Product Specification
The XC3S400AN-4FTG256C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for embedded applications requiring integrated non-volatile configuration memory. This advanced FPGA combines high-density programmable logic with built-in Flash memory, making it ideal for space-constrained designs where instant-on capability is essential.
Key Technical Specifications:
- Logic Cells: 400,000 system gates
- Package Type: FTBGA-256 (Fine-pitch Ball Grid Array)
- Speed Grade: -4 (Industrial grade performance)
- Operating Temperature Range: -40ยฐC to +100ยฐC (Industrial)
- Programmable Logic Blocks: 896 CLBs (Configurable Logic Blocks)
- Total Block RAM: 288 Kbits
- Distributed RAM: 56 Kbits
- Dedicated Multipliers: 16 x 18-bit multipliers
- I/O Standards Support: Multiple voltage levels (1.2V to 3.3V)
- Configuration Memory: Integrated In-System Flash memory
- Power Supply: Single 1.2V core with 3.3V I/O
The XC3S400AN-4FTG256C features Xilinx’s proven Spartan-3AN architecture, incorporating embedded Flash memory that eliminates the need for external configuration devices. This integration significantly reduces board space requirements and system cost while providing secure, reliable configuration storage.
Price
XC3S400AN-4FTG256C pricing varies based on quantity, supplier, and market conditions. Typical pricing ranges:
- Single Unit: $45-65 USD
- Small Quantity (10-99 units): $35-50 USD per unit
- Volume Pricing (1000+ units): Contact authorized distributors for quotes
Prices are subject to change based on market conditions and availability. For current pricing and volume discounts, contact authorized Xilinx distributors or electronic component suppliers.
Authorized Distributors:
- Digi-Key Electronics
- Mouser Electronics
- Arrow Electronics
- Avnet
- Future Electronics
Documents & Media
Technical Documentation
- Product Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Comprehensive implementation guide with design examples
- Migration Guide: Instructions for upgrading from previous Spartan generations
- Packaging Information: Mechanical drawings, pin assignments, and thermal data
- Characterization Reports: Performance validation and test results
Development Resources
- Reference Designs: Pre-verified IP cores and application examples
- Evaluation Boards: Development platforms for rapid prototyping
- Application Notes: Best practices for power management, signal integrity, and thermal design
- Simulation Models: SPICE models and timing simulation files
- CAD Libraries: Footprint libraries for major PCB design tools
Software Tools
- Xilinx ISE Design Suite: Complete development environment
- iMPACT Configuration Tool: Programming and debugging utilities
- ChipScope Pro: Integrated logic analyzer for real-time debugging
Related Resources
Compatible Product Lines
- Spartan-3A Series: Alternative density options without integrated Flash
- Spartan-6 Family: Next-generation low-power FPGA solutions
- Artix-7 Series: Modern 28nm architecture with enhanced performance
Development Ecosystem
- Xilinx Alliance Program: Access to third-party IP cores and tools
- Reference Designs Library: Pre-validated system implementations
- Community Forums: Technical support and design collaboration
- Training Resources: Online courses and certification programs
Application Areas
- Industrial Automation: Process control and monitoring systems
- Communications Infrastructure: Protocol processing and packet forwarding
- Automotive Electronics: Advanced driver assistance systems (ADAS)
- Medical Devices: Real-time signal processing and data acquisition
- Aerospace & Defense: Secure embedded processing applications
Environmental & Export Classifications
Environmental Compliance
The XC3S400AN-4FTG256C meets stringent environmental and safety standards:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: EU chemical safety compliance
- Halogen-Free: Environmentally conscious packaging materials
- Green Package: Pb-free and fully recyclable
Operating Conditions
- Commercial Grade: 0ยฐC to +85ยฐC
- Industrial Grade: -40ยฐC to +100ยฐC (XC3S400AN-4FTG256I variant)
- Humidity Tolerance: Up to 85% relative humidity, non-condensing
- Shock and Vibration: MIL-STD-883 compliant testing
Export Control Classification
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS Code: 8542.33.0001
- Country of Origin: Various (manufactured in multiple facilities)
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management compliance
- IATF 16949: Automotive quality standard (where applicable)
- IPC Standards: PCB assembly and reliability testing
Reliability Data
- MTBF: >1,000,000 hours at 25ยฐC
- Qualification Level: Industrial grade testing per JEDEC standards
- Electrostatic Discharge: Class 1C per JEDEC JS-001
- Latch-up Immunity: >100mA per JEDEC Standard 78
The XC3S400AN-4FTG256C represents a mature, reliable FPGA solution backed by Xilinx’s comprehensive support ecosystem and proven track record in mission-critical applications worldwide.
