The XC3S200A-5FTG256C is a versatile field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-3A family, designed to deliver exceptional performance for cost-sensitive applications. This FPGA combines advanced features with reliable operation, making it an ideal choice for developers seeking robust programmable logic solutions.
Product Specifications
Core Architecture
The XC3S200A-5FTG256C features a sophisticated architecture built on proven SRAM-based technology. This FPGA contains 200,000 system gates with 4,320 logic cells, providing substantial capacity for complex digital designs. The device operates with a -5 speed grade, ensuring fast signal propagation and high-performance operation across demanding applications.
Package and Pin Configuration
This variant comes in a 256-pin Fine-Pitch Ball Grid Array (FTBGA) package, designated as FTG256. The compact footprint measures 17mm x 17mm with a 1.0mm ball pitch, making it suitable for space-constrained designs while maintaining excellent thermal characteristics and signal integrity.
Memory and DSP Resources
The XC3S200A-5FTG256C incorporates 216 Kbits of block RAM distributed across 12 dedicated blocks, enabling efficient data storage and buffering. Additionally, it includes 16 dedicated 18×18 multipliers that accelerate digital signal processing tasks, making it particularly well-suited for applications requiring intensive mathematical computations.
I/O Capabilities
With up to 173 user I/O pins available in the FTG256 package, the XC3S200A-5FTG256C supports various interface standards including LVDS, LVTTL, and LVCMOS. The device features advanced I/O capabilities with programmable drive strength and slew rate control, ensuring compatibility with diverse system requirements.
Pricing Information
The XC3S200A-5FTG256C is positioned as a cost-effective solution in the mid-range FPGA market. Pricing varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability information. Volume discounts are typically available for production quantities, making this device economically viable for both prototyping and mass production applications.
Documents & Media
Technical Documentation
Complete technical resources are available to support XC3S200A-5FTG256C implementation, including detailed datasheets specifying electrical characteristics, timing parameters, and package information. The comprehensive user guide provides in-depth coverage of device architecture, configuration options, and design methodologies.
Design Tools and Software
Development is supported through Xilinx ISE Design Suite, which provides a complete design environment including synthesis tools, place-and-route capabilities, and timing analysis. The software package includes device-specific libraries, reference designs, and application notes to accelerate development cycles.
Application Notes and Reference Designs
Extensive application documentation covers common implementation scenarios, design best practices, and optimization techniques specific to the XC3S200A-5FTG256C. Reference designs demonstrate practical applications across various market segments, providing valuable starting points for custom implementations.
Related Resources
Development Boards and Kits
Several evaluation platforms support the XC3S200A-5FTG256C, enabling rapid prototyping and proof-of-concept development. These boards typically include essential peripherals, programming interfaces, and expansion connectors to facilitate comprehensive system evaluation.
Intellectual Property (IP) Cores
A rich ecosystem of verified IP cores is available for the XC3S200A-5FTG256C, covering communication protocols, signal processing functions, and interface standards. These pre-verified building blocks significantly reduce development time and risk while ensuring reliable operation.
Third-Party Tools and Support
The device is supported by numerous third-party development tools, verification platforms, and design services. This extensive ecosystem provides designers with flexibility in choosing development methodologies that best match their project requirements and existing workflows.
Environmental & Export Classifications
Operating Conditions
The XC3S200A-5FTG256C is specified for commercial temperature range operation from 0ยฐC to +85ยฐC, suitable for most industrial and commercial applications. The device maintains specified performance across this temperature range while consuming low static power, contributing to overall system efficiency.
Environmental Compliance
This FPGA meets RoHS compliance standards, ensuring environmental responsibility in manufacturing and deployment. The lead-free package construction supports modern environmental requirements while maintaining long-term reliability and performance.
Export Classification
The XC3S200A-5FTG256C falls under standard commercial export classifications. However, specific export requirements may vary based on end-use applications and destination countries. Consult current export regulations and Xilinx documentation for detailed classification information relevant to your specific application and geographic requirements.
Quality and Reliability Standards
Manufacturing follows stringent quality standards with comprehensive testing procedures ensuring consistent performance and reliability. The device is backed by Xilinx’s established quality assurance processes and typically carries standard commercial warranties supporting production deployment confidence.
The XC3S200A-5FTG256C represents an excellent balance of performance, features, and cost-effectiveness, making it a compelling choice for developers seeking reliable FPGA solutions in the mid-range capacity segment.
