The XC3S700A-5FGG400C is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-3A family, designed to deliver exceptional performance for cost-sensitive applications. This versatile FPGA combines advanced features with competitive pricing, making it an ideal choice for digital signal processing, embedded processing, and system integration projects.
Product Specifications
The XC3S700A-5FGG400C offers robust specifications that meet demanding application requirements:
Core Architecture:
- Logic Cells: 13,248 equivalent gates providing ample processing capability
- Configurable Logic Blocks (CLBs): 1,472 CLBs for flexible digital logic implementation
- Block RAM: 360 Kbits of embedded memory for data storage and buffering
- Dedicated Multipliers: 20 embedded 18×18 multipliers for high-speed arithmetic operations
Memory and I/O Features:
- User I/O Pins: 372 configurable I/O pins supporting various voltage standards
- Package Type: 400-pin Fine-Pitch Ball Grid Array (FBGA) for compact board designs
- Speed Grade: -5 speed grade ensuring optimal timing performance
- Operating Voltage: 1.2V core voltage with 3.3V I/O compatibility
Performance Characteristics:
- Maximum Frequency: Up to 300+ MHz system clock performance
- Power Consumption: Optimized for low-power applications
- Temperature Range: Commercial grade operation (0ยฐC to +85ยฐC)
Pricing Information
The XC3S700A-5FGG400C offers competitive pricing in the mid-range FPGA market segment. Pricing varies based on order quantity and distributor:
- Single Unit Price: Contact authorized distributors for current pricing
- Volume Pricing: Significant discounts available for quantities of 100+ units
- Evaluation Options: Development boards and evaluation kits available separately
For the most current XC3S700A-5FGG400C pricing and availability, consult authorized Xilinx distributors including Digi-Key, Mouser Electronics, and Arrow Electronics.
Documents & Media
Comprehensive documentation supports XC3S700A-5FGG400C implementation and development:
Technical Documentation:
- Datasheet: Complete electrical and timing specifications
- User Guide: Detailed architecture overview and design guidelines
- Package Information: Pin assignments and mechanical drawings
- Application Notes: Design best practices and implementation examples
Development Resources:
- Vivado Design Suite: Integrated development environment for FPGA design
- IP Core Libraries: Pre-verified intellectual property blocks
- Reference Designs: Example implementations for common applications
- Simulation Models: VHDL and Verilog behavioral models
Support Materials:
- Errata Documents: Known issues and workarounds
- Migration Guides: Upgrade paths from previous FPGA families
- Training Materials: Online courses and webinars
Related Resources
The XC3S700A-5FGG400C ecosystem includes numerous complementary products and resources:
Development Platforms:
- Spartan-3A Evaluation Boards: Ready-to-use development platforms
- Starter Kits: Entry-level development solutions with tutorials
- Custom Carrier Boards: Third-party development platforms
Compatible Components:
- Configuration Memory: SPI Flash and PROM devices for FPGA configuration
- Power Management: Switching regulators optimized for Spartan-3A FPGAs
- Oscillators: Clock sources meeting FPGA timing requirements
Software Tools:
- ISE Design Suite: Legacy development environment (still supported)
- ChipScope Pro: Integrated logic analyzer for debugging
- EDK/SDK: Embedded development kit for processor integration
Community Resources:
- Xilinx Forums: Technical support and user community
- Application Libraries: Open-source designs and IP cores
- Third-Party Tools: EDA tool compatibility and extensions
Environmental & Export Classifications
The XC3S700A-5FGG400C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process meeting EU directives
- REACH Compliance: Conforms to European chemical safety regulations
- Conflict Minerals: Certified conflict-free material sourcing
- Green Packaging: Recyclable packaging materials
Export Control Classifications:
- ECCN: Export Control Classification Number available upon request
- Country of Origin: Manufactured in approved facilities
- Export Restrictions: Standard semiconductor export guidelines apply
- Documentation: Export compliance certificates available
Quality Standards:
- ISO 9001: Manufacturing quality management certification
- Automotive Grade: Industrial temperature range options available
- Reliability Testing: JEDEC standard qualification testing
- Traceability: Full manufacturing lot traceability maintained
Operating Environment:
- Temperature Range: 0ยฐC to +85ยฐC commercial grade operation
- Humidity: Up to 85% relative humidity non-condensing
- Storage Temperature: -65ยฐC to +150ยฐC
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested
The XC3S700A-5FGG400C represents an excellent balance of performance, features, and cost-effectiveness for mid-range FPGA applications. Its comprehensive ecosystem support and proven reliability make it a dependable choice for both prototyping and production deployments across diverse industries including telecommunications, industrial automation, and consumer electronics.
