The XC3S200AN-4FTG256I is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s Spartan-3AN family, designed for cost-effective embedded applications requiring integrated configuration memory and reliable operation.
Product Specifications
Core Features of XC3S200AN-4FTG256I
- Logic Cells: 200,000 system gates with 4,320 logic cells
- Package Type: 256-pin Fine-Pitch Ball Grid Array (FTBGA256)
- Speed Grade: -4 (standard commercial grade)
- Operating Temperature: 0ยฐC to +85ยฐC (commercial grade)
- Supply Voltage: 1.2V core, 3.3V I/O
- Configuration Memory: Integrated In-System Flash for non-volatile configuration
- Block RAM: 216 Kbits total block RAM
- Distributed RAM: 60 Kbits
- Multipliers: 12 dedicated 18×18 multipliers
- I/O Pins: 195 user I/O pins
- Clock Management: 4 Digital Clock Managers (DCMs)
Technical Specifications
The XC3S200AN-4FTG256I delivers exceptional performance for mid-range FPGA applications with its advanced architecture optimized for power efficiency and design flexibility. This device features Xilinx’s proven Spartan-3AN technology with integrated configuration flash memory, eliminating the need for external configuration devices.
Price Information
XC3S200AN-4FTG256I pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing:
- Single unit pricing: Contact for quote
- Volume pricing: Available for quantities 100+
- Educational pricing: Special rates available for academic institutions
- Long-term supply agreements available
Prices subject to change. Contact authorized distributors for real-time pricing and availability.
Documents & Media
Technical Documentation
- Datasheet: Spartan-3AN FPGA Family Complete Data Sheet
- User Guide: Spartan-3AN Configuration User Guide
- Package Information: FTG256 Package Mechanical Drawings
- Application Notes: Power Management and Thermal Considerations
- Design Files: Reference designs and example projects
- Errata: Known issues and workarounds document
Development Resources
- Software: Xilinx ISE Design Suite compatibility
- IP Cores: Access to Xilinx IP catalog
- Reference Designs: Starter kits and evaluation boards
- Video Tutorials: Getting started with XC3S200AN-4FTG256I
- Webinars: Advanced design techniques and optimization
Related Resources
Development Tools
- Xilinx ISE Design Suite: Complete development environment
- ChipScope Pro: Integrated logic analyzer
- PlanAhead: Design planning and implementation tool
- Spartan-3AN Starter Kit: Evaluation platform featuring XC3S200AN-4FTG256I
Compatible Products
- Power Management: Recommended power supply solutions
- Programming Cables: JTAG and configuration interfaces
- Evaluation Boards: Third-party development platforms
- IP Cores: Soft processor cores and communication interfaces
Application Areas
The XC3S200AN-4FTG256I excels in diverse applications including industrial automation, communications infrastructure, automotive electronics, medical devices, and consumer electronics where reliable, cost-effective programmable logic solutions are required.
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free package meets RoHS directive requirements
- Halogen-Free: Environmentally friendly packaging materials
- Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
- Humidity: Up to 85% relative humidity, non-condensing
- Shock/Vibration: Meets JEDEC standards for mechanical stress
Export Classifications
- ECCN: 3A001.a.2 (US Export Administration Regulations)
- HTS Code: 8542.33.0001
- Country of Origin: Varies by manufacturing location
- Export License: May be required for certain destinations
Quality Standards
- ISO Certification: Manufactured in ISO 9001:2015 certified facilities
- Reliability: MTBF data available upon request
- Quality Grade: Industrial standard with comprehensive testing
- Traceability: Full lot traceability and quality documentation
The XC3S200AN-4FTG256I represents an ideal balance of performance, cost, and integration for embedded system designers requiring reliable FPGA solutions with integrated configuration memory and comprehensive development tool support.
