The XC3S1400A-4FGG676I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3A family, designed to deliver exceptional performance for demanding digital signal processing and embedded system applications. This versatile FPGA combines advanced features with cost-effective implementation, making it an ideal choice for engineers developing complex digital designs.
Product Specifications
The XC3S1400A-4FGG676I offers robust specifications that meet the requirements of modern electronic designs:
Core Features:
- Logic Cells: 1,400,000 system gates equivalent
- Configurable Logic Blocks (CLBs): 11,776
- Block RAM: 576 Kbits total memory
- Distributed RAM: 200 Kbits
- DSP48 Slices: 32 dedicated multiply-accumulate blocks
- Speed Grade: -4 (high performance)
- Package Type: FGG676 (Fine-pitch Ball Grid Array)
- Total I/O Pins: 502 user I/O pins
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Advanced Capabilities: The XC3S1400A-4FGG676I incorporates advanced clock management with up to 8 Digital Clock Managers (DCMs) and supports various I/O standards including LVDS, SSTL, and HSTL. The device features SelectRAM+ memory resources and dedicated multipliers optimized for high-speed arithmetic operations.
Price Information
Pricing for the XC3S1400A-4FGG676I varies based on quantity, supplier, and market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, making this FPGA cost-effective for both prototyping and mass production applications.
Documents & Media
Technical Documentation:
- XC3S1400A-4FGG676I Datasheet (Product Specification)
- Spartan-3A FPGA Family User Guide
- Package and Pinout Information (676-pin FBGA)
- Power and Thermal Management Guidelines
- Programming and Configuration Guide
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- Timing and constraint files
- PCB layout guidelines for FGG676 package
Software Support: The XC3S1400A-4FGG676I is fully supported by Xilinx development tools, including ISE Design Suite and various IP cores for accelerated development.
Related Resources
Development Boards: Several evaluation and development platforms support the XC3S1400A-4FGG676I, enabling rapid prototyping and system validation. These boards typically include essential peripherals, power supplies, and programming interfaces.
IP Cores and Libraries: Xilinx provides extensive IP core libraries compatible with the XC3S1400A-4FGG676I, including:
- Digital signal processing cores
- Communication protocol implementations
- Memory controllers and interfaces
- Video and image processing functions
Design Tools: The XC3S1400A-4FGG676I integrates seamlessly with industry-standard design flows and third-party tools, ensuring compatibility with existing development environments.
Environmental & Export Classifications
Environmental Compliance: The XC3S1400A-4FGG676I meets stringent environmental standards:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Industrial temperature range operation
- Moisture sensitivity level (MSL) rating provided
Export Classifications:
- ECCN (Export Control Classification Number): Complies with current export regulations
- Country of origin marking included
- Proper documentation for international shipping
Quality Standards: The XC3S1400A-4FGG676I is manufactured under ISO 9001 quality management systems and undergoes comprehensive testing to ensure reliability in demanding applications.
Packaging and Handling: The device ships in anti-static packaging with proper moisture barrier protection. Handling guidelines ensure the XC3S1400A-4FGG676I maintains its specified performance characteristics throughout storage and assembly processes.
The XC3S1400A-4FGG676I represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. Its comprehensive feature set and robust specifications make it suitable for a wide range of applications, from high-speed digital signal processing to complex embedded system implementations.
