Product Specification
The XC3S700A-4FG400C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A series, designed to deliver exceptional performance for cost-sensitive applications. This advanced programmable logic device features 700,000 system gates and operates at commercial temperature ranges, making it ideal for a wide range of digital design projects.
Key Technical Specifications:
- System Gates: 700,000 gates providing substantial logic capacity
- Logic Cells: 13,248 equivalent logic cells for complex digital implementations
- Block RAM: 360 Kbits of distributed RAM for efficient data storage
- Package Type: FG400 – Fine-pitch Ball Grid Array with 400 pins
- Speed Grade: -4 (standard performance grade)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Supply Voltage: Multiple voltage rails (1.2V core, 2.5V/3.3V I/O)
- I/O Standards: Support for multiple I/O standards including LVTTL, LVCMOS, LVDS
The XC3S700A-4FG400C incorporates advanced features such as dedicated multipliers, phase-locked loops (PLLs), and Digital Clock Manager (DCM) blocks, enabling designers to implement sophisticated digital signal processing and clock management functions efficiently.
Price
The XC3S700A-4FG400C is competitively priced to provide excellent value for medium-density FPGA applications. Pricing varies based on quantity, with significant volume discounts available:
- Unit Price (1-99 pieces): Contact authorized distributors for current pricing
- Volume Pricing (100+ pieces): Substantial discounts available for production quantities
- Engineering Samples: Available for qualified design projects
For the most current XC3S700A-4FG400C pricing and availability, contact authorized Xilinx distributors or visit official electronics component suppliers. Prices may vary based on market conditions, packaging options, and order quantities.
Documents & Media
Technical Documentation:
- XC3S700A-4FG400C Datasheet: Complete electrical and timing specifications
- Spartan-3A Family User Guide: Comprehensive design and implementation guide
- Package and Pinout Information: FG400 package details and pin assignments
- Power Consumption Guidelines: Thermal management and power estimation tools
- Migration Guide: Information for upgrading from previous Spartan generations
Design Resources:
- Reference Designs: Pre-verified IP cores and example projects
- Application Notes: Best practices for XC3S700A-4FG400C implementation
- Simulation Models: VHDL and Verilog models for design verification
- Constraint Files: UCF templates for common design scenarios
Software Tools:
- ISE Design Suite: Complete development environment for XC3S700A-4FG400C
- ChipScope Pro: Hardware debugging and verification tools
- XPower Analyzer: Power consumption analysis and optimization
Related Resources
Development Boards:
- Spartan-3A Starter Kit: Ideal platform for XC3S700A-4FG400C evaluation
- Custom Development Boards: Third-party boards featuring the XC3S700A-4FG400C
- Expansion Modules: Compatible peripherals and interface boards
Complementary Products:
- Configuration Devices: Platform Flash PROMs for XC3S700A-4FG400C configuration
- Power Management ICs: Optimized power solutions for Spartan-3A designs
- Clock Generation: Crystal oscillators and clock distribution devices
Design Services:
- Xilinx Alliance Partners: Certified design service providers
- Training Programs: FPGA design courses and certification programs
- Technical Support: Application engineering assistance and design reviews
Community Resources:
- Xilinx Forums: Community-driven support and knowledge sharing
- University Program: Academic resources and educational materials
- Open Source Projects: Community-developed IP and reference designs
Environmental & Export Classifications
Environmental Compliance:
The XC3S700A-4FG400C meets stringent environmental standards and regulations:
- RoHS Compliant: Lead-free package options available
- REACH Compliant: Meets European chemical safety regulations
- Halogen-Free: Available in halogen-free package variants
- Green Package: Environmentally friendly packaging materials
Operating Environment:
- Temperature Range: Commercial grade (0ยฐC to +85ยฐC ambient)
- Humidity: Up to 85% relative humidity (non-condensing)
- Altitude: Operational up to 2000 meters above sea level
- Vibration/Shock: Meets JEDEC standards for electronic components
Export Classifications:
- Export Control Classification Number (ECCN): 3A001.a.7
- HTS Code: 8542.33.0001
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to applicable export control regulations
Quality Standards:
- ISO 9001: Manufactured under certified quality management systems
- Automotive Grade: AEC-Q100 qualified variants available for automotive applications
- Military/Aerospace: Extended temperature and radiation-tolerant versions available
The XC3S700A-4FG400C undergoes comprehensive testing and qualification processes to ensure reliable operation across its specified environmental conditions, making it suitable for industrial, telecommunications, and consumer electronics applications requiring robust performance and long-term reliability.
For additional technical support, documentation, or purchasing information regarding the XC3S700A-4FG400C, consult with authorized Xilinx distributors or visit the official Xilinx website for the most current product information and resources.
