The XC3S200A-4FGG320C is a versatile and cost-effective FPGA (Field Programmable Gate Array) from Xilinx’s Spartan-3A family, designed to deliver exceptional performance for a wide range of digital design applications. This programmable logic device combines advanced features with competitive pricing, making it an ideal choice for engineers developing embedded systems, digital signal processing applications, and prototype designs.
Product Specifications
The XC3S200A-4FGG320C offers robust technical specifications that meet demanding application requirements:
Core Architecture:
- Logic cells: 200,000 system gates
- Configurable Logic Blocks (CLBs): 896
- Total distributed RAM: 15,360 bits
- Block RAM: 216 Kbits (12 blocks of 18 Kbits each)
- Dedicated multipliers: 16 (18×18 bit)
I/O Capabilities:
- User I/O pins: 173
- Differential I/O pairs: 68
- Package type: FG320 (Fine-pitch Ball Grid Array)
- I/O standards support: LVDS, LVPECL, HSTL, SSTL, and more
Performance Characteristics:
- Speed grade: -4 (fastest available for this device)
- Maximum frequency: Up to 250 MHz
- Operating voltage: 1.2V core, 2.5V/3.3V I/O
- Power consumption: Optimized for low-power applications
Memory Resources:
- Look-up tables (LUTs): 3,584 (4-input)
- Flip-flops: 3,584
- Maximum user memory: 231 Kbits
Price
The XC3S200A-4FGG320C is competitively priced within the mid-range FPGA market segment. Pricing varies based on quantity, distribution channel, and current market conditions. For the most accurate and up-to-date pricing information, please contact authorized Xilinx distributors or visit official semiconductor marketplaces. Volume discounts are typically available for orders exceeding 100 units, making this device cost-effective for both prototyping and production applications.
Documents & Media
Comprehensive technical documentation is available for the XC3S200A-4FGG320C:
Official Documentation:
- Spartan-3A FPGA Family Data Sheet (DS529)
- Spartan-3A FPGA Family Complete Data Sheet (DS611)
- XCF Platform Flash Configuration PROMs Data Sheet
- Spartan-3A FPGA Family PCB Design Guidelines
Development Resources:
- Xilinx ISE Design Suite compatibility
- Reference designs and application notes
- Pin-out diagrams and package drawings
- Timing specifications and characterization reports
Video Resources:
- Getting started tutorials for Spartan-3A development
- Design methodology webinars
- Implementation case studies
All documentation is available through Xilinx’s official website and authorized development tool providers.
Related Resources
The XC3S200A-4FGG320C ecosystem includes numerous supporting products and resources:
Development Boards:
- Spartan-3A Evaluation Kit
- Third-party development platforms
- Custom carrier boards from various manufacturers
Compatible Software:
- Xilinx ISE WebPACK (free development environment)
- ModelSim simulation software
- ChipScope Pro analyzer for debugging
Related FPGA Devices:
- XC3S50A-4TQG144C (smaller capacity option)
- XC3S400A-4FGG320C (higher capacity alternative)
- XC3S700A-4FGG484C (advanced features)
Support Components:
- Configuration PROMs (XCF series)
- Clock management devices
- Power management solutions
Environmental & Export Classifications
The XC3S200A-4FGG320C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- Operating temperature range: 0ยฐC to +85ยฐC (commercial grade)
- Storage temperature range: -65ยฐC to +150ยฐC
- Humidity tolerance: 5% to 85% non-condensing
Quality Standards:
- Manufactured in ISO 9001:2000 certified facilities
- AEC-Q100 automotive qualification available
- JEDEC standard compliance for reliability testing
Export Classifications:
- ECCN (Export Control Classification Number): Varies by destination
- Country of origin: Typically manufactured in Asia-Pacific facilities
- Export license requirements may apply for certain destinations
Package Information:
- Halogen-free package options available
- MSL (Moisture Sensitivity Level) rating: Level 3
- Recommended storage conditions in anti-static packaging
The XC3S200A-4FGG320C represents an excellent balance of performance, features, and cost-effectiveness, making it suitable for applications ranging from communications infrastructure to industrial automation systems. Its comprehensive documentation and broad ecosystem support ensure successful implementation in diverse engineering projects.
