- Spartan-3AN Starter Kit for rapid prototyping
- Third-party development boards featuring the XC3S400AN-4FGG400I
- Reference design platforms for specific applications
Environmental & Export Classifications
The XC3S400AN-4FGG400I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for European markets
- Halogen-free materials meeting environmental sustainability requirements
- Conflict minerals compliance documentation available
Export Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- Country of Origin: Varies by manufacturing location
- HTS Code: 8542.33.0001 for customs classification
Quality Standards:
- ISO 9001 certified manufacturing processes
- Automotive qualification standards (AEC-Q100 Grade 2)
- Military temperature range capability
- Extended product lifecycle support commitment
Reliability Testing:
- JEDEC standard compliance for semiconductor reliability
- Accelerated aging and stress testing validation
- Electrostatic discharge (ESD) protection ratings
- Electromagnetic compatibility (EMC) certification
The XC3S400AN-4FGG400I represents a comprehensive FPGA solution combining high performance, reliability, and extensive design flexibility. Its automotive-grade qualification and robust feature set make it suitable for applications ranging from industrial automation to automotive electronics, providing designers with the tools needed for successful product development in demanding environments.
