The XC3S200A-4FTG256C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3A family, designed to deliver exceptional performance and flexibility for cost-sensitive applications. This versatile FPGA solution combines advanced programmable logic with integrated features, making it ideal for telecommunications, industrial automation, consumer electronics, and embedded system designs.
Product Specifications
Core Architecture
The XC3S200A-4FTG256C features a robust architecture built on proven Spartan-3A technology:
- Logic Cells: 200,000 system gates equivalent
- Configurable Logic Blocks (CLBs): 1,728 slices organized in a highly efficient array
- Block RAM: 216 Kbits of dedicated memory resources
- Distributed RAM: Additional embedded memory for flexible data storage
- Digital Clock Managers (DCMs): 4 DCMs for advanced clock management and synthesis
Package and I/O Specifications
- Package Type: 256-pin Fine-Pitch Ball Grid Array (FTBGA)
- Package Size: 17mm x 17mm footprint for compact PCB designs
- User I/O Pins: 172 single-ended I/O pins supporting multiple voltage standards
- Differential I/O Pairs: Support for high-speed differential signaling
- Speed Grade: -4 speed grade ensuring optimal performance timing
Performance Characteristics
The XC3S200A-4FTG256C delivers impressive performance metrics:
- Maximum Operating Frequency: Up to 326 MHz internal clock speeds
- Low Power Consumption: Optimized for battery-powered and portable applications
- Fast Configuration: Quick startup times for responsive system initialization
- Temperature Range: Commercial grade operation from 0ยฐC to +85ยฐC
Pricing Information
The XC3S200A-4FTG256C offers competitive pricing for high-volume applications. Pricing varies based on:
- Order Quantity: Volume discounts available for quantities of 100+ units
- Lead Time Requirements: Standard lead times typically 8-12 weeks
- Distribution Channel: Authorized distributors may offer additional pricing tiers
- Market Conditions: Pricing subject to current semiconductor market dynamics
For current XC3S200A-4FTG256C pricing and availability, contact authorized Xilinx distributors or semiconductor suppliers. Educational and prototype quantities may qualify for special pricing programs.
Documents & Media
Technical Documentation
- XC3S200A-4FTG256C Datasheet: Complete electrical and timing specifications
- Spartan-3A Family User Guide: Comprehensive architecture and design guidance
- Package and Pinout Information: Detailed pin assignments and package drawings
- AC/DC Characteristics: Electrical specifications and operating conditions
Design Resources
- Reference Designs: Pre-validated design examples and application notes
- Development Board Schematics: Reference hardware designs for rapid prototyping
- Constraint Files: UCF and timing constraint templates
- IBIS Models: Signal integrity simulation models for PCB design
Software Tools
- ISE Design Suite: Complete FPGA development environment
- ChipScope Pro: Integrated logic analyzer for debugging
- PlanAhead: Advanced floorplanning and constraint management
- iMPACT: Configuration and programming utilities
Related Resources
Development Platforms
- Spartan-3A Starter Kit: Complete development platform featuring the XC3S200A-4FTG256C
- Evaluation Boards: Third-party boards supporting rapid prototyping
- Custom Carrier Boards: Application-specific development platforms
Complementary Products
- Configuration Memory: SPI Flash and PROM devices for FPGA configuration
- Power Management: Switching regulators and linear regulators optimized for Spartan-3A
- Clock Generation: Crystal oscillators and clock distribution components
- Interface Components: Level translators and signal conditioning circuits
Technical Support
- Xilinx Forums: Community-driven technical discussions and solutions
- Application Notes: Detailed implementation guides for common applications
- Webinars and Training: Educational resources for FPGA design techniques
- Technical Support Portal: Direct access to Xilinx engineering support
Environmental & Export Classifications
Environmental Compliance
The XC3S200A-4FTG256C meets stringent environmental standards:
- RoHS Compliant: Lead-free package construction meeting EU RoHS directives
- REACH Compliance: Compliant with European chemical safety regulations
- Halogen-Free: Environmentally friendly package materials
- Conflict Minerals: Sourced from conflict-free supply chains
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Varies by manufacturing location
- Export License Requirements: May require export licenses for certain destinations
Quality and Reliability
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity Rating: Up to 85% relative humidity, non-condensing
- MTBF Rating: Exceeds 1 million hours under normal operating conditions
Packaging and Handling
- ESD Sensitivity: Class 1 ESD sensitive device requiring proper handling procedures
- Moisture Sensitivity: MSL-3 moisture sensitivity level
- Tape and Reel: Available in anti-static tape and reel packaging
- Tray Packaging: Alternative packaging for prototype quantities
The XC3S200A-4FTG256C represents an excellent balance of performance, features, and cost-effectiveness for modern FPGA applications. Its comprehensive feature set, robust development ecosystem, and proven reliability make it an ideal choice for designers seeking a versatile programmable logic solution.
