Product Specification
The XC3S50AN-4FTG256C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for cost-sensitive applications. This advanced FPGA combines programmable logic with integrated flash memory, making it an ideal solution for embedded system designs.
Key Technical Specifications:
- Logic Cells: 50,000 system gates equivalent
- Package Type: FTBGA-256 (Fine-pitch Ball Grid Array)
- Speed Grade: -4 (high-performance variant)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- I/O Pins: Up to 195 user I/O pins
- Memory: Integrated In-System Flash for configuration storage
- Power Supply: 1.2V core voltage with 3.3V I/O
- Architecture: Advanced Spartan-3AN technology with enhanced features
The XC3S50AN-4FTG256C offers superior performance-per-dollar ratio, making it perfect for applications requiring moderate logic density with integrated non-volatile configuration memory. Its compact FTBGA-256 package provides excellent pin density while maintaining signal integrity for high-speed designs.
Price
Pricing for the XC3S50AN-4FTG256C varies based on quantity, distributor, and current market conditions. This FPGA typically falls within the mid-range pricing tier for Spartan-3AN devices, offering excellent value for its feature set.
For current pricing information and volume discounts:
- Contact authorized Xilinx distributors
- Request quotes for bulk orders
- Check major electronic component suppliers
- Consider lifecycle and availability status
The XC3S50AN-4FTG256C provides cost-effective programmable logic solutions while maintaining the quality and reliability expected from Xilinx products.
Documents & Media
Technical Documentation:
- Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Comprehensive implementation guidelines and design recommendations
- Migration Guide: Instructions for upgrading from previous Spartan generations
- Package Information: Detailed pinout diagrams and mechanical specifications
- Characterization Report: Performance benchmarks and operational parameters
Design Resources:
- Reference Designs: Example implementations and proven design patterns
- Application Notes: Best practices for XC3S50AN-4FTG256C implementation
- PCB Layout Guidelines: Board design recommendations for optimal performance
- Thermal Management: Guidelines for proper heat dissipation and cooling
All documentation is available through Xilinx’s official website and authorized design tool environments, ensuring designers have access to the most current information for successful XC3S50AN-4FTG256C implementation.
Related Resources
Development Tools:
- Xilinx ISE Design Suite: Complete development environment for XC3S50AN-4FTG256C
- Impact Configuration Tool: For device programming and configuration
- ChipScope Pro: Integrated logic analyzer for debugging
- PlanAhead: Advanced floorplanning and constraint management
Compatible IP Cores:
- MicroBlaze Soft Processor: Embedded processor solution
- Memory Controllers: DDR, SRAM, and flash memory interfaces
- Communication Interfaces: UART, SPI, I2C, and custom protocols
- DSP Functions: Mathematical operations and signal processing blocks
Evaluation Platforms:
- Spartan-3AN development boards featuring XC3S50AN-4FTG256C
- Starter kits with comprehensive peripheral interfaces
- Third-party evaluation modules and reference designs
The extensive ecosystem surrounding the XC3S50AN-4FTG256C ensures rapid development and successful project completion with proven resources and tools.
Environmental & Export Classifications
Environmental Compliance:
The XC3S50AN-4FTG256C meets stringent environmental standards and regulations:
- RoHS Compliant: Lead-free manufacturing process
- REACH Compliant: Meets European chemical regulations
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- Green Product: Environmentally conscious design and manufacturing
Operating Conditions:
- Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
- Humidity: Standard industrial operating conditions
- Altitude: Sea level to specified maximum elevation
- Vibration/Shock: Meets standard electronic component specifications
Export Classifications:
- ECCN: Export Control Classification Number as specified by US regulations
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufacturing location information
- Trade Compliance: Meets international export/import requirements
Quality Standards:
- ISO Certification: Manufacturing facility quality management compliance
- Automotive Grade: Available variants for automotive applications (if applicable)
- Industrial Grade: Suitable for industrial environment deployment
- Reliability Testing: Comprehensive qualification and stress testing
The XC3S50AN-4FTG256C maintains high environmental standards while providing reliable operation across various deployment scenarios, ensuring compliance with global regulations and quality requirements.
The XC3S50AN-4FTG256C represents Xilinx’s commitment to delivering high-performance, cost-effective FPGA solutions for diverse embedded applications. Its combination of integrated flash memory, robust I/O capabilities, and proven Spartan-3AN architecture makes it an excellent choice for designers seeking reliable programmable logic solutions.
