Product Specification
The XC3S700A-4FGG484I is a powerful field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-3A family, designed to deliver exceptional performance for cost-sensitive applications. This advanced programmable logic device features 700,000 system gates, making it ideal for complex digital designs requiring substantial processing capability.
Key Technical Specifications:
- System Gates: 700,000 gates providing extensive logic capacity
- Logic Cells: 13,248 configurable logic blocks for flexible design implementation
- Block RAM: 360 Kbits of dedicated memory for data storage and buffering
- I/O Pins: 372 user I/O pins supporting various interface standards
- Package Type: FGG484 – Fine-pitch Ball Grid Array with 484 pins
- Speed Grade: -4 (fastest commercial speed grade available)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
- Supply Voltage: 1.2V core, 3.3V I/O
- Maximum Frequency: Up to 300+ MHz performance capability
The XC3S700A-4FGG484I incorporates advanced 90nm process technology, delivering superior power efficiency while maintaining high-speed operation. Its comprehensive I/O support includes LVDS, SSTL, and HSTL standards, enabling seamless integration with various system components.
Price
The XC3S700A-4FGG484I is competitively priced within the mid-range FPGA market segment. Pricing varies based on quantity, distributor, and market conditions:
- Unit Price (1-99 pieces): Contact authorized distributors for current pricing
- Volume Pricing: Available for quantities of 100+ units with significant cost reductions
- Engineering Samples: Available through Xilinx direct sales or authorized partners
- Long-term Availability: Supported through Xilinx’s product longevity program
For the most current XC3S700A-4FGG484I pricing information, consult authorized Xilinx distributors including Digi-Key, Mouser Electronics, Avnet, and Arrow Electronics. Educational discounts may be available for qualifying institutions.
Documents & Media
Essential Documentation:
- Datasheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Comprehensive implementation guidelines and design recommendations
- Migration Guide: Instructions for upgrading from previous Spartan generations
- Packaging Information: Mechanical drawings and thermal specifications
- Errata Sheet: Known issues and recommended workarounds
Development Resources:
- Reference Designs: Pre-verified IP cores and example implementations
- Application Notes: Detailed design methodologies and optimization techniques
- Video Tutorials: Step-by-step design flow demonstrations
- Webinar Recordings: Expert insights on advanced FPGA design techniques
All XC3S700A-4FGG484I documentation is available through the Xilinx Support Center and product-specific web pages. Technical support forums provide community-driven assistance and design tips.
Related Resources
Development Tools:
- Xilinx ISE Design Suite: Complete development environment supporting the XC3S700A-4FGG484I
- ChipScope Pro: Integrated logic analyzer for real-time debugging
- PlanAhead: Advanced floorplanning and constraint management
- EDK (Embedded Development Kit): For embedded processor implementations
Evaluation Platforms:
- Spartan-3A Starter Kit: Cost-effective evaluation platform featuring the XC3S700A-4FGG484I
- Development Boards: Third-party boards from partners like Digilent and Avnet
- Reference Designs: Pre-built demonstrations showcasing device capabilities
Complementary Products:
- Configuration Devices: Platform Flash and other non-volatile memory solutions
- Power Management: Dedicated power supply ICs optimized for Spartan-3A FPGAs
- Connectivity Solutions: High-speed transceivers and interface controllers
The XC3S700A-4FGG484I ecosystem includes extensive third-party IP cores, development boards, and design services from Xilinx Alliance Partners.
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Meets European Union Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical safety regulations
- Halogen-Free: Environmentally responsible packaging materials
- Pb-Free Assembly: Lead-free soldering processes and materials
Operating Conditions:
- Temperature Range: -40ยฐC to +100ยฐC junction temperature (Industrial grade)
- Humidity: Up to 85% non-condensing relative humidity
- Shock/Vibration: Meets JEDEC standards for mechanical reliability
- ESD Protection: Human Body Model (HBM) and Machine Model (MM) certified
Export Classifications:
- ECCN: 3A001.a.7 (Export Control Classification Number)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Various manufacturing locations depending on supply chain
- Export Restrictions: Subject to U.S. export control regulations
The XC3S700A-4FGG484I complies with international environmental standards while maintaining the highest quality and reliability standards. Proper handling procedures and anti-static precautions should be observed during assembly and testing processes.
The XC3S700A-4FGG484I represents an excellent balance of performance, features, and cost-effectiveness for demanding FPGA applications. Its robust feature set and comprehensive development ecosystem make it an ideal choice for both prototyping and production deployments.
