The XC3S700A-4FG400I is a powerful FPGA (Field Programmable Gate Array) from Xilinx’s acclaimed Spartan-3 family, designed to deliver exceptional performance for embedded system applications. This advanced programmable logic device combines high gate density with cost-effective pricing, making it an ideal choice for digital signal processing, communications, and industrial control applications.
Product Specifications
The XC3S700A-4FG400I offers robust technical specifications that meet demanding design requirements:
Core Architecture:
- Logic Cells: 13,824 system gates providing extensive programmable logic capacity
- Distributed RAM: 216 Kb for flexible memory implementation
- Block RAM: 360 Kb organized in dual-port configuration
- Multipliers: 20 dedicated 18×18 hardware multipliers for DSP applications
I/O and Connectivity:
- User I/O Pins: 264 configurable input/output pins
- Package Type: FG400 Fine-pitch Ball Grid Array (BGA)
- Operating Voltage: 1.2V core, 3.3V I/O
- Speed Grade: -4 (industrial temperature range)
- Temperature Range: -40ยฐC to +100ยฐC (Industrial grade)
Advanced Features:
- Clock Management: Up to 8 Digital Clock Managers (DCMs) for precise timing control
- Configuration Memory: In-system programmable Flash memory
- Power Management: Low-power CMOS technology with multiple power-down modes
Pricing Information
The XC3S700A-4FG400I typically ranges from $45 to $85 per unit, depending on quantity and supplier. Volume pricing is available for orders exceeding 100 pieces, with significant discounts for production quantities above 1,000 units. Contact authorized Xilinx distributors for current pricing and availability, as semiconductor prices fluctuate based on market conditions and supply chain factors.
Documents & Media
Essential documentation for the XC3S700A-4FG400I includes:
Technical Documentation:
- Complete datasheet with electrical characteristics and timing specifications
- Spartan-3 FPGA Family User Guide detailing architecture and features
- Package and pinout diagrams for PCB design integration
- Programming and configuration guidelines
Design Resources:
- ISE Design Suite compatibility information and installation guidelines
- Reference designs and application notes for common implementations
- Constraint files and UCF templates for development acceleration
- Migration guides from other FPGA families
Software Tools:
- Xilinx ISE WebPACK (free version) supporting the XC3S700A-4FG400I
- ChipScope Pro analyzer for embedded debugging capabilities
- ModelSim simulation software compatibility information
Related Resources
The XC3S700A-4FG400I ecosystem includes numerous complementary products and resources:
Development Boards:
- Spartan-3 Starter Kit featuring the XC3S700A-4FG400I
- Third-party evaluation boards with pre-configured peripherals
- Custom development platforms from various manufacturers
Compatible Components:
- Memory interfaces supporting DDR, SRAM, and Flash memory types
- High-speed transceivers for communication protocols
- Power management solutions optimized for Spartan-3 FPGAs
Design Services:
- Authorized design partners offering implementation services
- Training programs and workshops for FPGA development
- Technical support through Xilinx community forums and documentation
Software Ecosystem:
- IP core libraries for common functions like processors and interfaces
- Third-party development tools and debugging solutions
- Open-source projects and community-contributed designs
Environmental & Export Classifications
The XC3S700A-4FG400I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant with lead-free manufacturing processes
- REACH regulation compliance for European markets
- Conflict minerals reporting in accordance with SEC regulations
- ISO 14001 environmental management system certification
Export Classifications:
- Export Control Classification Number (ECCN): 3A991.a.2
- Harmonized Tariff Schedule (HTS): 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Export licensing requirements may apply for certain destinations
Quality Standards:
- Automotive qualification available (AEC-Q100 Grade 2)
- Industrial temperature range operation (-40ยฐC to +100ยฐC)
- JEDEC standard compliance for reliability testing
- Six Sigma quality processes throughout manufacturing
Package Information:
- Moisture sensitivity level: MSL-3 requiring careful handling
- Lead-free package construction meeting environmental standards
- Halogen-free materials available upon request
- Recyclable packaging materials used for shipping
The XC3S700A-4FG400I represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its comprehensive feature set, robust documentation, and extensive ecosystem support make it a reliable choice for both prototype development and volume production applications across various industries including telecommunications, industrial automation, and consumer electronics.
