The XC3S700A-4FTG256I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for cost-sensitive applications. This versatile programmable logic device combines advanced features with reliable operation, making it an ideal choice for digital signal processing, embedded systems, and communication applications.
Product Specifications
The XC3S700A-4FTG256I offers impressive technical capabilities in a compact package:
Core Features:
- Logic Cells: 13,248 equivalent logic cells providing substantial processing power
- System Gates: 700,000 system gates for complex digital designs
- Block RAM: 360 Kbits of distributed RAM for efficient data storage
- Multipliers: 20 dedicated 18×18 multipliers for high-speed arithmetic operations
- Maximum User I/O: 195 pins for extensive connectivity options
Package and Operating Conditions:
- Package Type: 256-pin Fine-Pitch Ball Grid Array (FTBGA)
- Speed Grade: -4 (commercial temperature range)
- Operating Temperature: -40ยฐC to +100ยฐC industrial grade
- Supply Voltage: 1.2V core, 3.3V I/O
- Package Dimensions: 17mm x 17mm footprint
Performance Characteristics:
- Maximum Frequency: Up to 326 MHz system performance
- Power Consumption: Optimized for low-power applications
- Configuration: SRAM-based configuration with multiple programming options
Price Information
The XC3S700A-4FTG256I pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Prices typically range from $15-30 USD per unit in moderate quantities, with significant savings available for high-volume purchases.
Documents & Media
Technical Documentation:
- Official Xilinx Spartan-3A Family Data Sheet (DS529)
- XC3S700A-4FTG256I Product Brief and Selection Guide
- Package and Pinout Information (256-FTBGA)
- AC/DC Characteristics and Timing Specifications
- Configuration User Guide and Programming Instructions
Design Resources:
- Vivado Design Suite compatibility information
- ISE Design Suite 14.7 project templates
- Reference designs and application notes
- FPGA development board schematics featuring the XC3S700A-4FTG256I
Software Tools:
- Xilinx Vivado Design Suite (recommended)
- Legacy ISE Design Suite support
- ChipScope Pro debugging tools compatibility
- Third-party synthesis tool support documentation
Related Resources
Development Platforms:
- Spartan-3A Evaluation Kit featuring XC3S700A devices
- Compatible development boards from third-party manufacturers
- Breadboard-friendly breakout modules for prototyping
Complementary Products:
- XC3S400A-4FTG256I (smaller capacity alternative)
- XC3S1400A-4FTG256I (higher capacity option)
- Compatible configuration memory devices (Platform Flash)
- Recommended power management ICs and support components
Application Areas:
- Digital signal processing and filtering applications
- Embedded system control and interface logic
- Communication protocol implementation
- Industrial automation and control systems
- Automotive electronics and driver assistance systems
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Lead-free package meets RoHS 2011/65/EU requirements
- REACH Regulation: Compliant with EU REACH substance restrictions
- Conflict Minerals: Sourced responsibly per Dodd-Frank Act requirements
Export Control Information:
- ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
- Country of Origin: Manufactured in certified facilities
- Export License: May require export license for certain destinations
Quality and Reliability:
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Temperature: -40ยฐC to +100ยฐC operating range
- Quality Standards: ISO 9001 certified manufacturing processes
- Reliability Testing: Comprehensive qualification per JEDEC standards
The XC3S700A-4FTG256I represents an excellent balance of performance, features, and cost-effectiveness for demanding FPGA applications. Its robust feature set and industrial-grade reliability make it suitable for both prototyping and volume production requirements across diverse industries.
